IP Library Granted Patent US 11,791,346
Granted Patent B2
US 11,791,346 · App. 17/694,754 · Granted Oct 17, 2023

Method for manufacturing a display device

Inventor: Isao Suzumura (Tokyo, JP)
Assignee: Japan Display Inc.
H01L27/1225G02F1/1368H01L27/1248H01L29/401H01L29/42384H10K59/126G02F1/13685H01L21/426
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Quick Facts
Patent No.
US 11,791,346
App. No.
17/694,754
Granted
Oct 17, 2023
Kind
B2
Abstract

The purpose of the present invention is to decrease the resistance of the drain and source in the TFT of the oxide semiconductor as well as to have stable Vd-Id characteristics of the TFT. The structure of the present invention is as follows: A display device having plural pixels including thin film transistors (TFT) having oxide semiconductor films comprising: a gate insulating film formed on the oxide semiconductor film, an aluminum oxide film formed on the gate insulating film, a gate electrode formed on the aluminum oxide film, a side spacer formed on both sides of the gate electrode, and an interlayer insulating film formed on the gate electrode, the side spacer, a drain and a source, wherein in a plan view, and in a direction from the drain to the source, a length of the gate electrode is shorter than a length of the aluminum oxide film.

Claims (19)

1. Method for manufacturing a display device having a thin film transistor comprising:

a step for forming a first insulating film over a substrate,

a step for forming an oxide semiconductor film over the first insulating film,

a step for patterning the oxide semiconductor film to island shape,

a step for forming a gate insulating film over the oxide semiconductor film and the first insulating film,

a step for forming an aluminum oxide film over the gate insulating film,

a step for forming a gate electrode made of metal,

a step for forming a second insulating film over the oxide semiconductor film and the gate electrode,

a step for forming through holes in the second insulating film, which is an interlayer insulating film, and

a step for forming a drain electrode and source electrode in the through holes to contact the oxide semiconductor film,

wherein the aluminum oxide film over the gate insulating film is removed before the step for forming the second insulating film.

2. Method for manufacturing the display device having a thin film transistor according to claim 1 , wherein

the first insulating film is formed by chemical vapor deposition.

3. Method for manufacturing the display device having a thin film transistor according to claim 1 , wherein

the through hole is formed in an area in which the second insulating film contacts the gate insulating film, and the through hole is formed to penetrate the gate insulating film.

4. Method for manufacturing the display device having a thin film transistor according to claim 1 , wherein

the aluminum oxide film is removed by dry etching using Chlorine base gas.

5. Method for manufacturing the display device having a thin film transistor according to claim 4 , wherein

the through hole is formed in an area in which the second insulating film contacts the gate insulating film, and the through hole is formed to penetrate the gate insulating film.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2025
From: JAPAN DISPLAY INC.
To: MAGNOLIA WHITE CORPORATION
Reel/Frame 072130/0313 →
Priority Claims (1)
JP 2018-002641 · Jan 11, 2018 · national
Continuity (3)
Continuation 16922438 · Jul 7, 2020
Continuation PCTJP2018043661 · Nov 28, 2018
Related Publication 20220208795A1 · Jun 30, 2022
Cited By (1)
US 12,563,716