Display device and method for manufacturing the same
A light emitting apparatus including a substrate, a plurality of light emitting diode devices disposed on the substrate, a light non-transmitting layer disposed on the substrate and having at least one of open regions, and a first conductive bonding layer disposed between the plurality of lighting emitting diode devices and the substrate and electrically contacting the plurality of light emitting diode devices, in which an upper surface of the first conductive bonding layer is placed above the light non-transmitting layer.
1. A light emitting apparatus comprising:
a substrate;
a plurality of light emitting diode devices disposed on the substrate;
a light non-transmitting layer disposed on the substrate;
a first conductive bonding layer disposed between the plurality of light emitting diode devices and the substrate, and electrically contacting the plurality of light emitting diode devices; and
an encapsulation layer disposed on the substrate and covering at least an upper surface of each of the plurality of light emitting diode devices,
wherein an upper surface of the first conductive bonding layer is disposed between the light non-transmitting layer and the substrate.
2. The light emitting apparatus of claim 1 , wherein the first conductive bonding layer is disposed on the light non-transmitting layer.
3. The light emitting apparatus of claim 1 , wherein the light non-transmitting layer includes through-holes.
4. The light emitting apparatus of claim 2 , wherein the encapsulation layer further covers at least one side surface of each of the plurality of light emitting diode devices.
5. The light emitting apparatus of claim 2 , wherein the plurality of light emitting diode devices are configured to emit light having different wavelengths.
6. The light emitting apparatus of claim 5 , wherein the plurality of light emitting diode devices are configured to emit light in a red wavelength band, a green wavelength band, and a blue wavelength band, respectively.
7. The light emitting apparatus of claim 5 , wherein the plurality of light emitting diode devices include a first terminal and a second terminal.
8. The light emitting apparatus of claim 7 , wherein the first terminal is electrically connected to a scan interconnect of the substrate and the second terminal is electrically connected to a data interconnect of the substrate.
9. The light emitting apparatus of claim 8 , further comprising connection electrodes extending in one direction and electrically contacting the first conductive bonding layer.
10. The light emitting apparatus of claim 9 , wherein the light non-transmitting layer is disposed on the connection electrodes.
11. The light emitting apparatus of claim 9 , wherein at least one of the connection electrodes is connected to the scan interconnect of the substrate, and a number of the connection electrodes corresponds to a number of the light emitting diode devices.
12. The light emitting apparatus of claim 1 , wherein the light non-transmitting layer comprises at least one of a light absorption material, a black matrix material, or a black photo-sensitive resist.
13. The light emitting apparatus of claim 6 , wherein at least one of the plurality of light emitting diode devices comprises a color conversion layer disposed on a light emitting diode chip.
14. The light emitting apparatus of claim 13 , wherein the color conversion layer comprises at least one of phosphors, nano-structures, and organic materials configured to convert a color, or a combinations thereof.
15. The light emitting apparatus of claim 13 , further comprising a color filter layer disposed on the color conversion layer.
16. The light emitting apparatus of claim 1 , wherein the substrate comprises at least one of a flexible material, a transparent material, an organic polymer substrate, or an organic-inorganic composite.
17. A light emitting apparatus comprising:
a substrate; and
a plurality of pixel units comprising:
a plurality of light emitting diode devices disposed on the substrate;
a light non-transmitting layer disposed on the substrate;
a first conductive bonding layer disposed between the plurality of light emitting diode devices and the substrate, and electrically contacting the plurality of light emitting diode devices; and
an encapsulation layer disposed on the light non-transmitting layer and covering at least an upper surface of each of the plurality of light emitting diode devices,
wherein the first conductive bonding layer is disposed on the light non-transmitting layer, and
wherein an upper surface of the first conductive bonding layer is disposed between the light non-transmitting layer and the substrate.
18. The light emitting apparatus of claim 17 , wherein the plurality of pixel units are linearly arranged along rows or columns.
19. The light emitting apparatus of claim 17 , wherein the encapsulation layer further convers at least one side surface of each of the plurality of light emitting diode devices.