IP Library Granted Patent US 12,443,246
Granted Patent B2
US 12,443,246 · App. 17/703,834 · Granted Oct 14, 2025

Electronic device

Inventor: Yi Chen (Kaohsiung, TW)
Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
G06F1/1698G06F1/1681
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Quick Facts
Patent No.
US 12,443,246
App. No.
17/703,834
Granted
Oct 14, 2025
Kind
B2
Abstract

An electronic device is disclosed. The electronic device includes a first part, a second part adjacent to the first part and a rotational shaft. The rotational shaft includes an antenna and configured to allow the first part and the second part to rotate about a rotation axis defined by the rotational shaft.

Claims (37)

1. An electronic device, comprising:

a first part;

a second part adjacent to the first part; and

a rotational shaft configured to allow the first part and the second part to rotate about a rotation axis defined by the rotational shaft; and

an antenna package attached to an inner surface of the rotational shaft through an adhesive layer, wherein the antenna package includes a first electronic component, wherein the inner surface of the rotational shaft defines a space accommodating the first electronic component, and wherein the first electronic component includes a high-power amplifier (HPA) and a low-noise amplifier (LNA).

2. The electronic device of claim 1 , wherein the rotational shaft comprises opposite ends and a wall extending between the opposite ends, wherein the wall defines an opening at least partially exposing an antenna of the antenna package.

3. The electronic device of claim 1 , wherein the antenna package further comprises:

a carrier, wherein the first electronic component is electrically connected to an antenna through the carrier; and

a protection layer disposed over the carrier and covering the first electronic component, wherein the protection layer is spaced apart from the inner surface of the rotational shaft.

4. The electronic device of claim 1 , wherein the antenna package further comprises:

a carrier extending from the rotational shaft to the first part;

an antenna disposed in the rotational shaft; and

a second electronic component arranged in a circuit area on the first part.

5. The electronic device of claim 4 , wherein the antenna is electrically connected to the second electronic component through the carrier and the rotational shaft.

6. The electronic device of claim 1 , wherein the antenna package circumferentially extends along the inner surface of the rotational shaft.

7. The electronic device of claim 6 , wherein the antenna package entirely circumferentially extends along the inner surface of the rotational shaft.

8. The electronic device of claim 1 , wherein the antenna package further comprises:

an antenna array contacting the adhesive layer.

9. An electronic device, comprising:

a first part;

a second part adjacent to the first part; and

a rotational shaft configured to allow the first part and the second part to rotate about a rotation axis defined by the rotational shaft; and

an antenna package attached to an outer surface of the rotational shaft through an adhesive layer, wherein the antenna package includes:

a carrier;

an electronic component disposed over the carrier;

a first protection layer disposed over the carrier and covering the electronic component, wherein the first protection layer contacts the adhesive layer;

an antenna array disposed over the carrier; and

a second protection layer disposed over the carrier and at least partially exposing the antenna array.

10. The electronic device of claim 9 , wherein the antenna package comprises:

feeding elements connecting to the antenna array and tapering toward the adhesive layer.

11. An electronic device, comprising:

a first part;

a second part adjacent to the first part; and

a rotational shaft configured to allow the first part and the second part to rotate about a rotation axis defined by the rotational shaft; and

an antenna package attached to an inner surface of the rotational shaft through an adhesive layer, wherein the antenna package includes:

an antenna array contacting the adhesive layer; and

feeding elements connecting to the antenna array and tapering away from the adhesive layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 6, 2022
From: CHEN, YI
To: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Reel/Frame 059522/0323 →
Continuity (1)
Related Publication 20230305605A1 · Sep 28, 2023
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