Electronic package
An electronic package is provided, including at least an electronic element and at least an antenna structure disposed on a carrier structure. The antenna structure includes a base portion configured with an antenna body and a plurality of support portions disposed on the base portion. As such, the base portion is disposed over the carrier structure through the support portions and a plurality of open areas are formed between the base portion and the carrier structure to serve as an air gap, thereby effectively improving the performance gain and efficiency of the antenna body.
1. An electronic package, comprising:
a carrier structure having a circuit layer;
an electronic element disposed on the carrier structure and electrically connected to the circuit layer; and
an antenna structure disposed on the carrier structure and comprising a base portion configured with an antenna body and at least a first support portion disposed on the base portion, wherein the base portion is disposed over the carrier structure through the first support portion and at least an open area is formed between the base portion and the carrier structure, and wherein the antenna body has at least an antenna layer arranged on the base portion and at least an antenna extension portion embedded in the first support portion for electrically connecting the antenna layer and the circuit layer.
2. The electronic package of claim 1 , wherein the antenna body has a plurality of antenna layers separated from one another and correspondingly arranged on two sides of the base portion.
3. The electronic package of claim 2 , wherein the plurality of antenna layers transmit signals in a coupling manner.
4. The electronic package of claim 1 , wherein the first support portion is bonded to the carrier structure through a conductor.
5. The electronic package of claim 4 , further comprising an external connecting pad arranged between the first support portion and the conductor and electrically connected to the antenna extension portion.
6. The electronic package of claim 1 , further comprising a second support portion disposed on the base portion, wherein the base portion is disposed over the carrier structure through the first support portion and the second support portion, and the first antenna layer is free from being electrically conductive to an inside of the second support portion.
7. The electronic package of claim 6 , wherein the first support portion and the second support portion are bonded to the carrier structure through a conductor.
8. The electronic package of claim 7 , further comprising an external connecting pad arranged between the first support portion and the conductor.
9. The electronic package of claim 7 , further comprising an external connecting pad arranged between the second support portion and the conductor.
10. The electronic package of claim 6 , wherein the first support portion and the second support portion divide a plurality of open areas as an air gap.
11. The electronic package of claim 1 , wherein the open area has a height of at least 400 μm.
12. The electronic package of claim 1 , wherein the height of the open area is not equal to a thickness of the base portion.
13. The electronic package of claim 1 , further comprising a shielding structure covering the electronic element.
14. The electronic package of claim 1 , further comprising at least a base body disposed on the carrier structure, wherein the first support portion of the antenna structure is disposed over the base body.
15. The electronic package of claim 14 , wherein the base body has an additional space communicating with the open area.
16. The electronic package of claim 14 , wherein the base body has another antenna extension portion electrically connected to the antenna extension portion.