Multichip interconnect package fine jet underfill
An interconnected semicondcutor subassembly structure and formation thereof. The interconnected semicondcutor subassembly structure includes an interconnect structure, and first and second semicondcutor dies bonded to respective portions of a top surface of the interconnect structure. The interconnected semicondcutor subassembly structure further includes an underfill layer formed within a first gap located between a bottom surface of the first semiconductor die and the first portion the top surface of the interconnect structure, formed within a second gap located between the bottom surface of the second semiconductor die and the second portion of the top surface of the interconnect structure, and formed within a first portion of a third gap located between the first semicondcutor die and the second semicondcutor die. A top surface of the underfill layer formed within the first portion of the third gap located between the first and second semicondcutor dies has a concave meniscus shape.
1 . An interconnected semiconductor subassembly structure, comprising:
an interconnect structure;
a first semiconductor die bonded to a first portion of a top surface of the interconnect structure;
a second semiconductor die bonded to a second portion of the top surface of the interconnect structure; and
an underfill layer formed within a first gap located between a bottom surface of the first semiconductor die and the first portion of the top surface of the interconnect structure, formed within a second gap located between a bottom surface of the second semiconductor die and the second portion of the top surface of the interconnect structure, and formed within a first portion of a third gap located between the first semiconductor die and the second semiconductor die, wherein a top surface of the underfill layer formed within the first portion of the third gap located between the first semiconductor die and the second semiconductor die has a concave meniscus shape; and
a chip binding layer formed on top of the underfill layer formed within the first portion of the third gap located between the first semiconductor die and the second semiconductor die, wherein a top surface of the chip binding layer has a concave meniscus shape.
2 . The interconnected semiconductor subassembly structure of claim 1 , wherein the underfill layer and the chip binding layer have a similar material composition.
3 . The interconnected semiconductor subassembly structure of claim 1 , wherein the underfill layer and the chip binding layer have a different material composition.
4 . The interconnected semiconductor subassembly structure of claim 1 , wherein the top surface of the chip binding layer is located below a top surface of the first semiconductor die and a top surface of the second semiconductor die.
5 . The interconnected semiconductor subassembly structure of claim 1 , wherein a gap length of the third gap located between the first and second semiconductor dies is greater than a gap height of the first gap located between the first semiconductor die and the interconnect structure and greater than a gap height of the second gap located between the second semiconductor die and the interconnect structure.
6 . The interconnected semiconductor subassembly structure of claim 1 , wherein a gap width of the third gap is greater than a gap height of the first and second gaps combined.
7 . The interconnected semiconductor subassembly structure of claim 1 , wherein a gap length of the first and second gaps located between the first and second semiconductor dies and the interconnect structure, respectively, is greater than or equal to 50 um and less than or equal to 500 um.
8 . The interconnected semiconductor subassembly structure of claim 1 , wherein a gap height of the first and second gaps located between the first and second semiconductor dies and the interconnect structure, respectively, is greater than or equal to 5 um and less than or equal to 100 um.
9 . The interconnected semiconductor subassembly structure of claim 1 , wherein the interconnect structure is at least one of an interposer or a bridge.
10 . The interconnected semiconductor subassembly structure of claim 1 , wherein the first and second semiconductor dies are bonded to the interconnect structure by a plurality of micro metal joints.
11 . A method of forming an interconnected semiconductor subassembly structure, comprising:
bonding a first semiconductor die to a first portion of an interconnect structure;
bonding a second semiconductor die to a second portion of the interconnect structure; and
forming a underfill layer within a first gap located between the first semiconductor die and the first portion of the interconnect structure, within a second gap located between the second semiconductor die and the second portion of the interconnect structure, and within a first portion of a third gap located between the first semiconductor die and the second semiconductor die, wherein a top surface of the underfill layer formed within the first portion of the third gap located between the first semiconductor die and the second semiconductor die has a concave meniscus shape; and
forming a chip binding layer on top of the underfill layer formed within the first portion of the third gap located between the first semiconductor die and the second semiconductor die, wherein a top surface of the chip binding layer has a concave meniscus shape.
12 . The method of claim 11 , wherein forming the underfill layer comprises:
depositing the underfill material between the third gap located between the first semiconductor die and the second semiconductor die, wherein the underfill material flows into the first and second gaps by capillary action.
13 . The method of claim 11 , wherein the underfill material is deposited between the third gap located between the first semiconductor die and the second semiconductor die by a jet dispenser.
14 . The method of claim 11 , wherein a gap length of the third gap located between the first and second semiconductor dies is greater than a gap height of the first and second gaps located between the first and second semiconductor dies and the interconnect structure, respectively.
15 . The method of claim 11 , wherein the interconnect structure is at least one of an interposer or a bridge.
16 . The method of claim 11 , further comprising:
bonding the interconnected semiconductor subassembly structure to a package substrate after the underfill layer has cured.
17 . The method of claim 11 , wherein forming the underfill layer comprises:
depositing a chip binding material between the third gap located between the first semiconductor die and the second semiconductor die and on top of the underfill layer, wherein the underfill layer and the chip binding layer have at least one of a similar material composition or a different material composition.
18 . The method of claim 11 , further comprising:
bonding the interconnected semiconductor subassembly structure to a package substrate after both the underfill layer and the chip binding layer have cured.
19 . A method of forming an interconnected semiconductor subassembly structure, comprising:
bonding a first semiconductor die to a first portion of an interconnect structure;
bonding a second semiconductor die to a second portion of the interconnect structure; and
forming a underfill layer within a first gap located between the first semiconductor die and the first portion of the interconnect structure, within a second gap located between the second semiconductor die and the second portion of the interconnect structure, and within a first portion of a third gap located between the first semiconductor die and the second semiconductor die, wherein a top surface of the underfill layer formed within the first portion of the third gap located between the first semiconductor die and the second semiconductor die has a concave meniscus shape; and
controlling an amount of the underfill material dispensed based on a dot size of the underfill material dispensed and a total number of dots of the underfill material dispensed.
20 . The method of claim 19 , further comprising precalculating a height of the underfill layer based on a maximum amount of the underfill material that can be dispensed within the third gap without any excess underfill material forming outside of outermost ends of the first gap and the second gap.