Printed circuit board with an edge stiffener structure
A printed circuit board (PCB) is enhanced with an edge stiffener structure. The edge stiffener structure may be fastened to the PCB in a variety of ways, including using solder, adhesive, or removably attaching with snaps. Removably attached edge stiffening structures may be reused. Edge stiffener structures can overlap on one or both surfaces of a PCB. Some edge stiffener structures include extensions that fit into C-clamps and D-clamps.
1 . An apparatus, comprising:
a printed circuit board (PCB) with a peripheral edge; and
an edge stiffener structure including a first portion extending along at least a portion of the peripheral edge, the edge stiffener structure further including a second portion overlapping the peripheral edge on a surface of the PCB, wherein the edge stiffener structure comprises an extension that projects laterally from the first portion of the edge stiffener structure away from the PCB and is configured to fit into a securing structure adjacent to the first portion of the edge stiffener structure.
2 . The apparatus of claim 1 , wherein the portion of the peripheral edge is 50% of the peripheral edge.
3 . The apparatus of claim 1 , wherein the edge stiffener structure overlaps the peripheral edge on the surface by less than 10 millimeters.
4 . The apparatus of claim 1 , wherein the edge stiffener structure overlaps the peripheral edge on the surface by a width in a range of 1 to 3 millimeters.
5 . The apparatus of claim 1 , wherein the surface is a first surface, and the edge stiffener structure further overlaps the peripheral edge on a second surface that is opposite the first surface of the PCB.
6 . The apparatus of claim 1 , further comprising an integrated circuit component fastened to the PCB.
7 . The apparatus of claim 1 , wherein the surface is a first surface, and further comprising:
multiple integrated circuit components fastened to the PCB;
wherein a first integrated circuit component of the multiple integrated circuit components is fastened to the first surface and a second integrated circuit component of the multiple integrated circuit components is fastened to a second surface of the PCB.
8 . The apparatus of claim 1 , wherein the edge stiffener structure is fastened to the PCB using a plurality of solder bumps.
9 . The apparatus of claim 1 , wherein the edge stiffener structure is fastened to the PCB using an adhesive.
10 . The apparatus of claim 1 , wherein the PCB is rectangular, with two opposing sides being defined as long sides, and the edge stiffener structure is located on a long side.
11 . The apparatus of claim 1 , wherein the edge stiffener structure comprises multiple segments.
12 . The apparatus of claim 11 , wherein at least one of the multiple segments is a corner stiffener.
13 . The apparatus of claim 1 , in which the edge stiffener structure is removably attached to the PCB.
14 . The apparatus of claim 1 , in which the edge stiffener structure is attached to the PCB only on vertical sides of the PCB.
15 . A device, comprising:
a printed circuit board (PCB) with a peripheral edge;
an edge stiffener structure including a first portion extending along at least a portion of the peripheral edge, the edge stiffener structure further including a second portion overlapping the peripheral edge on a first surface of the PCB;
a top securing structure including an upper portion extending generally parallel to an upper surface of the PCB;
a bottom securing structure attached to the top securing structure and to the PCB on a lower surface of the PCB such that the PCB is secured between the top securing structure and the bottom securing structure, the bottom securing structure including a lower portion extending along at least the second portion of the edge stiffener structure, wherein the lower portion of the bottom securing structure has a first length in an x-direction that is greater than a second length of the second portion of the edge stiffener structure in the x-direction; and
the top securing structure or the bottom securing structure is thinned to accommodate the edge stiffener structure.
16 . The device of claim 15 , further comprising an integrated circuit component attached to the PCB.
17 . The device of claim 15 , wherein the bottom securing structure is a D-cover or a chassis.
18 . The device of claim 15 , wherein the top securing structure is a C-cover.
19 . The device of claim 15 , wherein the edge stiffener structure is fastened to the PCB using a plurality of solder bumps.
20 . The device of claim 15 , wherein the edge stiffener structure is fastened to the PCB using an adhesive.
21 . The device of claim 15 , wherein the edge stiffener structure comprises multiple segments.
22 . The device of claim 21 , wherein at least one of the multiple segments is a corner stiffener.
23 . The device of claim 15 , wherein the edge stiffener structure further comprises:
an extension that projects laterally from the PCB; and
the extension is configured to fit into one of the top securing structure or the bottom securing structure.
24 . The device of claim 15 , wherein the edge stiffener structure further comprises:
a first extension that projects laterally from the PCB and into the top securing structure; and
a second extension that projects laterally from the PCB and into the bottom securing structure.
25 . The device of claim 15 , wherein the top securing structure includes a first side portion adjacent to at least part of the first portion of the edge stiffener structure, where the bottom securing structure includes a second side portion adjacent to at least part of the first portion of the edge stiffener structure, wherein the bottom securing structure is attached to the top securing structure such that a lower edge of the first side portion and an upper edge of the second side portion are adjacent.