IP Library › Granted Patent US 12,249,059
Granted Patent B2
US 12,249,059 · App. 17/709,451 · Granted Mar 11, 2025

Navigation accuracy using camera coupled with detector assembly

Inventors: Alexander Krokhmal (Haifa, IL); Alexander Brandt (Tiberias, IL); Dor Perry (Haifa, IL); Asher Peled (Kfar-Vradim, IL); Matthew Wormington (Highlands Ranch, CO)
Assignee: Bruker Technologies Ltd.
G06T7/0004G06T2207/10116G06T2207/30148
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Quick Facts
Patent No.
US 12,249,059
App. No.
17/709,451
Granted
Mar 11, 2025
Kind
B2
Abstract

A system includes first and second imaging assemblies, and a processor. The first imaging assembly is configured to produce a first image of a measurement site in a sample. The second imaging assembly is coupled with a measurement assembly and is configured to produce a second image of the measurement site. The processor is configured to: (i) perform, based on the first image, a first movement of the sample relative to the measurement assembly, (ii) perform, based on the second image, a second movement of the sample for aligning the sample with the measurement assembly, and (iii) control the measurement assembly to perform a measurement in the measurement site.

Claims (32)

1. A system, comprising:

a first imaging assembly, which comprises an optical microscope, is configured to produce a first image of a measurement site, which comprises a structure produced in a sample comprising a semiconductor substrate;

a second imaging assembly, which comprises an optical camera, is coupled with a measurement assembly and is configured to produce a second image of the measurement site; and

a processor, which is configured to: (i) perform, based on the first image, a first movement of the sample relative to the measurement assembly, (ii) perform, based on the second image, a second movement of the sample for aligning the sample with the measurement assembly, and (iii) control the measurement assembly to perform a measurement in the measurement site.

2. The system according to claim 1 , wherein the optical microscope is configured to produce the first image in one or more magnifications, and the optical camera is configured to produce the second image, and wherein the processor is configured to identify the measurement site in the first and second images.

3. The system according to claim 1 , wherein the measurement assembly comprises one or more X-ray detector assemblies (XDAs), each XDA comprises multiple energy dispersive X-ray detectors surrounding a measurement position, and wherein: (i) a first distance between the optical microscope and the measurement position is larger than 50 mm, and (ii) a second distance between the optical camera and the measurement position is smaller than 25 mm.

4. The system according to claim 3 , wherein, based on at least the second image, the processor is configured to align the measurement position with the measurement site.

5. The system according to claim 3 , wherein the optical camera is positioned from at least one of the SDDs, at a third distance smaller than 20 mm.

6. The system according to claim 3 , wherein the optical camera is configured to produce the second image in a single magnification.

7. The system according to claim 3 , wherein at least one of the energy dispersive X-ray detectors comprises a silicon-drift detector (SDD).

8. The system according to claim 3 , and comprising an X-ray source, which is configured to direct an X-ray beam to the measurement position, and wherein, in response to directing the X-ray beam, at least one of the energy dispersive X-ray detectors is configured to detect X-ray fluorescence (XRF) emitted from the sample.

9. The system according to claim 8 , wherein, when the measurement position is aligned with the measurement site, the processor is configured to perform an XRF measurement in the structure produced in the semiconductor substrate.

10. The system according to claim 3 , wherein, (i) based on the first image, the processor is configured to obtain in the first movement, a first positioning error between the measurement site and the measurement position, and (ii) based on the second image, the processor is configured to obtain in the second movement, a second positioning error between the measurement site and the measurement position, wherein the second positioning error is smaller than the first positioning error.

11. The system according to claim 3 , wherein the optical camera and the SDDs are coupled to a common support structure of the measurement assembly.

12. The system according to claim 1 , wherein at least one of the first movement and the second movement comprises multiple movements.

13. The system according to claim 1 , wherein the second movement is smaller than the first movement.

14. A system, comprising:

an interface, which is configured to receive: (i) a first signal from a first imaging assembly, and (ii) a second signal from a second imaging assembly, which is coupled with a measurement assembly; and

a processor, which is configured to: (i) identify, based on the first signal, a measurement site in a sample, (ii) perform a first movement of the sample relative to the measurement assembly, (iii) identify the measurement site based on the second signal, and (iv) perform a second movement of the sample relative to the measurement assembly for performing a measurement in the measurement site, wherein the sample comprises a semiconductor substrate, and the measurement site comprises a structure produced in the semiconductor substrate, and wherein the first imaging assembly comprises an optical microscope, and the second imaging assembly comprises an optical camera.

15. The system according to claim 14 , wherein the measurement assembly comprises one or more X-ray detector assemblies (XDAS), each XDA comprises multiple energy dispersive X-ray detectors surrounding a measurement position, and wherein: (i) a first distance between the optical microscope and the measurement position is larger than 50 mm, and (ii) a second distance between the optical camera and the measurement position is smaller than 25 mm.

16. The system according to claim 15 , wherein, (i) based on the first image, the processor is configured to obtain in the first movement, a first positioning error between the measurement site and the measurement position, and (ii) based on the second image, the processor is configured to obtain in the second movement, between the measurement site and the measurement position, a second positioning error, smaller than the first positioning error.

17. The system according to claim 15 , wherein at least one of the energy dispersive X-ray detectors comprises a silicon-drift detector (SDD).

18. The system according to claim 15 , wherein the optical camera and the X-ray detectors are coupled to a common support structure of the measurement assembly.

19. A method, comprising:

receiving a first signal from a first imaging assembly, and a second signal from a second imaging assembly, which is coupled with a measurement assembly;

identifying, based on the first signal, a measurement site in a sample, and performing a first movement of the sample relative to the measurement assembly;

identifying the measurement site based on the second signal, and performing a second movement of the sample relative to the measurement assembly for aligning the sample with the measurement assembly; and

performing a measurement in the measurement site, wherein the sample comprises a semiconductor substrate and the measurement site comprises a structure produced in the semiconductor substrate, and wherein the first imaging assembly comprises an optical microscope, and the second imaging assembly comprises an optical camera.

20. The method according to claim 19 , wherein the measurement assembly comprises one or more X-ray detector assemblies (XDAS), each XDA comprises multiple energy dispersive X-ray detectors surrounding a measurement position, and wherein: (i) a first distance between the optical microscope and the measurement position is larger than 50 mm, and (ii) a second distance between the optical camera and the measurement position is smaller than 25 mm.

21. The method according to claim 20 , wherein, (i) based on the first image, the processor is configured to obtain in the first movement, a first positioning error between the measurement site and the measurement position, and (ii) based on the second image, the processor is configured to obtain in the second movement, between the measurement site and the measurement position, a second positioning error, smaller than the first positioning error.

22. The method according to claim 20 , wherein the camera and the energy dispersive X-ray detectors are coupled to a common support structure of the measurement assembly.

23. The method according to claim 19 , wherein performing the second movement comprises performing a smaller movement compared to the first movement.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2022
From: KROKHMAL, ALEXANDER; BRANDT, ALEXANDER; PERRY, DOR; PELED, ASHER; WORMINGTON, MATTHEW
To: BRUKER TECHNOLOGIES LTD.
Reel/Frame 059479/0874 →
Continuity (1)
Related Publication 20230316487A1 · Oct 5, 2023
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