Temperature sensor to achieve thermal stabilization of micro-ring resonator (MRR) in an open cavity photonic integrated circuit (OCPIC)
Embodiments disclosed herein include an optoelectronic system. In an embodiment, the optoelectronic system comprises a first substrate, a second substrate over the first substrate, and a micro-ring resonator (MRR) over the second substrate. In an embodiment, a heater is integrated into the MRR, a cladding is over the MRR, and a temperature sensor is over the MRR in the cladding.
1. An optoelectronic system, comprising:
a first substrate;
a second substrate over the first substrate;
a micro-ring resonator (MRR) over the second substrate;
a heater integrated into the MRR;
a cladding over the MRR; and
a temperature sensor over the MRR in the cladding.
2. The optoelectronic system of claim 1 , further comprising:
an interface layer between the temperature sensor and the MRR.
3. The optoelectronic system of claim 2 , wherein the interface layer is not over the heater.
4. The optoelectronic system of claim 2 , wherein the interface layer is over the heater.
5. The optoelectronic system of claim 2 , wherein the interface layer is a thermal conductor.
6. The optoelectronic system of claim 5 , wherein the thermal conductor comprises silicon and nitrogen.
7. The optoelectronic system of claim 1 , wherein the temperature sensor is approximately 2 microns away from the MRR.
8. The optoelectronic system of claim 1 , wherein the heater is positioned in the center of the MRR.
9. The optoelectronic system of claim 1 , further comprising:
contacts coupled to a top surface of the MRR.
10. The optoelectronic system of claim 9 , wherein the contacts are electrically coupled to pads on a top surface of the cladding.
11. The optoelectronic system of claim 1 , wherein the MRR has a thickness that is approximately 250 nm or less.
12. An optoelectronic system, comprising:
a waveguide;
a micro-ring adjacent to the waveguide;
a heater within a perimeter of the micro-ring; and
a sensor directly over the micro-ring.
13. The optoelectronic system of claim 12 , wherein the sensor comprises a conductive trace that is provided vertically above the micro-ring.
14. The optoelectronic system of claim 13 , wherein the conductive trace is thermally coupled to the micro-ring by a thermal interface layer.
15. The optoelectronic system of claim 14 , wherein the thermal interface layer comprises silicon and nitrogen.
16. The optoelectronic system of claim 13 , wherein the thermal interface layer does not cover a top surface of the heater.
17. The optoelectronic system of claim 13 , wherein the thermal interface layer covers a top surface of the heater.
18. An optoelectronic system, comprising:
a package substrate;
a photonics integrated circuit (PIC) coupled to the package substrate, wherein the PIC comprises:
a first substrate;
a second substrate over the first substrate;
a micro-ring resonator (MRR) over the second substrate;
a heater integrated into the MRR;
a cladding over the MRR; and
a temperature sensor over the MRR in the cladding; and
an electronic integrated circuit (EIC) coupled to the PIC.
19. The optoelectronic system of claim 18 , further comprising:
an interface layer between the temperature sensor and the MRR.
20. The optoelectronic system of claim 19 , wherein the interface layer comprises silicon and nitrogen.