On-cavity photonic integrated circuit (OCPIC) to achieve the most undercut real estate for effective thermal tuning
Embodiments disclosed herein include an on-cavity photonic integrated circuit (OCPIC). In an embodiment, the OCPIC comprises a laser transmitter, that comprises a row with four bumps, and a micro-ring resonator (MRR) in the row between a first bump and a second bump of the four bumps. In an embodiment, a cavity is below the MRR, where a diameter of the cavity is substantially equal to a spacing between the first bump and the second bump.
1. An apparatus comprising:
a laser transmitter, comprising:
a row with four bumps; and
a micro-ring resonator (MRR) in the row between a first bump and a second bump of the four bumps; and
a cavity below the MRR, wherein a diameter of the cavity is substantially equal to a spacing between the first bump and the second bump.
2. The apparatus of claim 1 , wherein the diameter of the cavity is approximately 59 μm.
3. The apparatus of claim 1 , wherein a pitch between the second bump and a third bump is approximately 45 μm.
4. The apparatus of claim 1 , further comprising:
a second laser transmitter adjacent to the laser transmitter, comprising:
a second row with four bumps;
a second MRR in the second row between a third bump and a fourth bump of the four bumps; and
a second cavity below the second MRR, wherein the second cavity has the same diameter as the cavity.
5. The apparatus of claim 4 , wherein a pitch between the row and the second row is larger than a pitch between bumps in the row.
6. The apparatus of claim 5 , wherein the pitch between the row and the second row is approximately 55 μm, and wherein the pitch between bumps in the row is approximately 45 μm.
7. The apparatus of claim 4 , wherein the pitch between the row and the second row is substantially equal to a pitch between bumps in the row.
8. The apparatus of claim 7 , wherein the pitch between the row and the second row is approximately 45 μm, and wherein the pitch between bumps in the row is approximately 45 μm.
9. The apparatus of claim 4 , wherein the second laser transmitter is a mirror image of the laser transmitter.
10. The apparatus of claim 4 , wherein the second laser transmitter is offset from the laser transmitter.
11. The apparatus of claim 10 , wherein the second laser transmitter is a mirror image of the laser transmitter.
12. The apparatus of claim 1 , wherein the bumps comprise:
a ground bump;
a power delivery bump;
a heater power bump; and
a signal bump.
13. An apparatus, comprising:
a first laser transmitter, wherein the first laser transmitter comprises:
a first row of bumps;
a first micro-ring resonator (MRR) embedded in the first row of bumps;
a first cavity below the first MRR; and
a second laser transmitter, wherein the second laser transmitter comprises:
a second row of bumps;
a second MRR; and
a second cavity below the second MRR, wherein the first laser transmitter and the second laser transmitter have a cell length that is approximately 225 μm or less.
14. The apparatus of claim 13 , wherein bumps in the first row and bumps in the second row have a pitch that is approximately 45 μm.
15. The apparatus of claim 13 , wherein a pitch between bumps in the first row and bumps in the second row is approximately 55 μm or less.
16. The apparatus of claim 15 , wherein the pitch between bumps in the first row and bumps in the second row is approximately 45 μm.
17. The apparatus of claim 13 , wherein the bump layout of the first laser transmitter is a mirror image of the bump layout of the second laser transmitter.
18. The apparatus of claim 13 , wherein the first laser transmitter is offset from the second laser transmitter.
19. An optoelectronic system, comprising:
a package substrate;
an on-cavity photonic integrated circuit (OCPIC), comprising:
a first laser transmitter, wherein the first laser transmitter comprises:
a first row of bumps;
a first micro-ring resonator (MRR) embedded in the first row of bumps;
a first cavity below the first MRR; and
a second laser transmitter, wherein the second laser transmitter comprises:
a second row of bumps;
a second MRR; and
a second cavity below the second MRR, wherein the first laser transmitter and the second laser transmitter have a cell length that is approximately 225 μm or less; and
an electronic integrated circuit (EIC) communicatively coupled to the OCPIC.
20. The optoelectronic system of claim 19 , wherein a diameter of the first cavity and a diameter of the second cavity is approximately 59 μm.