Substrate embedded magnetic core inductors and method of making
Described are microelectronic devices including an embedded microelectronic package for use as an integrated voltage regulator with a microelectronic system. The microelectronic package can include a substrate and a magnetic foil. The substrate can define at least one layer having one or more of electrically conductive elements separated by a dielectric material. The magnetic foil can have ferromagnetic alloy ribbons and can be embedded within the substrate adjacent to the one or more of electrically conductive elements. The magnetic foil can be positioned to interface with and be spaced from the one or more of electrically conductive element.
1. An electronic package for use as an integrated voltage regulator with a microelectronic system, the electronic package comprising:
a substrate defining at least one layer having one or more of electrically conductive elements separated by a dielectric material;
a first magnetic foil having ferromagnetic alloy ribbons, the first magnetic foil embedded within the substrate adjacent to the one or more of electrically conductive elements, wherein the first magnetic foil is positioned to interface with and be spaced from a first side of the one or more of electrically conductive elements such that the first magnetic foil interfaces with and is spaced from the first side of the one or more of electrically conductive elements, and wherein the dielectric material comprises a single continuous dielectric layer from a top of the first magnetic foil to a bottom of the one or more of electrically conductive elements; and
a second magnetic foil that is positioned on a second side of the one or more of electrically conductive elements such that the second magnetic foil interfaces with and is spaced from the second side of the one or more of electrically conductive elements, wherein the second magnetic foil is spaced apart and isolated from the first magnetic foil.
2. The electronic package of claim 1 , wherein the first magnetic foil is positioned within the substrate to have a major surface thereof extend in a first plane that is substantially parallel with a second plane defined by the at least one layer having the one or more of electrically conductive elements.
3. The electronic package of claim 1 , wherein the first magnetic foil is positioned within the substrate to have major surfaces thereof extend in both a first plane that is substantially parallel with a second plane defined by the at least one layer having the one or more of electrically conductive elements and a third plane that is substantially perpendicular with the second plane.
4. The electronic package of claim 1 , wherein the first magnetic foil is shaped and positioned in two dimensions to enclose the one or more of electrically conductive elements in one or more dimensions, and wherein the first magnetic foil is operable with the one or more of the electrically conductive elements to act as an inductor.
5. The electronic package of claim 1 , further comprising a non-magnetic adhesive material positioned between the first magnetic foil and the one or more of electrically conductive elements.
6. The electronic package of claim 1 , wherein the dielectric material of the substrate separates the first magnetic foil and the one or more of electrically conductive elements.
7. The electronic package of claim 1 , further comprising at least two electrically conductive elements disposed laterally to either side of the first magnetic foil and the one or more of electrically conductive elements.
8. An electronic system, comprising:
a board;
a semiconductor chip; and an integrated voltage regulator configured to couple to the semiconductor chip, comprising:
a substrate defining multiple layers of conductive traces separated by respective layers of dielectric material;
a plurality of magnetic foils each having ferromagnetic alloy ribbons embedded within the substrate adjacent one or more of the multiple layers, wherein a first one of the plurality of magnetic foils is positioned to interface with and be spaced from a first side of one or more of electrically conductive elements of the conductive traces, wherein a single continuous dielectric layer extends from a top of the first one of the plurality of magnetic foils to a bottom of the one or more of electrically conductive elements, and wherein a second one of the plurality of magnetic foils is positioned to interface with and be spaced from a second side of the one or more of electrically conductive elements, wherein the second one of the plurality of magnetic foils is spaced apart and isolated from the first one of the plurality of magnetic foils;
multiple electrical contacts extending through the substrate, wherein the multiple contacts include at least two electrical contacts disposed laterally to either side of the first or second ones of the plurality of magnetic foils and the one or more of electrically conductive elements.
9. The electronic system of claim 8 , wherein the first one of the plurality of magnetic foils is positioned within the substrate to have first major surfaces thereof extend in both a first plane that is substantially parallel with a second plane defined by one of the multiple layers of conductive traces and a third plane that is substantially perpendicular with the second plane, and wherein the second one of the plurality of magnetic foils is positioned within the substrate to have second major surfaces extend in both the first plane and the third plane.