Systems and methods for controlling thermal energy between hinged portions of electronic devices
A method and system to conduct thermal energy between two hinged portions of an electric device. In examples, the method employs a thermal hinge system configured to transfer or spread thermal energy, and optionally electrical energy, through a mechanical articulation or hinge in an electronic device. A thermal hinge may include a thermally conductive living hinge, complementary and/or mating thermal interface components, or a combination of both.
1. A thermal system for an electronic device, the thermal system comprising:
a first mechanical articulation configured to couple together a first hinged portion and a second hinged portion, the first mechanical articulation comprising:
a first thermal interface component located in the first hinged portion-and associated with the first mechanical articulation; and
a second thermal interface component located in the second hinged portion-and associated with the first mechanical articulation,
wherein the first thermal interface component and the second thermal interface component are configured to be movable between: (i) a first position in contact with each other and forming a first thermal pathway between the first hinged portion and the second hinged portion and (ii) a second position spaced apart to break the first thermal pathway
a second mechanical articulation configured to couple together the second hinged portion and a third hinged portion, the second mechanical articulation comprising:
a third thermal interface component located in the third hinged portion and associated with the second mechanical articulation; and
a fourth thermal interface component located in the second hinged portion and associated with the second mechanical articulation,
wherein the third thermal interface component and the fourth thermal interface component are configured to be displaced from (i) one position to contact each other and form a second thermal pathway between the third hinged portion and the second hinged portion to (ii) another position to be spaced apart to break the second thermal pathway.
2. The system of claim 1 , wherein the first thermal interface component comprises a first surface finish and a first surface feature and the second thermal interface component comprises a second surface finish and a second surface feature, the first surface feature and the second surface feature being complementary to each other and configured to mate when the first thermal interface component and the second thermal interface component are in the first position.
3. The system of claim 1 , wherein the first thermal interface component comprises a surface feature, and the second thermal interface component comprises a coating configured to accommodate the surface feature when the first thermal interface component is pressed against the second thermal interface component.
4. The system of claim 1 , wherein the first thermal interface component comprises one or more curved protrusion, a coating, and one or more first surface features over the coating, and the second thermal interface component is configured to accommodate the first thermal interface component when the first thermal interface component and the second thermal interface component are pressed together.
5. The system of claim 4 , wherein the second thermal interface component further comprises one or more second surface features that are complementary to the first surface features.
6. The system of claim 1 , wherein the first mechanical articulation is spring-loaded.
7. The system of claim 1 , wherein the electronic device comprises a pair of extended reality glasses, wherein the first hinged portion is a first temple arm of the extended reality glasses, the second hinged portion is a frame of the extended reality glasses, and the third hinged portion is a second temple arm of the pair of extended reality glasses.
8. A method of controlling transfer of thermal energy between hinged portions of an electronic device comprising:
providing the electronic device, which comprises a first hinged portion comprising a first thermal interface component, a second hinged portion comprising a second thermal interface component and a fourth thermal interface component, and a third hinged portion comprising a third thermal interface component, the first hinged portion and the second hinged portion being coupled by a first mechanical articulation, and the second hinged portion and the third hinged portion being coupled by a second mechanical articulation;
causing thermal energy to be transferred to the first thermal interface component;
operating the first mechanical articulation by applying a first force to displace the first hinged portion of the electronic device relative to the second hinged portion of the electronic device to cause the first thermal interface component to come into physical contact with the respective second thermal interface component and form a first thermal pathway to transfer the thermal energy between the first thermal interface component and the second thermal interface component;
causing the thermal energy to be transferred to third thermal interface component; and
operating the second mechanical articulation by applying a second force to displace the third hinged portion of the electronic device relative to the second hinged portion of the electronic device to cause the third thermal interface component to come into physical contact with the fourth thermal interface component and form a second thermal pathway to transfer the thermal energy between the third thermal interface component and the second thermal interface component,
wherein the third thermal interface component and the fourth thermal interface component are configured to be displaced from (i) one position to contact each other and form a second thermal pathway between the third hinged portion and the second hinged portion to (ii) another position to be spaced apart to break the second thermal pathway.
9. The method of claim 8 , further comprising:
transferring the thermal energy from an electronic structure to a first thermal management component located in the first hinged portion prior to causing the thermal energy to be transferred to the first thermal interface component; and
transferring the thermal energy from the second thermal interface component to a second thermal management component located in the second hinged portion after the thermal energy is transferred between the first thermal interface component and the second thermal interface component.
10. The method of claim 8 , further comprising further operating the first mechanical articulation to displace the first hinged portion of the electronic device relative to the second hinged portion of the electronic device to cause the first thermal interface component to become spaced apart from the respective second thermal interface component and interrupt the first thermal pathway to transfer the thermal energy between the first thermal interface component and the second thermal interface component.
11. The method of claim 8 , wherein the electronic device comprises a pair of extended reality glasses, wherein the first hinged portion is a first temple arm of the extended reality glasses, the second hinged portion is a frame of the extended reality glasses, and the third hinged portion is a second temple arm of the pair of extended reality glasses.
12. An electronic device comprising:
a first hinged portion;
a second hinged portion;
a third hinged portion;
a first mechanical articulation coupling the first hinged portion to the second hinged portion;
a second mechanical articulation coupling the second hinged portion to the third hinged portion;
a first thermal interface component located in the first hinged portion and associated with the first mechanical articulation; and
a second thermal interface component located in the second hinged portion and associated with the first mechanical articulation,
a third thermal interface component located in the third hinged portion and associated with the second mechanical articulation; and
a fourth thermal interface component located in the second hinged portion and associated with the second mechanical articulation,
wherein the first thermal interface component and the second thermal interface component are configured to be movable between: (i) a first position in contact with each other and form a thermal pathway between the first hinged portion and the second hinged portion and (ii) a second position spaced apart to break the thermal pathway,
wherein the third thermal interface component and the fourth thermal interface component are configured to be displaced from (i) one position to contact each other and form a second thermal pathway between the third hinged portion and the second hinged portion to (ii) another position to be spaced apart to break the second thermal pathway.
13. The electronic device of claim 12 , wherein the first thermal interface component comprises a first surface finish and a first surface feature and the second thermal interface component comprises a second surface finish and a second surface feature, the first surface feature and the second surface feature being complementary to each other and configured to mate when the first thermal interface component and the second thermal interface component are in the first position.
14. The electronic device of claim 12 , wherein the first thermal interface component comprises a surface feature, and the second thermal interface component comprises a coating configured to accommodate the surface feature when the first thermal interface component is pressed against the second thermal interface component.
15. The electronic device of claim 12 , further comprising:
a first thermal management component provided in the first hinged portion and thermally coupled to an electronic structure and bonded to the first thermal interface component; and
a second thermal management component provided in the second hinged portion and bonded to the second thermal interface component.
16. The electronic device of claim 15 , wherein the first thermal management component and the second thermal management component are each independently a vapor chamber, heat pipe, or thermally conductive strip of material.
17. The electronic device of claim 16 , wherein the first thermal management component and the second thermal management component each independently comprises a flex circuit.
18. The electronic device of claim 12 , wherein the electronic device comprises a wearable device.
19. The electronic device of claim 12 , wherein the electronic device comprises a pair of extended reality glasses, wherein the first hinged portion is a first temple arm of the extended reality glasses, the second hinged portion is a frame of the extended reality glasses, and the third hinged portion is a second temple arm of the pair of extended reality glasses.
20. The electronic device of claim 12 , further comprising a living hinge extending from the first hinged portion to the second hinged portion and along the first mechanical articulation.