Optoelectronic assembly and method for producing an optoelectronic assembly

1. An optoelectronic assembly comprising:

an optoelectronic component comprising:

a first electrode;

an organic functional layer structure arranged above the first electrode;

a second electrode arranged above the organic functional layer structure;

and a specularly reflective surface, wherein the second electrode includes or forms the specularly reflective surface; and

a radiation cooler in physical contact with the optoelectronic component;

wherein the radiation cooler is arranged on a side of the second electrode distal from the organic functional layer structure.

2. The optoelectronic assembly as claimed in claim 1 , wherein the optoelectronic component comprises a covering body, which closes off the optoelectronic component toward the outside, and the radiation cooler is arranged on the covering body, and/or

the optoelectronic component comprises a carrier, which closes off the optoelectronic component toward the outside, and the radiation cooler is arranged on the carrier, and/or

the optoelectronic component comprises a heat sink, which closes off the optoelectronic component toward the outside, and the radiation cooler is arranged on the heat sink.

3. The optoelectronic assembly as claimed in claim 1 , wherein the radiation cooler is integrated into a layer structure of the optoelectronic component.

4. The optoelectronic assembly as claimed in claim 1 , wherein the radiation cooler is in direct physical contact with an electrode of the optoelectronic component.

5. The optoelectronic assembly as claimed in claim 1 , wherein the optoelectronic component is an organic optoelectronic component implemented as a solar cell or an OLED.

6. The optoelectronic assembly as claimed in claim 1 , wherein the radiation cooler comprises a layer structure comprising a plurality of different layers, wherein the layers have different refractive indices and at least partly different layer thicknesses, wherein in a first thickness region of the layer structure layers are formed which have thicknesses which are greater than the thicknesses of layers in a second thickness region.

7. The optoelectronic assembly as claimed in claim 6 , wherein the thicknesses in the first thickness region are in a range from 100 to 1000 nm and/or wherein the thicknesses in the second thickness region are in a range from 1 to 100 nm.

8. The optoelectronic assembly as claimed in claim 6 , wherein the layers in part comprise or are formed by silicon dioxide and in part comprise or are formed by hafnium oxide or titanium dioxide.

9. An optoelectronic assembly comprising:

an optoelectronic component comprising:

a first electrode;

an organic functional layer structure arranged above the first electrode;

a second electrode arranged above the organic functional layer structure; and

a reflective surface; and

a radiation cooler in contact with the optoelectronic component,

wherein the radiation cooler is arranged on a side of the second electrode distal from the organic functional layer structure; and

wherein the radiation cooler comprises a layer structure comprising a plurality of different layers, wherein the layers have different refractive indices and at least partly different layer thicknesses, wherein in a first thickness region of the layer structure layers are formed which have thicknesses which are greater than the thicknesses of layers in a second thickness region.

10. The optoelectronic assembly as claimed in claim 9 , wherein the optoelectronic component is an organic optoelectronic component implemented as a solar cell or an OLED.

11. The optoelectronic assembly as claimed in claim 9 , wherein the radiation cooler is arranged on a side of the organic functional layer structure facing away from the reflective surface.

12. The optoelectronic assembly as claimed in claim 9 , wherein the radiation cooler is arranged on a side of the organic functional layer structure facing towards the reflective surface.

13. The optoelectronic assembly as claimed in claim 9 , wherein the optoelectronic component comprises a covering body, and/or

the optoelectronic component comprises a carrier, and/or

the optoelectronic component comprises a heat sink.

14. The optoelectronic assembly as claimed in claim 13 , wherein the covering body, the carrier, the heat sink, the first electrode and/or the second electrode comprises or forms the reflective surface.