Package, optical device, and manufacturing method of package
View Patent ↗A package includes a photonic integrated circuit die, an electric integrated circuit die, and an encapsulant. The photonic integrated circuit die includes a semiconductor substrate and a waveguide. The semiconductor substrate has a notch. The waveguide is disposed over the semiconductor substrate. A portion of the waveguide is located within a span of the notch of the semiconductor substrate. The electric integrated circuit die is disposed over and electrically connected to the photonic integrated circuit die. The encapsulant laterally encapsulates the electric integrated circuit die.
1. A package, comprising:
a photonic integrated circuit die, comprising:
a semiconductor substrate having a notch, wherein the notch is occupied by air; and
a waveguide disposed over the semiconductor substrate, wherein a portion of the waveguide is located within a span of the notch of the semiconductor substrate;
an electric integrated circuit die disposed over and electrically connected to the photonic integrated circuit die; and
an encapsulant laterally encapsulating the electric integrated circuit die.
2. The package of claim 1 , further comprising a supporting substrate over the electric integrated circuit die and the encapsulant.
3. The package of claim 1 , wherein the photonic integrated circuit die further comprises an etch stop layer located between the semiconductor substrate and the waveguide.
4. The package of claim 1 , wherein a height of the notch is equal to a thickness of the semiconductor substrate.
5. The package of claim 1 , wherein a height of the notch is smaller than a thickness of the semiconductor substrate.
6. The package of claim 1 , wherein the photonic integrated circuit die further comprises through vias penetrating through the semiconductor substrate, and the through vias are electrically connected to the electric integrated circuit die.
7. An optical device, comprising:
a circuit substrate; and
a package disposed on the circuit substrate, wherein the package comprises:
a photonic integrated circuit die, comprising:
a semiconductor substrate comprising a notch, wherein the notch is occupied by air; and
a waveguide disposed over the semiconductor substrate, wherein a tip of the waveguide is overlapped with the notch from a top view; and
an electric integrated circuit die disposed over and electrically connected to the photonic integrated circuit die.
8. The optical device of claim 7 , wherein the package further comprises a redistribution structure and conductive terminals dispose over the semiconductor substrate opposite to the waveguide, and the package is electrically connected to the circuit substrate through the conductive terminals.
9. The optical device of claim 7 , wherein the package further comprises an encapsulant laterally encapsulating the electric integrated circuit die.
10. The optical device of claim 7 , further comprising:
an optical fiber disposed adjacent to the waveguide, wherein the optical fiber is optically coupled to the waveguide; and
a supporting structure disposed on the circuit substrate, wherein the optical fiber is disposed on the supporting structure.
11. The optical device of claim 7 , wherein a width of the notch gradually increases from an edge of the semiconductor substrate toward an interior of the semiconductor substrate.
12. The optical device of claim 7 , wherein a width of the notch gradually decreases from an edge of the semiconductor substrate toward an interior of the semiconductor substrate.
13. The optical device of claim 7 , wherein a width of the notch is uniform.
14. The optical device of claim 7 , wherein the photonic integrated circuit die further comprises an etch stop layer located between the semiconductor substrate and the waveguide.
15. The optical device of claim 7 , wherein a height of the notch is equal to a thickness of the semiconductor substrate.
16. The optical device of claim 7 , wherein a height of the notch is smaller than a thickness of the semiconductor substrate.
17. A manufacturing method of a package, comprising:
providing a semiconductor wafer comprising a semiconductor substrate and waveguides over the semiconductor substrate;
bonding an electric integrated circuit die to the semiconductor wafer;
laterally encapsulating the electric integrated circuit die by an encapsulant;
forming a redistribution structure on the semiconductor substrate such that the redistribution structure and the waveguides are located over two opposite surfaces of the semiconductor substrate;
removing a portion of the semiconductor substrate to form notches in the semiconductor substrate; and
forming conductive pads over the redistribution structure.
18. The method of claim 17 , wherein prior to the removal of the portion of the semiconductor substrate, a portion of the redistribution structure is removed.
19. The method of claim 17 , wherein the conductive pads are formed prior to the removal of the portion of the semiconductor substrate.
20. The method of claim 17 , wherein the conductive pads are formed after the removal of the portion of the semiconductor substrate.