Secondary side heatsink techniques for optical and electrical modules
A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.
1. A system for use in a hardware platform for networking, computing, and/or storage, the system comprising:
a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side;
one or more optical components disposed on a surface of the printed circuit board assembly on the primary side of the printed circuit board assembly, wherein the optical components include a pluggable optical module which is removable from the printed circuit board assembly; and
a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is in thermal communication with and disposed via a direct thermal interface opposite of the pluggable optical module disposed on the primary side, for thermal management, when the pluggable module is inserted.
2. The system of claim 1 , wherein the secondary side heatsink is floating under a spring force including attachment components disposed on the primary side.
3. The system of claim 2 , wherein the attachment components are located through holes in the printed circuit board assembly.
4. The system of claim 1 , wherein the secondary side heatsink includes an adjustable vertical height relative to the optical component via an adjustable mechanical interface.
5. The system of claim 4 , wherein the adjustable mechanical interface is a set screw and cylindrical post.
6. The system of claim 4 , wherein the adjustable vertical height is set via the adjustable mechanical interface and is based on a thickness of the printed circuit board assembly.
7. The system of claim 1 , wherein the secondary side heatsink protrudes through a hole in the printed circuit board assembly to attach to the some of the optical components.
8. The system of claim 1 , wherein the printed circuit board assembly and the components are in a pluggable optical module compliant to a multi-source agreement.
9. The system of claim 8 , further comprising a cage for housing the pluggable optical module, wherein the secondary side heatsink protrudes through a hole in the cage.
10. The system of claim 1 , wherein the printed circuit board assembly, the components, and the secondary side heatsink are in a pluggable optical module compliant to a multi-source agreement.
11. A method comprising:
providing a system for use in a hardware platform for networking, computing, and/or storage, the system comprising:
a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side;
one or more optical components disposed on a surface of the printed circuit board assembly on the primary side of the printed circuit board assembly, wherein the optical components include a pluggable optical module which is removable from the printed circuit board assembly; and
a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is in thermal communication with and disposed via a direct thermal interface opposite of the pluggable optical module disposed on the primary side, for thermal management, when the pluggable module is inserted.
12. The method of claim 11 , wherein the secondary side heatsink is floating under a spring force including attachment components disposed on the primary side.
13. The method of claim 12 , wherein the attachment components are located through holes in the printed circuit board assembly.
14. The method of claim 11 , wherein the secondary side heatsink includes an adjustable height.
15. The method of claim 14 , wherein the adjustable height is based on a set screw.
16. The method of claim 14 , wherein the adjustable height is based on a thickness of the printed circuit board assembly.
17. The method of claim 11 , wherein the secondary side heatsink protrudes through a hole in the printed circuit board assembly to attach to the some of the optical components.
18. The method of claim 11 , wherein the printed circuit board assembly and the components are in a pluggable optical module compliant to a multi-source agreement.
19. The method of claim 18 , further comprising a cage for housing the pluggable optical module, wherein the secondary side heatsink protrudes through a hole in the cage.
20. The method of claim 11 , wherein the printed circuit board assembly, the components, and the secondary side heatsink are in a pluggable optical module compliant to a multi-source agreement.