Electronic module for arrangement to a transmission component and a method for arranging an electronic module to a transmission component
The invention relates to an electronic module ( 100 ) mounted on a transmission component ( 112 ). The electronic module ( 100 ) comprises a printed circuit board element ( 102 ) that has component side ( 104 ) with at least one electronic component ( 108 ) and a contact side ( 106 ) lying opposite the component side ( 104 ), and a heat conducting film ( 110 ) that is placed between a surface section of the contact side ( 106 ) lying opposite the component ( 108 ) and a surface section of the transmission component ( 112 ). The printed circuit board element ( 102 ) can be or is tightened to the transmission component ( 112 ) such that the heat conducting film ( 110 ) is pressed against the surface section of the contact side ( 106 ) and the surface section of the transmission component ( 112 ).
1. An electronic module mounted on a transmission component, wherein the electronic module comprises the following features:
a printed circuit board that has a component side with at least one electronic component, and a contact side lying opposite the component side; and
a heat conducting film that is placed between a surface section of the contact side lying opposite the component and a surface section of the transmission component, wherein the printed circuit board element can be or is tightened to the transmission component, such that the heat conducting film is pressed against the surface section of the contact side and the surface section of the transmission component.
2. The electronic module according to claim 1 , in which the printed circuit board element has at least one first through hole for receiving a first tensioning element for tensioning the printed circuit board element and a second through hole for receiving a second tensioning element for tensioning the printed circuit board element.
3. The electronic module according to claim 2 , in which the component is located between the first through hole and the second through hole.
4. The electronic module according to claim 2 , in which the component is located on a line connecting the first through hole and the second through hole.
5. The electronic module according to claim 4 , in which a segment of the line crossing the component is longer than the greatest width (B) of the component.
6. The electronic module according to claim 1 , with a housing for housing the component.
7. The electronic module according to claim 6 , in which the housing has at least one first housing through hole for receiving the first tensioning element and one second housing through hole for receiving the second tensioning element, wherein when the component is housed therein, the first housing through hole lies opposite the first through hole, and the second housing through hole lies opposite the second through hole.
8. The electronic module according to claim 6 , in which the component is cast with a housing material, in order to form the housing.
9. The electronic module according to claim 1 , in which the heat conducting film has a predefined elasticity, and/or is self-adhesive, and/or can be removed without residues.
10. The electronic module according to claim 1 , in which the printed circuit board element is populated on one side with the component.
11. The electronic module according to claim 1 , in which the printed circuit board element has at least one further electronic component on the component side, wherein the heat conducting film is furthermore formed such that it can be placed between a further surface section of the contact side lying opposite the further component and a further surface section of the transmission component, wherein the printed circuit board element can be or is tightened to the transmission component, such that the heat conducting film is also pressed against the further surface section of the contact side and the further surface section of the transmission component.
12. A method for mounting an electronic module on a transmission component, wherein the method comprises the following steps:
providing a printed circuit board element that has a component side with at least one electronic component and contact side lying opposite the component side that comes in contact with the transmission component;
placing a heat conducting film between a surface section of the contact side lying opposite the component and a surface section of the transmission component; and
tightening the printed circuit board element to the transmission component such that the heat conducting film is pressed against the surface section of the contact side and the surface section of the transmission component.