Vertical field-effect transistor and method for its formation
A vertical field-effect transistor. The vertical field-effect transistor includes: a drift region, a semiconductor fin on or above the drift region, and a source/drain electrode on or above the semiconductor fin. The semiconductor fin includes at least one concave side wall in the region between the drift region and the source/drain electrode.
1 . A vertical field-effect transistor, comprising:
a drift region;
a semiconductor fin on or above the drift region;
a source/drain electrode on or above the semiconductor fin, the semiconductor fin including at least one concave side wall in a region between the drift region and the source/drain electrode,
a gate electrode formed laterally next to at least one side wall of the semiconductor fin,
the at least one concave side wall being formed in that the semiconductor fin has a smaller lateral extent in a first portion, which is arranged laterally next to the gate electrode, than in a second portion, which makes contact with the drift region, and/or than in a third portion, which makes contact with the source/drain electrode,
wherein the at least one concave side wall faces laterally toward the gate electrode and defines a reduced lateral width of the semiconductor fin at a central portion located between upper and lower portions of the semiconductor fin, such that the semiconductor fin is narrower in the central portion than both the upper portion adjacent to the source/drain electrode and the lower portion adjacent to the drift region.
2 . The vertical field-effect transistor as recited in claim 1 , wherein the drift region and the semiconductor fin are formed from silicon carbide or gallium nitride.
3 . The vertical field-effect transistor as recited in claim 1 , wherein the semiconductor fin includes a first side wall and a second side wall, which is on an opposite side to the first side wall, the first side wall and the second side wall being concave in form.
4 . The vertical field-effect transistor as recited in claim 1 , wherein the at least one concave side wall is defined by the reduced lateral width at the central portion of the semiconductor fin relative to upper and lower portions of the semiconductor fin, the reduced lateral width being formed by oxidation and removal of semiconductor material at sidewalls of the fin, and the upper portion of the semiconductor fin being protected from oxidation by an etch-stop mask formed on or above the semiconductor fin.
5 . A method for forming a vertical field-effect transistor, the method comprising:
forming a drift region;
forming a semiconductor fin on or above the drift region; and
forming a source/drain electrode on or above the semiconductor fin, the semiconductor fin being formed with at least one concave side wall in a region between the drift region and the source/drain electrode,
wherein a gate electrode is formed laterally next to at least one side wall of the semiconductor fin, the at least one concave side wall being formed in that the semiconductor fin has a smaller lateral extent in a first portion, which is arranged laterally next to the gate electrode, than in a second portion, which makes contact with the drift region, and/or than in a third portion, which makes contact with the source/drain electrode,
wherein the at least one concave side wall faces laterally toward the gate electrode and defines a reduced lateral width of the semiconductor fin at a central portion located between upper and lower portions of the semiconductor fin, such that the semiconductor fin is narrower in the central portion than both the upper portion adjacent to the source/drain electrode and the lower portion adjacent to the drift region.
6 . The method as recited in claim 5 , wherein the at least one concave side wall of the semiconductor fin is formed using an etch-stop mask, the etch-stop masking formed on or above the semiconductor fin.
7 . The method as recited in claim 6 , wherein the etch-stop mask includes a nitride compound.
8 . The method as recited in claim 5 , wherein the at least one concave side wall of the semiconductor fin is formed by oxidation of a semiconductor material of the semiconductor fin and removal of the formed oxide semiconductor material.
9 . The method as recited in claim 8 , wherein the formation of the at least one concave side wall of the semiconductor fin includes repeated carrying out of oxidation of a semiconductor material of the semiconductor fin and of subsequent removal of the formed oxide semiconductor material.
10 . The method as recited in claim 5 , wherein the concave side wall of the semiconductor fin is formed using isotropic etching of a semiconductor material of the semiconductor fin.