Granted Patent B2

US 12,283,491 · App. 17/781,977 · Granted Apr 22, 2025

Inventors: Gerald Mittendorfer (Stuben, AT); Friedrich Paul Lindner (Schärding, AT)

Assignee: EV GROUP E. THALLNER GMBH

H01L21/52H01L21/78

Abstract

Claims (13)

1. A method for producing singulated encapsulated components, said method comprising:

application of a frame structure on a substrate surface of a substrate, wherein the frame structure surrounds components arranged on the substrate surface;

bonding of a cover substrate on the frame structure;

hardening of the frame structure; and

singulation of the encapsulated components,

wherein the frame structure is formed from an adhesive,

wherein the singulated encapsulated components are treated with plasma and/or reactive gas, wherein the plasma and/or gas treatment is conducted after the hardening of the frame structure, and wherein the plasma and/or gas treatment leads to a chemical conversion of an outer surface of the frame structure.

2. The method according to claim 1 , wherein the adhesive is a silicone adhesive.

3. The method according to claim 1 , wherein the singulated encapsulated components are treated in such a way that on the outer surface of the frame structure a glass-like structure arises.

4. The method according to claim 3 , wherein the glass-like structure is an SiO 2 structure.

5. The method according to claim 1 , wherein the hardening of the frame structure takes place before the bonding of the cover substrate on the frame structure.

6. The method according to claim 1 , wherein the adhesive of the frame structure is applied by inkjet processes, printing processes, casting, coating, spraying, extruding, spray coating, spray lacquering and/or lacquering.

7. A singulated encapsulated component, produced with a method according to claim 1 .

Assignments (1)

Continuity (1)

References Cited (33)