Method for producing an at least partly packaged semiconductor wafer

1. A method for producing an at least partially housed semiconductor wafer, comprising the steps of:

providing a semiconductor wafer which has components on an upper face;

providing a cover disc, a surface of which at least partially covers the semiconductor wafer,

functionalizing the surface of the cover disc by forming a functional layer by plasma treating the surface of the cover disc and activating the functional layer by an irradiation with light,

immediately after activating the functional layer, joining the upper face of the semiconductor wafer and the surface of the cover disc for chemical bonding of the semiconductor wafer and the cover disc by forming covalent bonds between molecules of the functional layer and the semiconductor wafer such that the cover disc forms a housing for the semiconductor wafer.

2. The method according to claim 1 , wherein the plasma treating comprises moving the surface of the cover disc beneath a plasma rod, wherein the number and speed of the movements of the cover disc beneath the plasma rod define a layer thickness of the functional layer.

3. The method according to claim 1 , wherein activating the functional layer comprises irradiation using light of a predetermined wavelength, preferably in the UV range.

4. The method according to claim 1 , wherein the process steps are carried out in a sealed process chamber, wherein the composition and pressure of a gas atmosphere can be adjusted during the activation of the functional layer and the joining of the semiconductor wafer and the cover disc.

5. The method according to claim 1 , wherein the cover disc is structured on an upper face which faces the semiconductor wafer such that individual component groups are arranged on the upper face of the semiconductor wafer in cavities on the surface of the cover disc.

6. The method according to claim 1 , wherein the semiconductor wafer is thinned from an opposite side of the upper face and can subsequently be contacted from the opposite side.

7. The method according to claim 6 , wherein individual assemblies are preferably separated by sawing, preferably along structural elements on the cover disc.

8. The method according to claim 1 , wherein the components of the semiconductor wafer are provided in the form of microelectronic or micromechanical components which are connected to electronic components, preferably high-frequency components.

9. The method according to claim 1 , wherein the cover disc is used as a carrier during rear face processing of the semiconductor wafer.