IP Library › Granted Patent US 11,952,653
Granted Patent B2
US 11,952,653 · App. 17/794,902 · Granted Apr 9, 2024

Sputtering reaction chamber and process assembly of sputtering reaction chamber

Inventors: Liren Han (Beijing, CN); Bing Li (Beijing, CN); Keke Zhao (Beijing, CN); Lixin Pei (Beijing, CN); Guodong Bian (Beijing, CN)
Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
C23C14/042C23C14/34C23C14/50C23C14/541
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Quick Facts
Patent No.
US 11,952,653
App. No.
17/794,902
Granted
Apr 9, 2024
Kind
B2
Abstract

The present disclosure provides a sputtering reaction chamber and a process assembly of the sputtering reaction chamber. The process assembly includes a liner, and the liner includes an integrally formed body member and a cover member. The cover member may extend from a bottom of the body member to an inner side of the body member and may be configured to press an edge of a to-be-processed workpiece when a process is performed. A cooling channel may be arranged in the cover member and the body member and may be configured to cool the cover member and the body member by transferring coolant. The process assembly of the sputtering reaction chamber and the sputtering reaction chamber provided by the present disclosure can reduce heat radiation of the process assembly to the to-be-processed workpiece and released gases and impurities to effectively reduce a whisker defect and improve a product yield.

Claims (50)

1. A process assembly of a sputtering reaction chamber comprising:

a liner including:

a body member being in a ring shape; and

a cover member integrally formed with the body member, extending from a bottom of the body member along a radial direction of the body member, and configured to fix a to-be-processed workpiece placed over a base when a process is performed, wherein:

a cooling channel is arranged in the cover member and the body member and includes a first cooling channel in the body member and a second cooling channel in the cover member, the first cooling channel communicating with the second cooling channel;

a deposition ring, wherein the cover member and the deposition ring cooperate with each other to form a labyrinth channel,

the deposition ring including:

a deposition member arranged radially with a bottom surface on top of the base and configured to contact with and support an outer edge of the to-be-processed workpiece,

a deposition-ring convex member arranged axially, and

a deposition-ring concave groove between the deposition-ring convex member and the deposition member;

wherein

the cover member includes a cover-member concave member in a ring shape corresponding to, and cooperating with, the deposition-ring convex member, and

the cover member further includes a cover-member convex member with an inner ring sidewall inserted into the deposition-ring concave groove to form the labyrinth channel.

2. The process assembly according to claim 1 , wherein:

the first channel is in a ring shape and is circumferentially arranged along a circumferential direction of the body member; and

the second channel extends from a bottom of the first channel to an end of the cover member along the radial direction of the cover member.

3. The process assembly according to claim 1 , further comprising:

a channel connector located at a top of the body member;

wherein the cooling channel further includes:

a third channel connected to the channel connector and communicating with the first channel to circulate in real-time to change a coolant during cooling.

4. The process assembly according to claim 3 , further comprising:

an adapter including a through-hole corresponding to the channel connector, the liner being mounted at the adapter.

5. A sputtering reaction chamber comprising:

a chamber body;

a base arranged in the chamber body; and

a process assembly including:

a liner including:

a body member being in a ring shape and arranged on an inner cider of a sidewall of the chamber body; and

a cover member integrally formed with the body member, extending from a bottom of the body member along a radial direction of the body member, and configured to fix a to-be-processed workpiece placed over the base when a process is performed, wherein:

a cooling channel is arranged in the cover member and the body member and includes a first cooling channel in the body member and a second cooling channel in the cover member, the first cooling channel communicating with the second cooling channel;

a deposition ring, wherein the cover member and the deposition ring cooperate with each other to form a labyrinth channel,

the deposition ring including:

a deposition member arranged radially with a bottom surface on top of the base and configured to contact with and support an outer edge of the to-be-processed workpiece;

a deposition-ring convex member arranged axially, and

a deposition-ring concave groove between the deposition-ring convex member and the deposition member;

wherein

the cover member includes a cover-member concave member in a ring shape corresponding to, and cooperating with, the deposition-ring convex member, and

the cover member further includes a cover-member convex member with an inner ring sidewall inserted into the deposition-ring concave groove to form the labyrinth channel.

6. The sputtering reaction chamber according to claim 5 , wherein:

the deposition ring is arranged along an outer edge of the base; and

the deposition ring cooperates with the cover member to form the labyrinth channel when the process is performed.

7. The sputtering reaction chamber according to claim 5 , wherein:

the first channel is in a ring shape and is circumferentially arranged along a circumferential direction of the body member; and

the second channel extends from a bottom of the first channel to an end of the cover member along the radial direction of the cover member.

8. The sputtering reaction chamber according to claim 5 , further comprising:

a channel connector located at a top of the body member;

wherein the cooling channel further includes:

a third channel connected to the channel connector and communicating with the first channel to circulate in real-time to change a coolant during cooling.

9. The sputtering reaction chamber according to claim 8 , further comprising:

an adapter including a through-hole corresponding to the channel connector, the liner being mounted at the adapter.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2022
From: HAN, LIREN; LI, BING; ZHAO, KEKE; PEI, LIXIN; BIAN, GUODONG
To: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
Reel/Frame 060599/0730 →
Priority Claims (1)
CN 202010073789.9 · Jan 22, 2020 · national
Continuity (1)
Related Publication 20230055006A1 · Feb 23, 2023
Cited By (1)
US 12,278,096