IP Library › Granted Patent US 12,421,437
Granted Patent B2
US 12,421,437 · App. 17/799,848 · Granted Sep 23, 2025

Thermally conductive liquid composition

Inventor: Shingo Todo (Aichi, JP)
Assignee: Fuji Polymer Industries Co., Ltd.
C09K5/14C08K13/02C08K13/04C08K2003/2227C08K2003/282C08K5/5419C08K7/18C08K2201/001C08K2201/005
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Quick Facts
Patent No.
US 12,421,437
App. No.
17/799,848
Granted
Sep 23, 2025
Kind
B2
Abstract

Provided is a thermally conductive liquid composition containing a matrix resin (A) and thermally conductive inorganic particles (B). The matrix resin (A) accounts for 2 mass % or more and 8 mass % or less and the thermally conductive inorganic particles (B) account for 92 mass % or more and 98 mass % or less relative to 100 mass % of the thermally conductive liquid composition. The thermally conductive inorganic particles (B) include thermally conductive inorganic particles (B1) of 100 μm or more and 500 μm or less and thermally conductive inorganic particles (B2) of 0.01 μm or more and less than 100 μm. In the volume-based cumulative distribution curve, the thermally conductive inorganic particles (B1) account for 25 vol % or more and 50 vol % or less and the thermally conductive inorganic particles (B2) account for 50 vol % or more and 75 vol % or less relative to 100 vol % of the thermally conductive inorganic particles (B). Thus, the thermally conductive liquid composition has improved fluidity and is smoothly extruded from a discharge orifice of a small diameter while having high thermal conductivity.

Claims (21)

1. A thermally conductive liquid composition comprising a matrix resin (A) and thermally conductive inorganic particles (B),

wherein the matrix resin (A) accounts for 2% by mass or more and 8% by mass or less and the thermally conductive inorganic particles (B) account for 92% by mass or more and 98% by mass or less relative to 100% by mass of the thermally conductive liquid composition; wherein:

the matrix resin (A) is an uncured organopolysiloxane;

the thermally conductive liquid composition comprises a plasticizer in an amount of more than 0 parts by mass and 200 parts by mass or less with respect to 100 parts by mass of the matrix resin (A);

the plasticizer is an alkoxysilane compound expressed by R a Si(OR′) 4-a , where R represents a substituted or unsubstituted organic group having 6 to 12 carbon atoms, R′ represents an alkyl group having 1 to 4 carbon atoms, and a is 0 or 1, or a partial hydrolysate of the alkoxysilane compound;

the thermally conductive inorganic particles (B) comprise thermally conductive inorganic particles (B1) with a median diameter D50 of 100 μm or more and 500 μm or less and thermally conductive inorganic particles (B2) with a median diameter D50 of 0.01 μm or more and less than 100 μm,

when the thermally conductive inorganic particles (B) are expressed in a volume-based cumulative distribution curve, the thermally conductive inorganic particles (B1) account for 25% by volume or more and 50% by volume or less and the thermally conductive inorganic particles (B2) account for 50% by volume or more and 75% by volume or less relative to 100% by volume of the thermally conductive inorganic particles (B),

the thermally conductive inorganic particles (B) are composed of at least one selected from the group consisting of aluminum oxide and aluminum nitride, and an amount of the aluminum oxide is 15 parts by mass or more and an amount of the aluminum nitride is less than 85 parts by mass with respect to 100 parts by mass of the thermally conductive inorganic particles (B),

the thermally conductive liquid composition has both viscous and elastic characteristics, and has a viscosity of 3000 Pas or more and 100000 Pas or less at 23° C. according to a rheometer, and

the thermally conductive liquid composition loaded in a syringe is extrudable in an amount of 0.1 g or more for 100 seconds from a discharge orifice 2.5 mm in diameter under a discharge pressure of 0.5 MPa at 23° C., without breakage of the syringe.

2. The thermally conductive liquid composition according to claim 1 , wherein the thermally conductive liquid composition has a thermal conductivity of 5.0 to 16.0 W/mK.

3. The thermally conductive liquid composition according to claim 1 ,

wherein the thermally conductive inorganic particles (B2) comprise thermally conductive inorganic particles (B2-1) of 0.8 μm or more and less than 10 μm and thermally conductive inorganic particles (B2-2) of 0.01 μm or more and less than 0.8 μm, and

a ratio between the thermally conductive inorganic particles (B2-1) and the thermally conductive inorganic particles (B2-2) determined by [(B2-1)/{(B2-1)+(B2-2)}]×100 is 40% by volume or more and less than 80% by volume.

4. The thermally conductive liquid composition according to claim 1 , wherein when the thermally conductive inorganic particles (B) are expressed in a volume-based frequency distribution curve, the thermally conductive inorganic particles (B) have one or more peaks in each of the following ranges: from 100 μm or more and 200 μm or less, from 0.8 μm or more and less than 10 μm, and from 0.01 μm or more and less than 0.8 μm.

5. The thermally conductive liquid composition according to claim 1 ,

wherein the thermally conductive inorganic particles (B2) further comprise thermally conductive inorganic particles (B2-3) of 10 μm or more and less than 100 μm, and

in the volume-based cumulative distribution curve, the thermally conductive inorganic particles (B2-3) account for 10% by volume or more and less than 35% by volume relative to 100% by volume of the thermally conductive inorganic particles (B).

6. The thermally conductive liquid composition according to claim 1 , wherein the thermally conductive liquid composition is in the form of a gel, putty, or grease.

7. The thermally conductive liquid composition according to claim 1 , wherein the thermally conductive liquid composition is loaded in a container.

8. The thermally conductive liquid composition according to claim 1 , wherein the thermally conductive liquid composition comprises a curing catalyst.

Assignments (2)
CHANGE OF ADDRESS Recorded Feb 6, 2023
From: FUJI POLYMER INDUSTRIES CO., LTD.
To: FUJI POLYMER INDUSTRIES CO., LTD.
Reel/Frame 062655/0927 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 15, 2022
From: TODO, SHINGO
To: FUJI POLYMER INDUSTRIES CO., LTD.
Reel/Frame 060811/0233 →
Priority Claims (1)
JP 2020-207778 · Dec 15, 2020 · national
Continuity (1)
Related Publication 20230087772A1 · Mar 23, 2023
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