Cooling system and methods
Disclosed are systems and methods for facilitating the cooling of electronic devices. In one embodiment, a cooling system includes a pump coupled to one or more gas accumulators, a heat exchanger, and a core. In some embodiments, the cooling system further includes a cover coupled to the core with an interference fit, which can be (for example) a thermal fitting. In certain embodiments, the core includes surface channels for transporting a working fluid. In one embodiment, the cover is configured to cover the surface channels. In some embodiments, the gas collectors, pump, and heat exchanger are mounted on a surface of the core that is opposite to a surface of the core covered by the cover.
1. A cooling system comprising:
a pump;
a first gas accumulator in fluid communication with the pump via a fluid circuit;
a second gas accumulator in fluid communication with the pump via the fluid circuit;
a heat exchanger in fluid communication with the pump via the fluid circuit;
a core in fluid communication with the pump via the fluid circuit; and
a cover coupled to the core by a thermal fitting.
2. The cooling system of claim 1 , wherein the pump comprises an electro-osmotic (EO) pump.
3. The cooling system of claim 1 , wherein the EO pump is configured to receive DC current.
4. The cooling system of claim 1 , wherein the first gas accumulator is coupled to the pump with an interference fit.
5. The cooling system of claim 4 , wherein the interference fit comprises a thermal fitting.
6. The cooling system of claim 1 , wherein the first gas accumulator is coupled to the core with an interference fit.
7. The cooling system of claim 6 , wherein the interference fit comprises a thermal fitting.
8. The cooling system of claim 1 , wherein the heat exchanger is coupled to the pump with an interference fit.
9. The cooling system of claim 8 , wherein the interference fit comprises a thermal fitting.
10. The cooling system of claim 1 , wherein the second gas accumulator is coupled to the heat exchanger with an interference fit.
11. The cooling system of claim 10 , wherein the interference fit comprises a thermal fitting.
12. The cooling system of claim 1 , wherein the second gas accumulator is coupled to the core with an interference fit.
13. The cooling system of claim 12 , wherein the interference fit comprises a thermal fitting.
14. The cooling system of claim 1 , wherein the cover covers a first surface of the core, and wherein the pump, first gas accumulator, second gas accumulator, and heat exchanger are mounted on a second surface of the core, said first surface and said second surface being opposite to each other.
15. The cooling system of claim 1 , wherein the first gas accumulator is placed upstream from the pump, and wherein the second gas accumulator is placed downstream from the pump.
16. The cooling system of claim 1 , wherein the core comprises a metal core printed circuit board.
17. The cooling system of claim 1 , wherein the first gas accumulator is coupled to a fluid outlet of the plurality of fluid channels.
18. The cooling system of claim 1 , wherein the second gas accumulator is coupled to a fluid inlet of the plurality of fluid channels.
19. The cooling system of claim 1 , wherein the core comprises surface channels, and wherein the cover is configured to cover said surface channels.