Interface card cooling using heat pipes
A device may have: a frame section having a cage with a first receiving portion and a second receiving portion, the second receiving portion receiving a module; a first plate having an end, the first plate being received by the first receiving portion; a heat pipe having a first end attached to the end of the first plate and having a second end; a second plate attached to the second end of the heat pipe; and a spring attached to the first plate to bias the first plate against the module, the first plate being capable of receiving heat dissipated by the module, the heat pipe being capable of receiving the heat received by the first plate and transferring the heat to the second plate, the second plate receiving the heat transferred by the heat pipe and dissipating the received heat.
1. A device comprising:
a frame section having a cage with a first receiving portion and a second receiving portion,
the second receiving portion receiving a module;
a first plate having an end,
the first plate being received by the first receiving portion to attach the first plate to the frame section, the first plate having a groove;
a heat pipe having a first end and having a second end;
a second plate attached to the second end of the heat pipe;
a cover attaching the first plate, the heat pipe, and the second plate to the frame section; and
a spring attached to the first plate and disposed between the first plate and the cover to bias the first plate against the module, the groove exposing part of the heat pipe including the first end, said exposed part of the heat pipe extending in a direction toward the second end of the heat pipe and contacting the spring, the groove having a closed portion adjacent the first end of the heat pipe and an open portion at a location spaced from the first end, such that the heat pipe extends through the open portion in the direction toward the second end, a portion of the heat pipe extending from the open portion to the second end being provided in the groove,
the first plate being capable of receiving heat dissipated by the module,
the heat pipe being capable of receiving the heat received by the first plate and transferring the heat to the second plate,
the second plate being capable of receiving the heat transferred by the heat pipe and dissipating the received heat.
2. The device of claim 1 further comprising: the module,
the module being a transceiver module, a small form-factor pluggable (SFP) module, an SFP enhance (SFP+) module, a Centum form-factor pluggable (CFP) module, an CFP2 module, or a XENPACK form-factor pluggable (XFP) module,
the module having a laser, a driver, a serializer/deseralizer, a photodiode, or an amplifier.
3. The device of claim 1 , where the heat pipe includes a mixture including air and water or is made from a flexible conductive material.
4. The device of claim 1 , further comprising:
a first plurality of fins provided on the first plate, the first plurality of fins including a cutout portion to receive and confine the spring; and
a second plurality of fins provided on the second plate.
5. The device of claim 1 , wherein the groove is a first groove, the device further comprising:
a second groove provided on the second plate to receive the second end of the heat pipe.
6. The device of claim 1 , further comprising a groove provided on the second plate to receive the heat pipe.
7. The device of claim 1 , further comprising:
a plurality of cages to receive respective modules, the plurality of cages including the cage;
a plurality of first plates including the first plate, each of the plurality of first plates being received by a respective one of the plurality of cages; and
a plurality of heat pipes including the heat pipe, each of the plurality of heat pipes being attached to a respective one of the plurality of first plates,
each of the plurality of first plates and each of the plurality of heat pipes being attached to the second plate.
8. A device comprising:
an interface card having:
a frame section having a cage with a first receiving portion and a second receiving portion,
the second receiving portion receiving a module;
a first plate having an end,
the first plate being received by the first receiving portion to attach the first plate to the frame section, the first plate having a groove;
a heat pipe having a first end and having a second end;
a second plate attached to the second end of the heat pipe; and
a spring attached to the first plate to bias the first plate against the module,
the first plate being capable of receiving heat dissipated by the module, the groove exposing part of the heat pipe including the first end, said exposed part of the heat pipe extending in a direction toward the second end of the heat pipe and contacting the spring, the groove having a closed portion adjacent the first end of the heat pipe and an open portion at a location spaced from the first end, such that the heat pipe extends through the open portion in the direction toward the second end, a portion of the heat pipe extending from the open portion to the second end being provided in the groove,
the heat pipe being capable of receiving the heat received by the first plate and transferring the heat to the second plate,
the second plate being capable of receiving the heat transferred by the heat pipe and dissipating the received heat.
9. The device of claim 8 , further comprising the module,
the module being a transceiver module, a small form-factor pluggable (SFP) module, an SFP enhance (SFP+) module, a Centum form-factor pluggable (CFP) module, an CFP2 module, or a XENPACK form-factor pluggable (XFP) module,
the module having a laser, a driver, a serializer/deseralizer, a photodiode, or an amplifier.
10. The device of claim 8 , where the heat pipe includes an air/water mixture or is made from a flexible conductive material.
11. The device of claim 8 , further comprising:
a first plurality of fins provided on the first plate, the first plurality of fins including a cutout portion to receive and confine the spring; and
a second plurality of fins provided on the second plate.
12. The device of claim 8 , wherein the groove is a first groove, the device further comprising:
a second groove provided on the second plate to receive the second end of the heat pipe.
13. The device of claim 8 , further comprising:
a plurality of cages to receive respective modules, the plurality of cages including the cage;
a plurality of first plates including the first plate, each of the plurality of first plates being received by a respective one of the plurality of cages; and
a plurality of heat pipes including the heat pipe, each of the plurality of heat pipes being attached to a respective one of the plurality of first plates,
each of the plurality of first plates and each of the plurality of heat pipes being attached to the second plate.
14. A device comprising:
a frame section having a cage with a first receiving portion and a second receiving portion,
the second receiving portion receiving a module;
a first plate having an end,
the first plate being received by the first receiving portion to attach the first plate to the frame section, the first plate having a groove;
a flexible heat pipe having a first end attached to the end of the first plate and having a second end, the groove exposing part of the flexible heat including the first end, said exposed part of the heat pipe extending in a direction toward the second end of the heat pipe and contacting the spring, the groove having a closed portion adjacent the first end of the heat pipe and an open portion at a location spaced from the first end, such that the heat pipe extends through the open portion in the direction toward the second end of the heat pipe, a portion of the heat pipe extending from the open portion to the second end being provided in the groove,
a second plate attached to the second end of the flexible heat pipe; and
a spring attached to the first plate to bias the first plate against the module,
the first plate being capable of receiving heat dissipated by the module,
the flexible heat pipe being capable of receiving the heat received by the first plate and transferring the heat to the second plate,
the second plate being capable of receiving the heat transferred by the flexible heat pipe and dissipating the received heat.
15. The device of claim 14 , further comprising the module,
the module being a transceiver module, a small form-factor pluggable (SFP) module, an SFP enhance (SFP+) module, a Centum form-factor pluggable (CFP) module, an CFP2 module, or a XENPACK form-factor pluggable (XFP) module,
the module having a laser, a driver, a serializer/deseralizer, a photodiode, or an amplifier.
16. The device of claim 14 , further comprising a cover attaching the first plate, the flexible heat pipe, and the second plate to the frame section,
the spring being disposed between the first plate and the cover.
17. The device of claim 14 , where the flexible heat pipe includes a mixture including air and water.
18. The device of claim 14 , further comprising:
a first plurality of fins provided on the first plate, the first plurality of fins including a cutout portion to receive and confine the spring; and
a second plurality of fins provided on the second plate.
19. The device of claim 14 , wherein the groove is a first groove, the device further comprising:
a second groove provided on the second plate to receive the second end of the flexible heat pipe.
20. The device of claim 14 , further comprising:
a plurality of cages to receive respective modules, the plurality of cages including the cage;
a plurality of first plates including the first plate, each of the plurality of first plates being received by a respective one of the plurality of cages; and
a plurality of flexible heat pipes, the flexible heat pipe being one of the plurality of flexible heat pipes, each of the plurality of flexible heat pipes being attached to a respective one of the plurality of first plates,
each of the plurality of first plates and each of the plurality of heat pipes being attached to the second plate.