Heat sink apparatus for an interface module
Embodiments described herein relate to apparatuses for reducing the effect of oscillations of a heat sink. A heat sink apparatus is provided for use with an interface module comprising a cage configured to receive a pluggable signal connector, wherein the cage comprises a first surface configured to couple to a circuit board. The heat sink apparatus comprises a heat sink, wherein the heat sink comprises: a first portion configured to couple into thermal contact with a second surface of the cage; a second portion, wherein the second portion is configured to extend beyond at least one of the dimensions of the cage in a plane parallel to the circuit board; a dampener coupled to the second portion of the heat sink, wherein the dampener is configured to dampen oscillations of the second portion in a direction perpendicular to the plane of the circuit board, and a first coupler coupled to the second portion of the heat sink for providing physical coupling between the heat sink and a second coupler on the circuit board during oscillations of the second portion in directions parallel to the plane of the circuit board.
1 . A heat sink apparatus for use with an interface module comprising a cage configured to receive a pluggable signal connector, wherein the cage comprises a first surface configured to couple to a circuit board, the heat sink apparatus comprising:
a heat sink, wherein the heat sink comprises:
a first portion configured to couple into thermal contact with a second surface of the cage;
a second portion, wherein the second portion is configured to extend beyond at least one of dimensions of the cage in a plane parallel to the circuit board;
a dampener coupled to the second portion of the heat sink, wherein the dampener is configured to dampen oscillations of the second portion in a direction perpendicular to a plane of the circuit board, and
a first coupler coupled to the second portion of the heat sink for providing physical coupling between the heat sink and a second coupler in or on the circuit board during the oscillations of the second portion in a direction parallel to the plane of the circuit board, wherein an engagement of the first coupler and the second coupler is configured to allow movement between the second portion of the heat sink in a direction perpendicular to the plane of the circuit board, and wherein the engagement of the first coupler and the second coupler is configured to restrict relative movement between the heat sink and the circuit board in the direction parallel to the plane of the circuit board.
2 . The heat sink apparatus according to claim 1 , wherein the dampener is coupled to a first surface of the second portion for positioning between the circuit board and the heat sink, wherein the first surface of the second portion is at least partially covered by the dampener.
3 . The heat sink apparatus according to claim 2 , wherein the dampener comprises a plurality of layers, and wherein the plurality of layers are coupled to the first surface of the second portion such that one or more air channels are formed by the plurality of layers.
4 . The heat sink apparatus according to claim 1 wherein the dampener is formed from a deformable material.
5 . The heat sink apparatus according to claim 1 , wherein:
the first coupler comprises a first protrusion extending from the second portion of the heat sink, and the second coupler comprises a first opening in either the circuit board or in a first element coupled to the circuit board that is configured to engage with the first protrusion; or
the first coupler comprises a second opening within either the second portion of the heat sink or in a second element coupled to the second portion, and the second coupler comprises a second protrusion extending from the circuit board that is configured to engage with the second opening.
6 . The heat sink apparatus according to claim 5 , wherein the first protrusion or the second protrusion is formed from a dampening material configured to dampen the oscillations of the second portion in the direction parallel to the plane of the circuit board.
7 . The heat sink apparatus according to claim 1 , wherein the dampener and the first coupler are formed from a same piece of material.
8 . A system comprising:
the heat sink apparatus according to claim 1 ,
the interface module and the circuit board.
9 . A system comprising:
an interface module, comprising:
a cage for receipt of a pluggable signal connector, wherein a first surface of the cage is configured to be coupled to a circuit board; and
a heat sink apparatus comprising:
a heat sink, wherein a first portion of the heat sink is in thermal contact with a second surface of the cage, and a second portion of the heat sink extends beyond at least one of dimensions of the cage in a plane parallel to the circuit board;
a dampener coupled to the second portion of the heat sink to dampen oscillations of the second portion in a direction perpendicular to the circuit board; and
a first coupler coupled to the second portion of the heat sink for providing physical coupling between the heat sink and a second coupler in or on the circuit board during oscillations of the second portion in a direction parallel to a plane of the circuit board, wherein an engagement of the first coupler and the second coupler is configured to allow movement between the second portion of the heat sink in a direction perpendicular to the plane of the circuit board, and wherein the engagement of the first coupler and the second coupler is configured to restrict relative movement between the heat sink and the circuit board in the direction parallel to the plane of the circuit board.
10 . The system according to claim 9 , wherein the dampener is coupled to a first surface of the second portion for positioning between the circuit board and the heat sink, wherein the first surface of the second portion is at least partially covered by the dampener.
11 . The system according to claim 10 , wherein the dampener comprises a plurality of layers, and wherein the plurality of layers are coupled to the first surface of the second portion such that one or more air channels are formed by the plurality of layers.
12 . The system according to claim 9 , wherein the dampener is formed from a deformable material.
13 . The system according to claim 9 , wherein:
the first coupler comprises a first protrusion extending from the second portion of the heat sink, and the second coupler comprises a first opening in either the circuit board or in a first element coupled to the circuit board that is configured to engage with the first protrusion; or
the first coupler comprises a second opening within either the second portion of the heat sink or in a second element coupled to the second portion, and the second coupler comprises a second protrusion extending from the circuit board that is configured to engage with the second opening.
14 . The system according to claim 13 , wherein the first protrusion or the second protrusion is formed from a dampening material configured to dampen the oscillations of the second portion in the direction parallel to the plane of the circuit board.
15 . The system according to claim 9 , wherein the dampener and the first coupler are formed from a same piece of material.