Heatsink for pluggable optical devices for the prevention of heatsink clip deformation
A heatsink for pluggable optical devices that incorporates features to limit the travel and deformation of the mating/mated spring clip that holds the heatsink to the cage of a pluggable optical device. The heatsink bearing surface takes the shape and contour of the leaf spring portion of the spring clip, thereby contacting and supporting it well before it plastically yields and permanently deforms. The shape of this feature, which may be coupled to or integrally formed with the heatsink bearing surface, can match exactly the shape of the spring clip or approximate the shape using a curved, variable, or other easier to manufacture profile, as long as the associated protrusions extend up into the corners of the leaf spring portion of the spring clip. This feature effectively acts as a hard stop and prevents the spring clip from being compromised due to improper handling or installation.
1. A heatsink assembly, comprising:
a heatsink surface comprising a first surface adapted to thermally contact an adjacent pluggable optical device and a second surface adapted to receive a biasing force from a spring clip having a leaf spring including a center portion that contacts the second surface and one or more biasing portions that are spaced apart from the second surface forming one or more gaps therebetween, wherein the biasing force biases the heatsink surface into the adjacent pluggable optical device; and
one or more protruding structures disposed on the second surface and adapted to fill all or a portion of the one or more gaps formed between the second surface and the one or more biasing portions of the leaf spring of the spring clip,
wherein a local contour of the second surface is adapted to conform to a contour of the center portion and the one or more protruding structures include one of a curved and variable shape, the one of the curved and variable shape conforming to a contour of the one or more biasing portions adjacent to the center portion, such that the second surface includes a matching shape with the center portion and the one or more biasing portions where the second surface contacts and supports the one or more biasing portions during deformation of the spring clip.
2. The heatsink assembly of claim 1 , wherein the one or more protruding structures are coupled to the second surface.
3. The heatsink assembly of claim 1 , wherein the one or more protruding structures are integrally formed with the second surface.
4. The heatsink assembly of claim 1 , wherein the one or more protruding structures comprise one or more opposed ramp structures.
5. The heatsink assembly of claim 1 , further comprising a plurality of fin structures coupled to the second surface and disposed adjacent to the one or more protruding structures.
6. The heatsink assembly of claim 1 , further comprising a plurality of fin structures coupled to the first surface.
7. A circuit pack assembly, comprising:
a cage adapted to receive a pluggable optical device therein, wherein the cage defines an opening therethrough;
a heatsink assembly; and
a spring clip adapted to couple the heatsink assembly to the cage;
wherein the heatsink assembly comprises a heatsink surface comprising a first surface adapted to thermally contact the pluggable optical device through the opening defined through the cage and a second surface adapted to receive a biasing force from the spring clip comprising a leaf spring comprising a center portion that contacts the second surface and one or more biasing portions that are spaced apart from the second surface forming one or more gaps therebetween, wherein the biasing force biases the heatsink surface into the pluggable optical device through the opening defined through the cage; and
wherein the heatsink assembly comprises one or more protruding structures disposed on the second surface and adapted to fill all or a portion of the one or more gaps formed between the second surface and the one or more biasing portions of the leaf spring of the spring clip,
wherein a local contour of the second surface conforms to a contour of the center portion and the one or more protruding structures include one of a curved and variable shape, the one of the curved and variable shape conforming to a contour of the one or more biasing portions adjacent to the center portion, such that the second surface includes a matching shape with the center portion and the one or more biasing portions where the second surface contacts and supports the one or more biasing portions during deformation of the spring clip.
8. The circuit pack assembly of claim 7 , wherein the one or more protruding structures are coupled to the second surface.
9. The circuit pack assembly of claim 7 , wherein the one or more protruding structures are integrally formed with the second surface.
10. The circuit pack assembly of claim 7 , wherein the one or more protruding structures comprise one or more opposed ramp structures.
11. The circuit pack assembly of claim 7 , wherein the heatsink assembly further comprises a plurality of fin structures coupled to the second surface and disposed adjacent to the one or more protruding structures.
12. The circuit pack assembly of claim 7 , wherein the heatsink assembly further comprises a plurality of fin structures coupled to the first surface.
13. A method for providing a heatsink assembly, comprising:
providing a heatsink surface comprising a first surface adapted to thermally contact an adjacent pluggable optical device and a second surface adapted to receive a biasing force from a spring clip having a leaf spring including a center portion that contacts the second surface and one or more biasing portions that are spaced apart from the second surface forming one or more gaps therebetween, wherein the biasing force biases the heatsink surface into the adjacent pluggable optical device; and
disposing one or more protruding structures on the second surface and adapted to fill all or a portion of the one or more gaps formed between the second surface and the one or more biasing portions of the leaf spring of the spring clip,
wherein a local contour of the second surface conforms to a contour of the center portion and the one or more protruding structures include one of a curved and variable shape, the one of the curved and variable shape conforming to a contour of the one or more biasing portions adjacent to the center portion, such that the second surface includes a matching shape with the center portion and the one or more biasing portions where the second surface contacts and supports the one or more biasing portions during deformation of the spring clip.
14. The method of claim 13 , wherein the one or more protruding structures are coupled to the second surface.
15. The method of claim 13 , wherein the one or more protruding structures are integrally formed with the second surface.
16. The method of claim 13 , wherein the one or more protruding structures comprise one or more opposed ramp structures.
17. The method of claim 13 , further comprising providing a plurality of fin structures coupled to one or more of the first surface and the second surface adjacent to the one or more protruding structures.