Load distributing frame for heat sink applications
A sprung frame assembly that can accommodate varying tolerance device heights while still exerting sufficient pressure/force required to a heatsink to contact and cool a bare die device, or other device of the like. Adapted for space constrained modules where placement of mounting holes is limited, and module density is high. Sprung frames are secured to mounting points at available locations on support structures as to eliminate any mounting holes in the PCB. The required force/pressure can be evenly achieved by methodically tightening a plurality of screws with springs at the corners of the sprung frames in sequence, pressure is applied evenly without damaging the device, while also taking up any tolerances in the device height.
1. A module comprising:
a printed circuit board (PCB);
a device requiring a heatsink disposed on the PCB; and
a support structure coupled to the PCB, wherein the support structure defines a plurality of mounting points located along the support structure on a side facing the device, wherein the plurality of mounting points receive a plurality of screws and springs that secure at least one frame to the support structure, and wherein the at least one frame is used to apply pressure to the heat sink and compress the heat sink onto the device.
2. The module of claim 1 , wherein the plurality of screws and springs are secured to the plurality of mounting points defined by the support structure such that force from the springs is transmitted to the device via the at least one frame.
3. The module of claim 1 , wherein the at least one frame comprises
a first sprung frame secured to the support structure, wherein the first sprung frame compresses the heat sink onto the device; and
a second sprung frame secured to the support structure, wherein the second sprung frame supports the PCB on the opposite side of the first sprung frame, and wherein the PCB requires no holes for mounting of the first sprung frame and the second sprung frame.
4. The module of claim 3 , wherein the plurality of mounting points are located on the support structure such that a pressure applied by the first sprung frame and the second sprung frame is uniform and such that a plurality of elongated members of the first sprung frame and the second sprung frame are as short as possible to increase rigidity.
5. The module of claim 1 , wherein the plurality of mounting points are located on the support structure such that a height tolerance of the device on the PCB is accommodated.
6. The module of claim 1 , wherein the plurality of mounting points are located on the support structure spaced apart from the PCB to allow for higher density routing and clearance for taller components mounted on the PCB.
7. The module of claim 1 , wherein the PCB is disposed in one of a networking module, a computing module, and a storage module.
8. The module of claim 1 , wherein the support structure serves as an insertion structure for the module.
9. A module comprising:
a printed circuit board (PCB);
a device requiring a heatsink disposed on the PCB; and
a plurality of mounting points disposed adjacent to the PCB, wherein the plurality of mounting points are defined in and located along a support structure coupled to the PCB and receive a plurality of screws and springs that secure at least one frame to the support structure, and wherein the at least one frame is used to apply pressure to the heat sink and compress the heat sink onto the device.
10. The module of claim 9 , wherein the plurality of mounting points extend from the support structure.
11. The module of claim 9 , wherein the plurality of screws and springs are secured to the plurality of mounting points defined by the support structure such that force from the springs is transmitted to the device via the at least one frame.
12. The module of claim 9 , wherein the at least one frame comprises
a first sprung frame secured to the plurality of mounting points, wherein the first sprung frame compresses the heat sink onto the device; and
a second sprung frame secured to the plurality of mounting points, wherein the second sprung frame supports the PCB on the opposite side of the first sprung frame, and wherein the PCB requires no holes for mounting of the first sprung frame and the second sprung frame.
13. The module of claim 12 , wherein the plurality of mounting points are located such that a pressure applied by the first sprung frame and the second sprung frame is uniform and such that a plurality of elongated members of the first sprung frame and the second sprung frame are as short as possible to increase rigidity.
14. The module of claim 9 , wherein the plurality of mounting points are located such that a height tolerance of the device on the PCB is accommodated.
15. The module of claim 9 , wherein the plurality of mounting points are located spaced apart from the PCB to allow for higher density routing and clearance for taller components mounted on the PCB.
16. The module of claim 9 , wherein the PCB is disposed in one of a networking module, a computing module, and a storage module.
17. The module of claim 9 , wherein the support structure serves as an insertion structure for the module.
18. A method comprising:
providing a printed circuit board (PCB);
providing a device requiring a heatsink disposed on the PCB; and
securing at least one frame used to apply pressure to the heat sink and compress the heat sink onto the device to a plurality of mounting points disposed adjacent to the PCB, wherein the plurality of mounting points are defined in and located along a support structure coupled to the PCB, and wherein the plurality of mounting points receive a plurality of screws and springs that secure the at least one frame to the support structure.