Method and material for attaching a chip to a submount
A die attachment material may include an ultra-violet (UV) curable resin and silver particles to attach a chip to a submount, where the silver particles are positioned within the UV curable resin. A method may include heating the die attachment material to obtain the UV curable resin on sintered silver particles, where at least a portion of the die attachment material is position between a chip and a submount. The method may further include irradiating, with UV light, the UV curable resin to obtain a polymer on the sintered silver particles. The polymer may form a layer on the sintered silver particles.
1. A method, comprising:
heating a material including silver particles within an ultra-violet (UV) curable resin to obtain the UV curable resin on sintered silver particles without curing the UV curable resin,
wherein the silver particles are un-sintered prior to the heating,
wherein, based at least in part on the heating, at least a portion of the UV curable resin is pushed toward a lateral exterior surface of the material during the heating, and
wherein at least a portion of the material is positioned between a chip and a submount; and
irradiating, with UV light, the UV curable resin to cure the UV curable resin and obtain a polymer on the sintered silver particles.
2. The method of claim 1 , wherein heating the material comprises sintering the silver particles within the UV curable resin.
3. The method of claim 1 , wherein irradiating the UV curable resin comprises at least one of irradiating the UV curable resin for a continuous exposure period or irradiating the UV curable resin with pulses of the UV light.
4. The method of claim 1 , further comprising:
applying the material to at least one of the submount or the chip; and
positioning the chip on the submount.
5. The method of claim 1 , further comprising:
before irradiating the UV curable resin, cooling the UV curable resin on the sintered silver particles.
6. The method of claim 1 , wherein the sintered silver particles are sintered within the UV curable resin.
7. The method of claim 1 , wherein a portion of the polymer forms a layer on the lateral exterior surface of the sintered silver particles.
8. The method of claim 7 , wherein the layer is between 0.1 and 10 microns thick.
9. The method of claim 7 , wherein the layer is connected to a portion of one or more side surfaces of the chip and a top surface of the submount.
10. A method, comprising:
placing a material between a chip and a submount,
the material including un-sintered silver particles and an ultra-violet (UV) curable resin;
heating the material to sinter the un-sintered silver particles within the UV curable resin to produce sintered silver particles without curing the UV curable resin,
wherein, based at least in part on the heating, at least a portion of the UV curable resin is pushed toward a lateral exterior surface of the material during the heating; and
irradiating, with UV light, the UV curable resin to cure the UV curable resin and produce a polymer on the sintered silver particles.
11. The method of claim 10 , wherein irradiating the UV curable resin comprises at least one of irradiating the UV curable resin for a continuous exposure period or irradiating the UV curable resin with pulses of the UV light.
12. The method of claim 10 , further comprising:
before irradiating the UV curable resin, cooling the UV curable resin on the sintered silver particles.
13. The method of claim 10 , wherein the sintered silver particles have a density of 10.49 grams/centimeter 3 , and
wherein the UV curable resin has a density of 1.00 grams/centimeter 3 .
14. The method of claim 10 , wherein the sintered silver particles are formed from at least one of microparticles or nanoparticles.
15. The method of claim 10 , wherein the UV curable resin comprises at least one of an epoxy-based resin, an acrylate-based resin, or a silicone-based resin.
16. The method of claim 10 , wherein a ratio, by weight, of the UV curable resin to silver particles is between 0.05 and 1, and
the ratio is selected such that, when cured, a layer of the polymer on the sintered silver particles has a thickness in a range from 0.1 microns to 10 microns.
17. The method of claim 10 , wherein sintering the un-sintered silver particles within the UV curable resin further pushes the UV curable resin toward the lateral exterior surface of the material to produce a layer of the UV curable resin on the sintered silver particles.
18. The method of claim 17 , wherein the layer is between 0.1 and 10 microns thick.
19. The method of claim 17 , wherein the layer is connected to a portion of one or more side surfaces of the chip and a top surface of the submount.
20. A method, comprising:
heating a material including silver particles within an ultra-violet (UV) curable resin to obtain the UV curable resin on sintered silver particles without curing the UV curable resin,
wherein at least a portion of the material is positioned between a chip and a submount,
wherein, based at least in part on the heating, at least a portion of the UV curable resin is pushed toward a lateral exterior surface of the material during the heating to produce a layer of the UV curable resin on the sintered silver particles;
cooling the UV curable resin on the sintered silver particles; and
irradiating, with UV light and after the cooling, the UV curable resin to cure the UV curable resin and obtain a polymer on the sintered silver particles.