Method and material for attaching a chip to a submount
A die attachment material may include an ultra-violet (UV) curable resin and silver particles to attach a chip to a submount, where the silver particles are positioned within the UV curable resin. A method may include heating the die attachment material to obtain the UV curable resin on sintered silver particles, where at least a portion of the die attachment material is position between a chip and a submount. The method may further include irradiating, with UV light, the UV curable resin to obtain a polymer on the sintered silver particles. The polymer may form a layer on the sintered silver particles.
1. A device, comprising:
a submount;
a material including sintered silver particles within a polymer,
wherein the polymer is formed by curing an ultra-violet (UV) curable resin on the sintered silver particles,
wherein the sintered silver particles are sintered within the UV curable resin, and
wherein a portion of the polymer forms a layer on an exterior surface of the sintered silver particles,
the layer having a thickness between 0.1 and 10 microns; and
a chip attached to the submount by the material,
wherein the layer is connected to a portion of one or more side surfaces of the chip and a top surface of the submount.
2. The device of claim 1 , wherein the chip comprises at least one of an optical device or an integrated circuit.
3. The device of claim 1 , wherein the sintered silver particles have a density of 10.49 grams/centimeter 3 , and
wherein the UV curable resin has a density of 1.00 grams/centimeter 3 .
4. The device of claim 1 , wherein the sintered silver particles are formed from at least one of microparticles or nanoparticles.
5. The device of claim 1 , wherein the UV curable resin comprises at least one of an epoxy-based resin, an acrylate-based resin, or a silicone-based resin.
6. The device of claim 1 , wherein the UV curable resin comprises a filler.
7. The device of claim 1 , wherein a ratio, by weight, of the UV curable resin to the sintered silver particles is in a range from 0.05 to 1.
8. A die attachment material, comprising:
an ultra-violet (UV) curable resin; and
silver particles to attach a chip to a submount,
wherein the silver particles are un-sintered and positioned within the UV curable resin, and
wherein a ratio, by weight, of the UV curable resin to the silver particles is between 0.05 and 1, and
the ratio is selected such that, when cured, a layer of polymer on sintered silver particles has a thickness in a range from 0.1 microns to 10 microns.
9. The die attachment material of claim 8 , wherein the silver particles have a density of 10.49 grams/centimeter 3 , and
wherein the UV curable resin has a density of 1.00 grams/centimeter 3 .
10. The die attachment material of claim 8 , wherein the silver particles comprise at least one of microparticles or nanoparticles.
11. The die attachment material of claim 8 , wherein the UV curable resin comprises at least one of an epoxy-based resin, an acrylate-based resin, or a silicone-based resin.
12. The die attachment material of claim 8 , wherein the UV curable resin comprises a filler.
13. A device, comprising:
a submount; and
a die attachment material,
wherein the die attachment material includes a polymer comprising sintered silver particles within a cured ultra-violet (UV) curable resin,
wherein the die attachment material attaches a chip to the submount, and
wherein a layer of the polymer, consisting of the cured UV curable resin, has an exterior surface connecting a portion of one or more side surfaces of the chip to a top surface of the submount,
the layer having a thickness in a range from 0.1 microns to 10 microns.
14. The device of claim 13 , wherein the sintered silver particles have a density of 10.49 grams/centimeter 3 , and
wherein the UV curable resin has a density of 1.00 grams/centimeter 3 .
15. The device of claim 13 , wherein the sintered silver particles are formed from at least one of microparticles or nanoparticles.
16. The device of claim 13 , wherein the UV curable resin comprises at least one of an epoxy-based resin, an acrylate-based resin, or a silicone-based resin.
17. The device of claim 13 , wherein the UV curable resin comprises a filler.
18. The device of claim 13 , wherein a ratio, by weight, of the UV curable resin to the sintered silver particles is in a range from 0.05 to 1.