Substrate cleaning device, substrate processing apparatus, break-in device, method for estimating number of fine particles adhering to substrate, method for determining degree of contamination of substrate cleaning member, and method for determining break-in processing
According to one embodiment of the present disclosure, provided is a substrate cleaning device including: a substrate holder configured to hold a substrate; a substrate cleaning member configured to come into sliding contact with the held substrate, and clean the substrate using a first cleaning liquid supplied from a first nozzle; a self-cleaning member configured to come into sliding contact with the substrate cleaning member at a retreat position separated from the substrate holder, and performs self-cleaning on the substrate cleaning member using a second cleaning liquid supplied from a second nozzle; a measurement module configured to measure a physical property value of a waste liquid of the second cleaning liquid used for the self-cleaning of the substrate cleaning member; and a controller configured to estimate a number of fine particles adhering to the cleaned substrate based on the physical property value of the waste liquid.
1. A substrate cleaning device comprising:
a substrate holder configured to hold a substrate;
a substrate cleaning member configured to come into sliding contact with the held substrate, and clean the substrate using a first cleaning liquid supplied from a first nozzle;
a self-cleaning member configured to come into sliding contact with the substrate cleaning member at a retreat position separated from the substrate holder, and perform self-cleaning on the substrate cleaning member using a second cleaning liquid supplied from a second nozzle;
a measurement module configured to measure a physical property value of a waste liquid of the second cleaning liquid used for the self-cleaning of the substrate cleaning member; and
a controller configured to estimate a number of fine particles adhering to the cleaned substrate based on the physical property value of the waste liquid;
a first pipe configured to guide the waste liquid of the second cleaning liquid used for the self-cleaning of the substrate cleaning member to the measurement module;
a three-way valve provided in the first pipe; and
a second pipe configured to supply flushing water to the measurement module via the three-way valve.
2. The substrate cleaning device according to claim 1 , wherein the physical property value includes at least one of a number of fine particles, a pH value, an electrical conductivity, and a total organic carbon concentration.
3. The substrate cleaning device according to claim 1 , wherein the controller determines an operating condition for self-cleaning based on the physical property value of the waste liquid.
4. The substrate cleaning device according to claim 1 , wherein the controller determines an operating condition for substrate cleaning based on the physical property value of the waste liquid.
5. The substrate cleaning device according to claim 1 , wherein the controller determines a timing to replace the substrate cleaning member based on the physical property value of the waste liquid.
6. A substrate processing apparatus comprising:
a substrate polishing device that polishes a substrate, using a suspension; and
the substrate cleaning device according claim 1 .