Method for manufacturing ultra-thin glass, ultra-thin glass, and display device including the ultra-thin glass
Disclosed is a method for manufacturing ultra-thin glass. The method includes: patterning, on a mother glass substrate comprising a plurality of display cells and a dummy area surrounding the display cells, a cutting line having a shape corresponding to the display cells; forming a mother glass protective film on the mother glass substrate; forming a through-hole which corresponds to the cutting line by etching the mother glass substrate; and cutting bridges which are formed by the mother glass substrate and connect the through-holes.
1. A method for manufacturing ultra-thin glass, the method comprising:
patterning a plurality of display cells on a first glass substrate;
patterning a dummy area adjacent to the display cells on the first glass substrate;
forming a plurality of cutting lines, including each of the plurality of cutting lines defining each of the plurality of display cells, each of the plurality of cutting lines having a closed-loop shape surrounding each of the plurality of display cells and the plurality of cutting lines comprising a plurality of patterns arranged in the closed-loop shape and spaced apart from each other;
forming a protective film on the first glass substrate;
forming a plurality of through-holes at the plurality of patterns of the plurality of cutting lines, including forming a plurality of bridges between the plurality of through-holes, each of the plurality of bridges including a glass member that extends from one through hole to another through hole of the plurality of through holes; and
cutting the plurality of bridges, including separating each of the plurality of display cells from each other and forming portions of the plurality of bridges that protrude from at least one side of each of the plurality of display cells.
2. The method of claim 1 , wherein the forming the protective film on the first glass substate comprises:
laminating an acid-resistant film on at least a portion of the dummy area of the first glass substrate or coating or depositing an acid-resistant solution in at least a portion of the dummy area of the first glass substrate.
3. The method of claim 2 , wherein the forming the plurality of through-holes comprises:
etching the first glass substrate,
wherein an area where the protective film is not formed is eroded by the etching of the first glass substrate and has a first thickness after the etching of the first glass substrate, and
wherein another area where the protective film is formed is not eroded and has a second thickness larger than the first thickness after the etching of the first glass substrate.
4. The method of claim 3 , wherein the first thickness is 20 um to 100 um, and the second thickness is 70 um to 1.3 mm.
5. The method of claim 1 , further comprising strengthening the first glass substrate after the forming the plurality of through-holes.