IP Library Granted Patent US 12,291,456
Granted Patent B2
US 12,291,456 · App. 17/844,041 · Granted May 6, 2025

High purity SiOC and SiC, methods compositions and applications

Inventors: Douglas M. Dukes (Troy, NY); Ashish P. Diwanji (New Albany, NY); Andrew R. Hopkins (Sylvania, OH); Walter J. Sherwood (Glenville, NY); Mark S. Land (Houston, TX); Glenn Sandgren (Boston, MA); Brian L. Benac (Hadley, NY)
Assignee: Pallidus, Inc.
C01B32/956C01B32/977C04B35/56C04B35/5603C04B35/571C04B35/80C08G77/20C08G77/50C08L83/00C08L83/04C30B23/00C30B23/025C30B29/06C30B29/36H01L21/02378H01L21/02381H01L21/02529H01L21/0262H01L29/1608H01L29/66068H01L29/66893C04B2235/3418C04B2235/3826C04B2235/44C04B2235/48C04B2235/483C04B2235/528C04B2235/5427C04B2235/5436C04B2235/6581C04B2235/72C04B2235/77C04B2235/96C08G77/12C08G77/80
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,291,456
App. No.
17/844,041
Granted
May 6, 2025
Kind
B2
Abstract

Organosilicon chemistry, polymer derived ceramic materials, and methods. Such materials and methods for making polysilocarb (SiOC) and Silicon Carbide (SiC) materials having 3-nines, 4-nines, 6-nines and greater purity. Processes and articles utilizing such high purity SiOC and SiC.

Claims (13)

1. An SiC wafer having a 4 H or a 6H polytype, for use as a semiconductor, the SiC wafer comprising a polymer derived SiC and a filler;

a. wherein the SiC wafer is made by steps comprising:

i. vapor deposition of a polymer derived SiC material to form a boule; the polymer derived SiC material consisting essentially of the polymer derived SiC and the filler and having a purity of at least 99.999%; and,

ii. preparing a wafer from the boule; and,

b. wherein the polymer derived SiC material is made by steps comprising:

i. curing of a liquid SiOC precursor formulation to form a cured SiOC solid material;

ii. pyrolizing the SiOC solid material to form the polymer derived SiC material.

2. The wafer of claim 1 , having a diameter from about 3 inches to about 10 inches.

3. An LED comprising a portion of the SiC wafer of claim 1 .

4. A metal-semiconductor field effect transistor (MESFET) comprising a portion of the wafer of claim 1 .

5. A compound semiconductor device comprising the MESFET of claim 4 .

6. A cellular base station comprising the MESFET of claim 4 .

7. A power transformer comprising the MESFET of claim 4 .

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2025
From: MELIOR INNOVATIONS, INC.
To: PALLIDUS, INC.
Reel/Frame 070718/0554 →
SECURITY INTEREST Recorded Jan 10, 2025
From: PALLIDUS, INC.
To: R&R PALLIDUS HOLDINGS II LLC, AS ADMINISTRATIVE AGENT
Reel/Frame 069818/0486 →
Continuity (14)
Continuation 16825162 · Mar 20, 2020
Continuation 15593938 · May 12, 2017
Continuation 14864539 · Sep 24, 2015
Continuation 14634814 · Feb 28, 2015
Continuation 14268150 · May 2, 2014
Continuation 14212896 · Mar 14, 2014
Provisional Application 62112025 · Feb 4, 2015
Provisional Application 62055397 · Sep 25, 2014
Provisional Application 62055497 · Sep 25, 2014
Provisional Application 62055461 · Sep 25, 2014
Provisional Application 61946598 · Feb 28, 2014
Provisional Application 61818981 · May 3, 2013
Provisional Application 61818906 · May 2, 2013
Related Publication 20230090632A1 · Mar 23, 2023
References Cited (1)
US 20130309496A1 · Zwieback · 2013 [cited by examiner]