Semiconductor devices having on-chip gate resistors
Power semiconductor devices comprise a gate pad, a gate bus, and a gate resistor that is electrically interposed between the gate pad and the gate bus and comprises a wide band-gap semiconductor material region.
1. A semiconductor device comprising:
a gate pad;
a gate bus; and
a gate resistor electrically interposed between the gate pad and the gate bus and comprising a wide band-gap semiconductor material region that has an insulating layer formed directly on an upper surface of the wide band-gap semiconductor material region.
2. The semiconductor device of claim 1 , wherein the gate resistor has a first conductivity type and is a first portion of a semiconductor layer structure, the semiconductor layer structure further comprising a second portion that has a second conductivity type,
the gate pad comprises a metal gate pad, and the gate bus comprises a metal gate bus, and
the gate resistor electrically connects the metal gate pad to the metal gate bus.
3. A semiconductor device comprising:
a metal gate pad;
a metal gate bus; and
a gate resistor comprising a wide band-gap semiconductor material region that has a first conductivity type, the gate resistor electrically connecting the gate pad to the gate bus, where the gate resistor is a first portion of a semiconductor layer structure, the semiconductor layer structure further comprising a second portion that has a second conductivity type,
wherein the wide band-gap semiconductor material region further comprises a first portion having the first conductivity type that is in between the metal gate pad and the second portion of the semiconductor layer structure and a second portion having the first conductivity type that is in between the metal gate bus and the second portion of the semiconductor layer structure.
4. The semiconductor device of claim 3 , wherein the metal gate pad comprises a first metal silicide region, the metal gate bus comprises a second metal silicide region, and the first and second metal silicide regions contact the first and second portions of the wide band-gap semiconductor material region, respectively, and
the gate resistor comprises a third portion of the wide band-gap semiconductor material region, which is between the first and second portions of the wide band-gap semiconductor material region, and an upper surface of the gate resistor is devoid of a metal silicide.
5. The semiconductor device of claim 4 , wherein the first metal silicide region extends along a perimeter of a lower surface of the metal gate pad and defines an outer portion of the lower surface of the metal gate pad, and
the lower surface of the metal gate pad further comprises an inner portion that abuts the first metal silicide region and is devoid of a metal silicide.
6. The semiconductor device of claim 5 , further comprising a gate pad insulating pattern that is between the inner portion of the metal gate pad and the semiconductor layer structure.
7. The semiconductor device of claim 1 , wherein the wide band-gap semiconductor material region comprises silicon carbide.
8. A semiconductor device comprising:
a gate pad;
a gate bus; and
a gate resistor electrically interposed between the gate pad and the gate bus and comprising a wide band-gap semiconductor material region,
wherein the wide band-gap semiconductor material region is a portion of a semiconductor layer structure that comprises an active area comprising a plurality of junction field effect transistors (JFETs), and
wherein the semiconductor device is cascoded with a metal-oxide-semiconductor field-effect transistor (MOSFET) to form a circuit breaker.
9. The semiconductor device of claim 1 , wherein the wide band-gap semiconductor material region has sheet resistance in a range of about 14000 ohms/sq to about 22000 ohms/sq.
10. A semiconductor device comprising:
a semiconductor layer structure comprising an active area that comprises a plurality of junction field effect transistors (JFETs);
a first silicide region and a second silicide region on an upper surface of the semiconductor layer structure;
a metal gate pad on the first silicide region;
a metal gate bus on the second silicide region; and electrically connected to the plurality of JFETs;
wherein the semiconductor layer structure further comprises a gate resistor that is electrically interposed between the metal gate pad and the metal gate bus, wherein an upper surface of the gate resistor is free of silicide.
11. The semiconductor device of claim 10 , wherein the gate resistor comprises a wide band-gap semiconductor material region.
12. The semiconductor device of claim 11 , wherein the wide band-gap semiconductor material region is a first wide band-gap semiconductor material region having a first conductivity type, and the semiconductor layer structure further comprises a plurality of second wide band-gap semiconductor material regions having the first conductivity type, and
wherein the plurality of JFETs comprise, respectively, a plurality of metal gate contacts and a plurality of gate electrodes, and each of the plurality of gate electrodes comprises a respective one of the plurality of second wide band-gap semiconductor material regions and contacts a lower surface of a respective one of the plurality of metal gate contacts.
13. The semiconductor device of claim 10 , wherein the semiconductor device is cascoded with a metal-oxide-semiconductor field-effect transistor (MOSFET) to form a circuit breaker.
14. The semiconductor device of claim 10 , wherein the gate resistor comprises a wide band-gap semiconductor material region having a first conductivity type and is a first portion of the semiconductor layer structure, and the semiconductor layer structure further comprises a second portion having a second conductivity type, and
the wide band-gap semiconductor material region further comprises a first portion between the metal gate pad and the second portion of the semiconductor layer structure and a second portion between the metal gate bus and the second portion of the semiconductor layer structure.
15. The semiconductor device of claim 14 , wherein the metal gate pad comprises a first metal silicide region, the metal gate bus comprises a second metal silicide region, and the first and second metal silicide regions contact the first and second portions of the wide band-gap semiconductor material region, respectively, and
wherein the gate resistor comprises a third portion of the wide band-gap semiconductor material region that is between the first and second portions of the wide band-gap semiconductor material region, and an upper surface of the third portion of the wide band-gap semiconductor material region is devoid of a metal silicide.
16. The semiconductor device of claim 15 , wherein the first metal silicide region extends along a perimeter of a lower surface of the metal gate pad and defines an outer portion of the lower surface of the metal gate pad, and
the lower surface of the metal gate pad further comprises an inner portion that abuts the first metal silicide region and is devoid of a metal silicide.
17. The semiconductor device of claim 16 , further comprising a gate pad insulating pattern that is between the inner portion of the lower surface of the metal gate pad and the semiconductor layer structure.
18. The semiconductor device of claim 10 , wherein the gate resistor comprises a wide band-gap semiconductor region having sheet resistance in a range of about 14000 ohms/sq to about 22000 ohms/sq.
19. The semiconductor device of claim 10 , wherein the gate resistor comprises a wide band-gap semiconductor region having sheet resistance of about 18000 ohms/sq.