COPPER RINGS FOR BGA COUNT REDUCTION IN SMALL FORM FACTOR PACKAGES
Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a die. In an embodiment, a package substrate is coupled to the die. In an embodiment, a ring is provided under the package substrate. In an embodiment, the ring comprises a conductive material. In an embodiment, the electronic package further comprises balls outside of the ring.
1 . An electronic package, comprising:
a die;
a package substrate coupled to the die;
a ring under the package substrate, wherein the ring comprises a conductive material; and
balls outside of the ring.
2 . The electronic package of claim 1 , further comprising:
a second ring around the first ring.
3 . The electronic package of claim 2 , wherein the second ring comprises a plurality of segments.
4 . The electronic package of claim 3 , wherein the plurality of segments are configured to be coupled to different power rails.
5 . The electronic package of claim 3 , wherein the plurality of segments includes five or more segments.
6 . The electronic package of claim 1 , wherein the ring is configured to be grounded.
7 . The electronic package of claim 1 , further comprising:
a plurality of dies coupled to the package substrate.
8 . The electronic package of claim 1 , further comprising a capacitor within the ring.
9 . The electronic package of claim 8 , wherein a standoff height of the capacitor is greater than a standoff height of the ring.
10 . The electronic package of claim 8 , wherein a standoff height of the capacitor is less than a standoff height of the ring.
11 . The electronic package of claim 1 , wherein a first row of balls outside of the ring are functional balls.
12 . The electronic package of claim 1 , wherein the ring is at least partially within a footprint of the die.
13 . A package substrate, comprising:
a substrate with a first surface and a second surface opposite from the first surface;
an array of balls on the second surface of the substrate, wherein the array of balls includes a cavity;
a first ring inside the cavity;
a second ring inside the cavity and around the first ring; and
capacitors in the cavity.
14 . The package substrate of claim 13 , wherein the cavity is a rectangular cavity.
15 . The package substrate of claim 13 , wherein the first ring is electrically isolated from the second ring.
16 . The package substrate of claim 13 , wherein the second ring includes a plurality of segments, and wherein each segment is electrically isolated from each other.
17 . The package substrate of claim 16 , wherein the plurality of segments are configured to be held at different voltages during operation of the package substrate.
18 . The package substrate of claim 13 , wherein the first ring is configured to be held at a ground voltage during operation of the package substrate.
19 . The package substrate of claim 13 , wherein a first row of bumps around a perimeter of the cavity are functional bumps.
20 . The package substrate of claim 13 , wherein a standoff height of the capacitor is different than a standoff height of the first ring or the second ring.
21 . The package substrate of claim 13 , further comprising:
a die coupled to the first surface of the package substrate.
22 . The package substrate of claim 21 , wherein the first ring is at least partially within a footprint of the die.
23 . An electronic system, comprising:
a board;
a package substrate coupled to the board, wherein the package substrate comprises:
a first ring between the package substrate and the board;
a second ring between the package substrate and the board, wherein the second ring is around the first ring: and
balls between the package substrate and the board, wherein the balls are outside of the second ring; and
a die coupled to the package substrate.
24 . The electronic system of claim 23 , further comprising:
a plurality of capacitors within a perimeter of the first ring.
25 . The electronic system of claim 23 , wherein the first ring is configured to be grounded, and wherein the second ring comprises a plurality of segments that are configured to be held at different voltages.