Patent Assignment
Reel/Frame 076008/0329
Assignment of Assignor's Interest
Recorded: 2026-09-14
Pages: 4
Assignor
INTEL CORPORATION
Executed: 2026-04-10
Assignee
INTEL FOUNDRY IP LLC
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Properties
(38)
Substrate Embedded Magnetic Core Inductors and Method of Making
Gate-All-Around Integrated Circuit Structures Having Depopulated Channel Structures Using Multiple Bottom-Up Oxidation Approaches
Application:
18/225,440 →
Publication:
US US20230369399A1
Contact Over Active Gate Structures with Etch Stop Layers for Advanced Integrated Circuit Structure Fabrication
Application:
18/753,766 →
Publication:
US US20240347465A1
Varied Ball Ball-Grid-Array (Bga) Packages
Gate-All-Around Integrated Circuit Structures Having Fin Stack Isolation
Microelectronic Structures Including Bridges
Application:
18/400,761 →
Publication:
US US20240136292A1
Fine Bump Pitch Die to Die Tiling Incorporating an Inverted Glass Interposer
Self-Assembled Monolayer on a Dielectric for Transition Metal Dichalcogenide Growth for Stacked 2D Channels
Application:
17/850,078 →
Publication:
US US20230420510A1
Dam Surrounding a Die on a Substrate
Protective Coating on an Edge of a Glass Core
Hybrid Bonded Capacitors
Application:
17/557,557 →
Publication:
US US20230197767A1
Single Layer and Multilayer Magnetic Inductors Between Substrate Cores
Application:
17/561,726 →
Publication:
US US20230207494A1
Integrated Circuit Structures with Backside Self-Aligned Conductive Source or Drain Contact
Non-Epitaxial Electrical Coupling Between a Front Side Trench Connector and Back Side Contacts of a Transistor
Transistor Backside Routing Layers with Contacts Having Varying Depths
Back-End-Of-Line 2D Transistor
Inline Circuit Edit for Backside Power Delivery with Deep Via
Copper Rings for Bga Count Reduction in Small Form Factor Packages
Application:
17/849,352 →
Publication:
US US20230420345A1
Selective Bottomless Graphene Lined Interconnects
Pcb Fabrication with Emi Film on Multi-Layer Rigid Pcb
Silicon Nitride Layer Under a Copper Pad
Application:
17/848,624 →
Publication:
US US20230420357A1
Dielectric Plugs for Advanced Integrated Circuit Structure Fabrication
Application:
17/950,926 →
Publication:
US US20240105597A1
Integrated Circuit Structures Having Uniform Grid Metal Gate and Trench Contact Plug
Ic Package with Micro Leds
Pillar Structures on an Optical Waveguide
Tsv-Type Embedded Multi-Die Interconnect Bridge Enabling with Thermal Compression Non-Conductive Film (Tc-Ncf) Process
Application:
18/089,483 →
Publication:
US US20240213164A1
Patterned Sheet Muf for Complex Packages and Methods of Producing
Application:
18/091,034 →
Publication:
US US20240222216A1
Forming Metal Gate Cuts Using Multiple Passes for Depth Control
Application:
17/937,212 →
Publication:
US US20240113105A1
Metal Insulator Metal (Mim) Capacitor Architectures
Application:
18/129,258 →
Publication:
US US20230411443A1
Integrated Circuit Structures Having Vertical Shared Gate High-Drive Thin Film Transistors
Application:
18/090,822 →
Publication:
US US20240222520A1
Integrated Circuit Structures Having Backside High Voltage Capacitors for Front Side Gan-Based Devices
Application:
18/088,541 →
Publication:
US US20240213140A1
Integrated Circuit Structure with Recessed Trench Contact and Deep Boundary Via
Integrated Circuit Structures with Cavity Spacers
Application:
18/073,213 →
Publication:
US US20240186398A1
Conductive Bridge Through Dielectric Wall Between Source or Drain Contacts
Application:
18/136,991 →
Publication:
US US20240355890A1
Integrated Circuit Structures Having Uniform Grid Metal Gate and Trench Contact Plug for Tub Gates with Pyramidal Channel Structures
Microelectronic Devices Designed with Mold Patterning to Create Package-Level Components for High Frequency Communication Systems
Ultra-Thin, Hyper-Density Semiconductor Packages
Application:
17/862,300 →
Publication:
US US20220344247A1
Source/Drain Contacts for Non-Planar Transistors
Application:
18/135,091 →
Related Assignments
(13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 12, 2021
From: ECTON, JEREMY D.; MARIN, BRANDON C.; PIETAMBARAM, SRINIVAS V.; NAD, SUDDHASATTWA
To: INTEL CORPORATION
Reel/Frame 058101/0671 →
Assignment of Assignor's Interest
May 5, 2022
From: HE, LIANG; JIANG, JISU; HAN, JUNG KYU; DUAN, GANG
To: INTEL CORPORATION
Reel/Frame 059857/0262 →
Assignment of Assignor's Interest
May 6, 2022
From: MANEPALLI, RAHUL N.; PIETAMBARAM, SRINIVAS V.; TANIKELLA, RAVINDRA; PAITAL, SAMEER
To: INTEL CORPORATION
Reel/Frame 059841/0658 →
Assignment of Assignor's Interest
Aug 23, 2022
From: PARK, CHANGYOK
To: INTEL CORPORATION
Reel/Frame 060875/0237 →
Assignment of Assignor's Interest
Aug 25, 2022
From: XIE, JIANYONG; COLLINS, ANDREW P.; SAIN, ARGHYA; PANDI, SIVASEETHARAMAN
To: INTEL CORPORATION
Reel/Frame 060899/0949 →
Assignment of Assignor's Interest
Dec 2, 2022
From: MILLS, SHAUN; MANNEBACH, EHREN; D'SILVA, JOSEPH; KOLLURU, KALYAN
To: INTEL CORPORATION
Reel/Frame 061949/0339 →
Assignment of Assignor's Interest
Dec 2, 2022
From: GULER, LEONARD P.; PURSEL, SEAN; GANDIKOTA, RAGHURAM; ABBAS, SIKANDAR
To: INTEL CORPORATION
Reel/Frame 061949/0300 →
Assignment of Assignor's Interest
May 10, 2023
From: NAYLOR, CARL H.; MAXEY, KIRBY; O'BRIEN, KEVIN P.; DOROW, CHELSEY
To: INTEL CORPORATION
Reel/Frame 063594/0423 →
Assignment of Assignor's Interest
May 10, 2023
From: LIN, CHIA-CHING; SHIVARAMAN, SHRIRAM; O'BRIEN, KEVIN P.; PENUMATCHA, ASHISH VERMA
To: INTEL CORPORATION
Reel/Frame 063605/0839 →
Assignment of Assignor's Interest
May 18, 2023
From: ENGEL, CLIFFORD J.; LIVENGOOD, RICHARD H.; KOBRINSKY, MAURO J.; BRISTOL, ROBERT L
To: INTEL CORPORATION
Reel/Frame 063687/0367 →
Assignment of Assignor's Interest
May 19, 2023
From: NAGARAJAN, KAVITHA; LIM, MIN SUET; GOH, ENG HUAT; KAMGAING, TELESPHOR
To: INTEL CORPORATION
Reel/Frame 063700/0545 →
Assignment of Assignor's Interest
Jun 14, 2023
From: CHANDRASEKHAR, NITA; TIWARI, VISHAL; CHOWDHURY, AKM SHAESTAGIR
To: INTEL CORPORATION
Reel/Frame 063946/0934 →
Assignment of Assignor's Interest
Jul 7, 2023
From: MILLS, SHAUN
To: INTEL CORPORATION
Reel/Frame 064184/0642 →