Integrated circuit structure with recessed trench contact and deep boundary via
Integrated circuit structures having recessed trench contacts and deep boundary vias are described. For example, an integrated circuit structure includes a plurality of gate lines extending over a plurality of semiconductor nanowire stack channel structures. A plurality of trench contacts extends over a plurality of source or drain structures, where a first one of the plurality of trench contacts has a recess therein. A backside metal routing layer is extending beneath the plurality of gate lines and beneath the plurality of trench contacts. A conductive structure couples the backside metal routing layer to a second one of the one or more of the plurality of trench contacts. The conductive structure includes a pillar portion in contact with the second one of the plurality of trench contacts, the pillar portion on a line portion, the line portion in contact with and extending along the backside metal routing layer.
1 . An integrated circuit structure, comprising:
a plurality of gate lines extending over a plurality of semiconductor nanowire stack channel structures;
a plurality of trench contacts extending over a plurality of source or drain structures, wherein a first one of the plurality of trench contacts has a recess in metal of the trench contact;
a backside metal routing layer extending beneath the plurality of gate lines and beneath the plurality of trench contacts; and
a conductive structure coupling the backside metal routing layer to a second one of the plurality of trench contacts, the conductive structure comprising a pillar portion in contact with the second one of the plurality of trench contacts, the pillar portion on a line portion, the line portion in contact with and extending along the backside metal routing layer.
2 . The integrated circuit structure of claim 1 , wherein the backside metal routing layer is a backside power delivery line.
3 . The integrated circuit structure of claim 1 , wherein the conductive structure is a recessed deep boundary via structure.
4 . The integrated circuit structure of claim 1 , wherein the pillar portion of the conductive structure extends between a pair of N-type source or drain structures of plurality of source or drain structures or extends between a pair of P-type source or drain structures of plurality of source or drain structures.
5 . The integrated circuit structure of claim 1 , further comprising a dielectric liner along sides of the pillar portion and the line portion of the conductive structure.
6 . An integrated circuit structure, comprising:
a plurality of gate lines extending over a plurality of semiconductor fin structures;
a plurality of trench contacts extending over a plurality of source or drain structures, wherein a first one of the plurality of trench contacts has a recess in metal of the trench contact;
a backside metal routing layer extending beneath the plurality of gate lines and beneath the plurality of trench contacts; and
a conductive structure coupling the backside metal routing layer to a second one of the plurality of trench contacts, the conductive structure comprising a pillar portion in contact with the second one of the plurality of trench contacts, the pillar portion on a line portion, the line portion in contact with and extending along the backside metal routing layer.
7 . The integrated circuit structure of claim 6 , wherein the backside metal routing layer is a backside power delivery line.
8 . The integrated circuit structure of claim 6 , wherein the conductive structure is a recessed deep boundary via structure.
9 . The integrated circuit structure of claim 6 , wherein the pillar portion of the conductive structure extends between a pair of N-type source or drain structures of plurality of source or drain structures or extends between a pair of P-type source or drain structures of plurality of source or drain structures.
10 . The integrated circuit structure of claim 6 , further comprising a dielectric liner along sides of the pillar portion and the line portion of the conductive structure.
11 . A computing device, comprising:
a board; and
a component coupled to the board, the component including an integrated circuit structure, comprising:
a plurality of gate lines extending over a plurality of semiconductor nanowire stack channel structures;
a plurality of trench contacts extending over a plurality of source or drain structures, wherein a first one of the plurality of trench contacts has a recess in metal of the trench contact;
a backside metal routing layer extending beneath the plurality of gate lines and beneath the plurality of trench contacts; and
a conductive structure coupling the backside metal routing layer to a second one of the plurality of trench contacts, the conductive structure comprising a pillar portion in contact with the second one of the plurality of trench contacts, the pillar portion on a line portion, the line portion in contact with and extending along the backside metal routing layer.
12 . The computing device of claim 11 , further comprising:
a memory coupled to the board.
13 . The computing device of claim 11 , further comprising:
a communication chip coupled to the board.
14 . The computing device of claim 11 , further comprising:
a camera coupled to the board.
15 . The computing device of claim 11 , wherein the component is a packaged integrated circuit die.
16 . A computing device, comprising:
a board; and
a component coupled to the board, the component including an integrated circuit structure, comprising:
a plurality of gate lines extending over a plurality of semiconductor fin structures;
a plurality of trench contacts extending over a plurality of source or drain structures, wherein a first one of the plurality of trench contacts has a recess in metal of the trench contact;
a backside metal routing layer extending beneath the plurality of gate lines and beneath the plurality of trench contacts; and
a conductive structure coupling the backside metal routing layer to a second one of the plurality of trench contacts, the conductive structure comprising a pillar portion in contact with the second one of the plurality of trench contacts, the pillar portion on a line portion, the line portion in contact with and extending along the backside metal routing layer.
17 . The computing device of claim 16 , further comprising:
a memory coupled to the board.
18 . The computing device of claim 16 , further comprising:
a communication chip coupled to the board.
19 . The computing device of claim 16 , further comprising:
a camera coupled to the board.
20 . The computing device of claim 16 , wherein the component is a packaged integrated circuit die.