TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS
Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and an opening in the package substrate. In an embodiment, a plurality of first pads are provided at a bottom of the opening, and a bridge die is in the opening. In an embodiment, the bridge die comprises a plurality of second pads that are coupled to the first pads by solder. In an embodiment, a non-conductive film (NCF) is around the solder between the first pads and the second pads.
1 . An electronic package, comprising:
a package substrate;
an opening in the package substrate, wherein a plurality of first pads are provided at a bottom of the opening;
a bridge die in the opening, wherein the bridge die comprises a plurality of second pads that are coupled to the first pads by solder; and
a non-conductive film (NCF) around the solder between the first pads and the second pads.
2 . The electronic package of claim 1 , wherein a plurality of vias pass through the bridge die.
3 . The electronic package of claim 1 , wherein the package substrate comprises an organic material.
4 . The electronic package of claim 1 , wherein the package substrate comprises glass.
5 . The electronic package of claim 1 , wherein the NCF comprises an epoxy.
6 . The electronic package of claim 1 , wherein the first pads include a surface finish.
7 . The electronic package of claim 6 , wherein the surface finish comprises gold.
8 . The electronic package of claim 1 , wherein the bridge die is a passive bridge die.
9 . The electronic package of claim 1 , wherein the bridge die is an active bridge die.
10 . The electronic package of claim 1 , further comprising a first die coupled to a second die by the bridge die.
11 . A bridge die, comprising:
a die substrate;
a plurality of vias through the die substrate;
a plurality of pads over a backside of the plurality of vias;
a plurality of solder bumps on the plurality of pads; and
a non-conductive film (NCF) over the plurality of solder bumps.
12 . The bridge die of claim 11 , wherein the NCF comprises an epoxy.
13 . The bridge die of claim 11 , wherein the solder bumps are substantially embedded in the NCF.
14 . The bridge die of claim 11 , wherein the die substrate is an active silicon die.
15 . The bridge die of claim 11 , wherein the die substrate is a passive silicon die.
16 . An electronic system, comprising:
a board;
a package substrate coupled to the board, wherein the package substrate comprises:
a cavity;
a bridge die in the cavity, wherein a backside of the bridge die is coupled to pads in the cavity using a non-conductive film (NCF) around solder between the bridge die and the pads;
a first die coupled to the package substrate; and
a second die coupled to the package substrate, wherein the first die is communicatively coupled to the second die by the bridge die.
17 . The electronic system of claim 16 , wherein the bridge die is an active bridge or a passive bridge.
18 . The electronic system of claim 16 , wherein the NCF comprises an epoxy.
19 . The electronic system of claim 16 , wherein the pads comprise a surface finish.
20 . The electronic system of claim 16 , wherein the electronic system is part of a personal computer, a server, a mobile device, a tablet, or an automobile.