Patent Assignment
Reel/Frame 063774/0104
Assignment of Assignor's Interest
Recorded: 2023-05-26
Pages: 22
Assignors
LIU, MINGLU
Executed: 2022-12-19
DUAN, GANG
Executed: 2022-12-19
HE, LIANG
Executed: 2022-12-19
LIN, ZIYIN
Executed: 2023-01-09
NOFEN, ELIZABETH
Executed: 2022-12-19
BAI, YIQUN
Executed: 2023-05-25
ATKINS, JONATHAN
Executed: 2022-12-22
NIETO PESCADOR, JESUS S.
Executed: 2023-04-19
PIETAMBARAM, SRINIVAS V.
Executed: 2022-12-19
DARMAWIKARTA, KRISTOF
Executed: 2022-12-19
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Tsv-Type Embedded Multi-Die Interconnect Bridge Enabling with Thermal Compression Non-Conductive Film (Tc-Ncf) Process
Application:
18/089,483 →
Publication:
US 2024/0213164
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.