PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING
Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a package substrate with a die coupled to the package substrate by a plurality of interconnects. In an embodiment, a first layer is on the package substrate surrounding the die, and a second layer is over and around the die. In an embodiment, the second layer underfills the plurality of interconnects, and the second layer has a different material composition than the first layer.
1 . An electronic package, comprising:
a package substrate;
a die coupled to the package substrate by a plurality of interconnects;
a first layer on the package substrate surrounding the die; and
a second layer over and around the die, wherein the second layer underfills the plurality of interconnects, wherein the second layer has a different material composition than the first layer.
2 . The electronic package of claim 1 , wherein an interface between the first mold material and the second mold material is substantially orthogonal to a top surface of the package substrate.
3 . The electronic package of claim 1 , wherein the second layer has a rectangular footprint, and wherein the first layer is a frame around the rectangular footprint.
4 . The electronic package of claim 1 , wherein the first layer has a first coefficient of thermal expansion (CTE), and the second layer has a second CTE, wherein the first CTE is lower than the second CTE.
5 . The electronic package of claim 1 , wherein the first layer has a first filler loading percentage, and the second layer has a second filler loading percentage, wherein the second filler loading percentage is lower than the first filler loading percentage.
6 . The electronic package of claim 1 , wherein the first layer and the second layer have differences in one or more of filler size, filler loading, filler type, filler shape, filler hollow ratio, resin type, and additives.
7 . The electronic package of claim 1 , wherein the first layer and the second layer form a continuous sheet that is applied over the package substrate.
8 . The electronic package of claim 1 , further comprising:
a second die over the package substrate that is coupled to the package substrate by a plurality of second interconnects; and
wherein the second layer is over and around the second die and the plurality of second interconnects.
9 . The electronic package of claim 1 , further comprising:
a third layer that is different than the first layer, wherein the third layer is spaced apart from the second layer by the first layer.
10 . The electronic package of claim 9 , wherein a material composition of the second layer is substantially similar to a material composition of the third layer.
11 . The electronic package of claim 9 , wherein a material composition of the second layer is different than a material composition of the third layer.
12 . The electronic package of claim 1 , wherein the electronic package is part of a computing system for a personal computer, a server, a mobile device, a tablet, or an automobile.
13 . A mold underfill (MUF) sheet, comprising:
a first mold material with a first composition;
an opening formed through the first mold material; and
a second mold material in the opening, wherein the second mold material comprises a second composition.
14 . The MUF sheet of claim 13 , wherein the first composition and the second composition have differences in one or more of filler size, filler loading, filler type, filler shape, filler hollow ratio, resin type, and additives.
15 . The MUF sheet of claim 13 , wherein the opening has substantially vertical sidewalls.
16 . The MUF sheet of claim 13 , wherein the opening has a rectangular footprint.
17 . The MUF sheet of claim 13 , wherein the MUF sheet is part of a roll of a plurality of MUF sheets.
18 . A computing system, comprising:
a board;
a package substrate coupled to the board;
a die coupled to the package substrate; and
a mold underfill (MUF) disposed over the package substrate and the die, wherein the MUF comprises:
a first mold material over and around the die; and
a second mold material surrounding the first mold material.
19 . The computing system of claim 18 , wherein the first mold material has a first coefficient of thermal expansion (CTE), and wherein the second mold material has a second CTE that is less than the first CTE.
20 . The computing system of claim 18 , wherein the computing system is part of a personal computer, a server, a mobile device, a tablet, or an automobile.