PCB fabrication with EMI film on multi-layer rigid PCB
Embodiments disclosed herein include a printed circuit board (PCB). In an embodiment, the PCB comprises a core and routing layers over and under the core. In an embodiment, a multi-layer shield is over at least one of the routing layers. In an embodiment, the multi-layer shield comprises a metallic layer with a first surface and a second surface opposite from the first surface, and a conductive adhesive over the first surface of the metallic layer. In an embodiment, a base layer is over the second surface of the metallic layer, where the base layer is electrically insulating.
1 . A printed circuit board (PCB), comprising:
a core;
routing layers over and under the core; and
a multi-layer shield over at least one of the routing layers, wherein the multi-layer shield comprises:
a metallic layer with a first surface and a second surface opposite from the first surface;
a conductive adhesive over the first surface of the metallic layer; and
a base layer over the second surface of the metallic layer, wherein the base layer is electrically insulating.
2 . The PCB of claim 1 , wherein the multi-layer shield is over a bottommost surface of the routing layers.
3 . The PCB of claim 1 , wherein the multi-layer shield is over a topmost surface of the routing layers.
4 . The PCB of claim 1 , wherein the multi-layer shield is over a topmost surface of the routing layers and a bottommost surface of the routing layers.
5 . The PCB of claim 1 , wherein the multi-layer shield has a thickness that is approximately 20 μm or less.
6 . The PCB of claim 5 , wherein the multi-layer shield has a thickness that is approximately 15 μm or less.
7 . The PCB of claim 1 , wherein the multi-layer shield further comprises:
a reinforcement layer over the base layer.
8 . The PCB of claim 1 , wherein the conductive adhesive contacts a metallic surface on the at least one of the routing layers.
9 . The PCB of claim 8 , wherein the metallic surface is a grounded surface.
10 . The PCB of claim 1 , wherein the multi-layer shield further comprises:
a cutout to accommodate attaching one or more discrete components to the routing layers.
11 . A printed circuit board (PCB), comprising:
a routing layer;
a solder resist over the routing layer, wherein an opening in the solder resist exposes a metallic feature in the routing layer; and
a multi-layer shield over the solder resist, wherein the multi-layer shield comprises:
a conductive adhesive;
a metallic layer on the conductive adhesive, wherein the conductive adhesive electrically couples the metallic layer to the metallic feature; and
a base layer on the metallic layer, wherein the base layer is an electrically insulating material.
12 . The PCB of claim 11 , wherein the multi-layer shield has a thickness that is up to approximately 20 μm.
13 . The PCB of claim 12 , wherein a thickness of the metallic layer is up to approximately 10 μm.
14 . The PCB of claim 11 , wherein the solder resist comprises a component opening, and wherein the multi-layer shield comprises a shield opening that is substantially aligned with the component opening.
15 . The PCB of claim 11 , wherein the multi-layer shield is on a sidewall of the solder resist and a top surface of the solder resist.
16 . The PCB of claim 11 , wherein the metallic layer comprises copper.
17 . The PCB of claim 11 , wherein the metallic feature is grounded.
18 . A computing system, comprising:
a board, wherein the board comprises:
an electromagnetic interference (EMI) shield that includes a metallic layer and an electrically conductive adhesive that electrically couples the metallic layer to an electrical ground of the board;
a package substrate coupled to the board; and
a die coupled to the package substrate.
19 . The computing system of claim 18 , wherein the EMI shield is provided over the board, under the board, or both over and under the board.
20 . The computing system of claim 18 , wherein the computing system is part of a personal computer, a server, a mobile device, a tablet, or an automobile.