IP Library Granted Patent US 12,730,261
Granted Patent B2
US 12,730,261 · App. 17/956,757 · Granted Sep 8, 2026

Pillar structures on an optical waveguide

Inventors: Brandon C. Marin (Gilbert, AZ); Gang Duan (Chandler, AZ); Jeremy D. Ecton (Gilbert, AZ); Suddhasattwa Nad (Chandler, AZ); Srinivas V. Pietambaram (Chandler, AZ)
Assignee: Intel Corporation
G02B6/1226G02B5/008G02B6/122G02B6/13G02B6/0016
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Quick Facts
Patent No.
US 12,730,261
App. No.
17/956,757
Granted
Sep 8, 2026
Kind
B2
Abstract

Embodiments herein relate to systems, apparatuses, techniques for an optical waveguide that includes a plurality of pillar structures that are in an optical path between the optical waveguide and a PIC. In embodiments, the plurality of pillar structures form an evanescent coupling structure that increases the alignment tolerance between the PIC and the optical waveguide. In embodiments, an end of each of the plurality of pillar structures may include a mass of material, such as gold, silver, or copper, that light from the PIC interacts with in a Plasmon effect to focus the light on to the optical waveguide. Other embodiments may be described and/or claimed.

Claims (49)

1 . An apparatus comprising:

a substrate;

a waveguide on a surface of the substrate;

a plurality of pillar structures, wherein each of the plurality of pillar structures has a first end and a second end opposite the first end, wherein the first end of each of the plurality of pillar structures is coupled with a surface of the waveguide; and

a plurality of masses, wherein each one of the plurality of masses is coupled with the second end of a corresponding one of the plurality of pillar structures, and wherein each one of the plurality of masses has a diameter greater than a diameter of the corresponding one of the plurality of pillar structures.

2 . The apparatus of claim 1 , wherein the plurality of masses includes a selected one or more of: gold, silver, aluminum, palladium, nickel, or copper.

3 . The apparatus of claim 1 , wherein the plurality of masses is not directly physically coupled with the surface of the waveguide.

4 . The apparatus of claim 1 , wherein each one of the plurality of masses is not in direct physical contact with any other of the plurality of masses.

5 . The apparatus of claim 1 , wherein the substrate includes glass.

6 . The apparatus of claim 1 , wherein the plurality of pillar structures are in a grid pattern with respect to the surface of the waveguide.

7 . The apparatus of claim 1 , wherein each of the plurality of pillar structures are orthogonal to the surface of the waveguide.

8 . The apparatus of claim 1 , further comprising a layer on the surface of the waveguide, wherein the first end of each of the plurality of pillar structures is coupled with the layer, and wherein the layer primarily comprises carbon.

9 . The apparatus of claim 1 , wherein each of the plurality of masses has a shape that is a selected one of: a spheroid or a polyhedron.

10 . The apparatus of claim 1 , wherein the waveguide is formed using laser direct writing.

11 . A package comprising:

a layer of glass;

a waveguide on a surface of the layer of glass;

a plurality of pillar structures, wherein each of the plurality of pillar structures has a first end and a second end opposite the first end, wherein the first end of each of the plurality of pillar structures is coupled to a surface of the waveguide within a region on the surface of the waveguide;

a plurality of masses, wherein each one of the plurality of masses is coupled with the second end of a corresponding one of the plurality of pillar structures; and

a photonics integrated circuit (PIC) coupled with the layer of glass, wherein the PIC and the region on the surface of the waveguide are optically coupled through at least a portion of the plurality of pillar structures.

12 . The package of claim 11 , wherein the plurality of masses includes a selected one or more of: gold, silver, aluminum, palladium, nickel, or copper.

13 . The package of claim 11 , further including a layer on the surface of the waveguide, wherein the layer primarily comprises carbon.

14 . The package of claim 13 , wherein each of the plurality of masses that is coupled with the second end of a corresponding one of the plurality of pillar structures does not extend to the surface of the waveguide or to a surface of the layer which primarily comprises carbon.

15 . The package of claim 11 , wherein a first mass of the plurality of masses and a second mass of the plurality of masses that is adjacent to the first mass of the plurality of masses are separated by a distance of 3 μm or less.

16 . The package of claim 11 , wherein the plurality of pillar structures are in a grid pattern with respect to the surface of the waveguide.

17 . The package of claim 11 , wherein the waveguide is a first waveguide, wherein the plurality of pillar structures is a first plurality of pillar structures, wherein the plurality of masses is a first plurality of masses, and wherein the region on the surface of the waveguide is a first region; and further comprising:

a second waveguide on the surface of the layer of glass;

a second plurality of pillar structures, wherein each of the second plurality of pillar structures has a first end and a second end opposite the first end, wherein the first end of each of the second plurality of pillar structures is coupled to a surface of the second waveguide within a second region on the surface of the second waveguide;

a second plurality of masses, wherein each one of the second plurality of masses is coupled with the second end of a corresponding one of the second plurality of pillar structures; and

wherein the PIC and the second region on the surface of the second waveguide are optically coupled.

18 . The package of claim 17 , wherein the plurality of pillar structures are in a grid pattern with respect to the surface of the waveguide.

19 . The package of claim 11 , wherein each of the plurality of pillar structures are orthogonal to the surface of the waveguide.

20 . The package of claim 17 , further comprising a layer on the surface of the waveguide, wherein the layer primarily comprises carbon.

21 . The package of claim 11 , wherein each of the plurality of masses has a shape that is a selected one of: a spheroid or a polyhedron.

22 . A method comprising:

providing a glass substrate;

forming a waveguide on a surface of the glass substrate;

forming a plurality of pillar structures on a surface of the waveguide, wherein the plurality of pillar structures are orthogonal to the surface of the waveguide; and

further comprising forming a plurality of masses, wherein each one of the plurality of masses is coupled with an end of a corresponding one of the plurality of pillar structures that is distal to the surface of the waveguide, and wherein each one of the plurality of masses has a diameter greater than a diameter of the corresponding one of the plurality of pillar structures.

23 . The method of claim 22 , wherein forming the plurality of masses further includes:

applying a material to the plurality of pillar structures; and

applying heat to the plurality of pillar structures.

24 . The method of claim 23 , wherein the material includes a selected one or more of: gold, silver, aluminum, palladium, nickel, or copper.

25 . An apparatus comprising:

a substrate;

a waveguide on a surface of the substrate;

a plurality of pillar structures, wherein each of the plurality of pillar structures has a first end and a second end opposite the first end, wherein the first end of each of the plurality of pillar structures is coupled with a surface of the waveguide;

a plurality of masses, wherein each one of the plurality of masses is coupled with the second end of a corresponding one of the plurality of pillar structures; and

a layer on the surface of the waveguide, wherein the first end of each of the plurality of pillar structures is coupled with the layer, and wherein the layer primarily comprises carbon.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2026
From: INTEL CORPORATION
To: INTEL FOUNDRY IP LLC
Reel/Frame 076008/0329 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2023
From: MARIN, BRANDON C.; DUAN, GANG; ECTON, JEREMY D.; NAD, SUDDHASATTWA; PIETAMBARAM, SRINIVAS V.
To: INTEL CORPORATION
Reel/Frame 063066/0478 →
Continuity (1)
Related Publication 20240111092A1 · Apr 4, 2024
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