IP Library Granted Patent US 9,512,000
Granted Patent B2
US 9,512,000 · App. 14/952,876 · Granted Dec 6, 2016

Fabrication and self-aligned local functionalization of nanocups and various plasmonic nanostructures on flexible substrates for implantable and sensing applications

Inventors: Chieh-feng Chang (Pasadena, CA); Sameer Walavalkar (Studio City, CA); Scott E. Fraser (Glendale, CA); Axel Scherer (Barnard, VT)
Assignee: California Institute of Technology
B81C1/00476B81C1/00468B82Y40/00H01L21/02164H01J37/3053H01J2237/3174H01L21/32137H01L41/332
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Quick Facts
Patent No.
US 9,512,000
App. No.
14/952,876
Granted
Dec 6, 2016
Kind
B2
Abstract

Methods for fabricating flexible substrate nanostructured devices are disclosed. The nanostructures comprise nano-pillars and metallic bulbs or nano-apertures. The nanostructures can be functionalized to detect biological entities. The flexible substrates can be rolled into cylindrical tubes for detection of fluidic samples.

Claims (51)

1. A method comprising:

etching a silicon substrate to form silicon nanostructures on top of the silicon substrate;

oxidizing the silicon nanostructures to form silicon oxide nanostructures;

depositing a metallic layer on the silicon oxide nanostructures;

reflowing the metallic layer to form metallic bulbs on a top section of the silicon oxide nanostructures;

depositing a continuous flexible substrate on the metallic bulbs and on the silicon oxide nanostructures; and

removing the silicon substrate and the silicon oxide nanostructures.

2. The method of claim 1 , wherein the nanostructures are pillars.

3. The method of claim 1 , wherein the metallic layer is Au.

4. The method of claim 1 , wherein the continuous flexible substrate is polydimethylsiloxane.

5. The method of claim 1 , further comprising depositing a sacrificial layer between the silicon oxide nanostructures and the continuous flexible substrate.

6. The method of claim 1 , wherein the continuous flexible substrate is transparent to optical waves.

7. The method of claim 1 , further comprising reshaping the metallic bulbs prior to depositing the continuous flexible substrate.

8. The method of claim 7 , wherein reshaping comprises applying a focused ion beam with a different intensity for at least two metallic bulbs.

9. The method of claim 7 , wherein reshaping comprises ion milling the metallic bulbs.

10. The method of claim 7 , wherein reshaping comprises shadow evaporating at an angle.

11. The method of claim 10 , wherein shadow evaporating at an angle comprises shadow evaporating at an angle in successive steps, each step being at a different angle.

12. The method of claim 1 , further comprising bending the continuous flexible substrate with the nanostructures being on a concave side of the continuous flexible substrate.

13. The method of claim 12 , wherein bending the continuous flexible substrate comprises bending the continuous flexible substrate in a cylinder shape.

14. The method of claim 13 , wherein bending the continuous flexible substrate is carried out in a spiral fashion.

15. The method of claim 13 , wherein the continuous flexible substrate rolled in the cylinder shape is configured to contain a fluid sample flow within.

16. The method of claim 15 , wherein the continuous flexible substrate rolled in the cylinder shape is further configured to act as a waveguide for optical waves.

17. A method comprising:

etching a silicon substrate to form silicon nanostructures on top of the silicon substrate;

oxidizing the silicon nanostructures to form silicon oxide nanostructures;

depositing a metallic layer on the silicon oxide nanostructures and on the silicon substrate between the silicon oxide nanostructures;

reflowing the metallic layer to form metallic bulbs on a top section of the silicon oxide nanostructures while leaving parts of the metallic layer on the silicon substrate between the silicon oxide nanostructures;

removing the silicon oxide nanostructures to form nano-apertures between the parts of the metallic layer on the silicon substrate;

depositing a continuous sacrificial layer on the nano-apertures;

attaching a carrier chip to the continuous sacrificial layer;

removing the silicon substrate by etching;

depositing a continuous flexible substrate on a surface of the nano-apertures opposite to a surface with the continuous sacrificial layer; and

removing the continuous sacrificial layer and the carrier chip.

18. The method of claim 17 , further comprising inserting an adhesive layer between the continuous flexible substrate and the surface of the nano-apertures opposite to a surface with the continuous sacrificial layer, and wherein the removing the silicon oxide nanostructures is by etching or mechanical removal.

19. The method of claim 17 , wherein the nanostructures are pillars.

20. The method of claim 17 , wherein the metallic layer is Au.

21. The method of claim 17 , wherein the continuous flexible substrate is polydimethylsiloxane.

22. The method of claim 17 , further comprising depositing a sacrificial layer between the silicon oxide nanostructures and the continuous flexible substrate.

23. The method of claim 17 , wherein the continuous flexible substrate is transparent to optical waves.

24. The method of claim 17 , wherein removing the silicon oxide nanostructures to form nano-apertures comprises controlling a depth at which the nano-apertures are formed.

25. A method comprising:

etching a silicon substrate to form silicon nanostructures on top of the silicon substrate;

oxidizing the silicon nanostructures to form silicon oxide nanostructures;

depositing a metallic layer on the silicon oxide nanostructures;

reflowing the metallic layer to form metallic bulbs on a top section of the silicon oxide nanostructures;

depositing a photosensitive layer on the metallic bulbs and on the silicon oxide nano structures;

selecting an intensity for optical excitation to be above an excitation threshold only for the photosensitive layer between the metallic bulbs;

optically exciting at the selected intensity;

removing the excited photosensitive layer, thereby leaving gaps in the photosensitive layer between the metallic bulbs; and

functionalizing the gaps between the metallic bulbs.

26. The method of claim 25 , further comprising an adhesive layer attached to the continuous flexible substrate on a surface opposite the nanostructures.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 29, 2016
From: CHANG, CHIEH-FENG; WALAVALKAR, SAMEER; SCHERER, AXEL
To: CALIFORNIA INSTITUTE OF TECHNOLOGY
Reel/Frame 037851/0372 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 29, 2016
From: FRASER, SCOTT E.
To: CALIFORNIA INSTITUTE OF TECHNOLOGY
Reel/Frame 037851/0829 →
Continuity (2)
Provisional Application 62089724 · Dec 9, 2014
Related Publication 20160158724A1 · Jun 9, 2016