Sensor assembly and methods of manufacturing thereof
A sensor assembly includes a substrate having an outer region, an inner region, and a middle region between the outer region and the inner region. The substrate further includes electrical contact pads on at least the inner region. The sensor assembly further includes a housing coupled to the substrate at the middle region or the outer region to provide a hermetic seal. The sensor assembly further includes a sensor die bonded to the substrate at the inner region. A metal bond bonds electrodes of the sensor die to the electrical contact pads. The metal bond includes platinum, and/or one or more metals selected from tin, indium, copper, aluminum, and/or nickel.
1 . A sensor assembly comprising:
a substrate comprising an outer region comprising a first distal end of the substrate, an inner region comprising an opposite second distal end of the substrate, and a middle region positioned between the outer region and the inner region, the substrate further comprising one or more electrical contact pads extending along a surface of the substrate from the outer region to the inner region;
a flange coupled to the substrate at the middle region of the substrate or the outer region of the substrate, wherein the flange is configured to couple with a housing to provide a hermetic seal; and
a sensor die bonded to the substrate at the inner region, wherein a metal bond bonds one or more electrodes of the sensor die to the one or more electrical contact pads at the inner region, the metal bond comprising:
a) platinum; or
b) at least two metals each selected from a group consisting of tin, indium, copper, aluminum, and nickel.
2 . The sensor assembly of claim 1 , wherein the metal bond comprises one or more metal layers comprising aluminum and nickel.
3 . The sensor assembly of claim 1 , wherein the one or more electrical contact pads and the one or more electrodes comprise platinum conductors.
4 . The sensor assembly of claim 1 , wherein the metal bond further comprises one or more metal adhesion layers on at least a portion of the one or more electrical contact pads and on at least a portion of the one or more electrodes.
5 . The sensor assembly of claim 4 , wherein the one or more metal adhesion layers comprise one or more of aluminum, an aluminum alloy, nickel or a nickel alloy.
6 . The sensor assembly of claim 2 , wherein the metal bond comprises:
a welded joint of platinum between the one or more electrodes and the one or more electrical contact pads, wherein the one or more electrodes each comprise a platinum wire, wherein a portion of the platinum wire is overlaid on and bonded to a respective electrical contact pad of the one or more electrical contact pads.
7 . The sensor assembly of claim 1 further comprising a corrosion resistant coating deposited on at least a portion of the sensor assembly.
8 . A method of manufacturing a sensor assembly, the method comprising:
providing a substrate comprising an outer region comprising a first distal end of the substrate, an inner region comprising an opposite second distal end of the substrate, and a middle region positioned between the outer region and the inner region, the substrate further comprising a first electrical contact pad and a second electrical contact pad extending along a surface of the substrate from the outer region to the inner region;
providing a sensor die comprising a first electrode and a second electrode, wherein the first electrode comprises a first metal wire that extends from the sensor die and the second electrode comprises a second metal wire that extends from the sensor die;
positioning the sensor die onto the inner region of the substrate such that a portion of the first metal wire is overlaid on the first electrical contact pad and the second metal wire is overlaid on the second electrical contact pad;
bonding the first metal wire to the first electrical contact pad by a first welding operation;
bonding the second metal wire to the second electrical contact pad by a second welding operation; and
coupling the substrate to a flange at the middle region of the substrate or the outer region of the substrate, wherein the flange is configured to couple with a housing to provide a hermetic seal.
9 . The method of claim 8 , wherein the first welding operation and the second welding operation comprise an electron-beam welding operation or a laser beam welding operation.
10 . The method of claim 8 , wherein the first and second electrical contact pads comprise platinum, and wherein the first and second metal wire comprise platinum.
11 . The method of claim 8 , further comprising annealing at least the first metal wire and the second metal wire.
12 . The method of claim 8 , wherein providing the sensor die comprising the first electrode and the second electrode comprises:
bonding the first metal wire to the first electrode by a third welding operation; and
bonding the second metal wire to the second electrode by a fourth welding operation.
13 . The method of claim 12 , wherein the third welding operation and the fourth welding operation comprise one of an electron-beam welding operation or a laser beam welding operation.
14 . The method of claim 8 , further comprising depositing a corrosion resistant coating on at least a portion of the sensor assembly.
15 . A method of manufacturing a sensor assembly, the method comprising:
providing a substrate comprising an outer region comprising a first distal end of the substrate, an inner region comprising an opposite second distal end of the substrate, and a middle region positioned between the outer region and the inner region, the substrate further comprising one or more electrical contact pads on at least the inner region;
providing a sensor die comprising one or more electrodes;
disposing a sheet of multilayer reactive foil onto at least one of a) the one or more electrical contact pads of the substrate or b) the one or more electrodes of the sensor die;
positioning the sensor die onto the inner region of the substrate such that the sheet of multilayer reactive foil is sandwiched between the one or more electrical contact pads and the one or more electrodes;
igniting the sheet of multilayer reactive foil to form a metal bond between the one or more electrical contact pads of the substrate and the one or more electrodes of the sensor die; and
coupling the substrate to a flange at the middle region of the substrate or the outer region of the substrate, wherein the flange is configured to couple with a housing to provide a hermetic seal.
16 . The method of claim 15 , wherein igniting the sheet of multilayer reactive foil comprises applying a voltage to the sheet of multilayer reactive foil, wherein the sheet of multilayer reactive foil is shaped to conform to at least one of a) a first shape of the one or more electrical contact pads or b) a second shape of the one or more electrodes.
17 . The method of claim 15 , wherein the sheet of multilayer reactive foil comprises a plurality of alternating layers of nickel and aluminum.
18 . The method of claim 15 , wherein the one or more electrical contact pads and the one or more electrodes comprise platinum conductors, the method further comprising:
depositing one or more metal adhesion layers on at least a portion of the one or more electrical contact pads and on at least a portion of the one or more electrodes.
19 . The method of claim 18 , wherein the one or more metal adhesion layers comprise one or more of aluminum, an aluminum alloy, nickel or a nickel alloy.
20 . The method of claim 15 , further comprising:
depositing a corrosion resistant coating over at least an exposed portion of the metal bond.