Method for aligning die to substrate

1. A micro-mirror device package, comprising:

a micro-mirror device die having a plurality of micro-mirror devices formed on a semiconductor substrate and a first guide portion; and

a package substrate having a second guide portion, wherein the micro-mirror device die is fixed on the package substrate by the first and second guide portions;

a third guide portion touching both the first and second guide portions and supporting the micro-mirror device die while maintaining its relative position against the package substrate; and

a material forming the third guide portion has higher thermal conductivity than a material forming the package substrate.

2. The micro-mirror device package according to claim 1 , wherein:

one of the first and second guide portions is a hole,

the other of the first and second guide portions is a protrusion which fits into the hole and

the micro-mirror device die is fixed on the package substrate by the fitting of the protrusion into the hole.

3. The micro-mirror device package according to claim 2 , wherein:

at least one of the hole and the protrusion is formed in a tapered shape.

4. The micro-mirror device package according to claim 2 , wherein:

the protrusion fits into the hole unrotatably.

5. The micro-mirror device package according to claim 1 , wherein:

the first and second guide portions both are holes, and

the third guide portion is a protrusion which fits into both the first and second guide portions.

6. The micro-mirror device package according to claim 1 , wherein:

the second guide portion is a plurality of through holes,

the third guide portion is a plurality of protrusions each of which fits each of the plurality of through holes and passes through the package substrate,

the first guide portion is an outside of the micro-mirror device die as a guide surface for aligning the micro-mirror device die in a position where the micro-mirror device die touches each of the plurality of protrusions that passes through each of the plurality of through holes, and

each of the plurality of protrusions that passes through each of the plurality of through holes supports the micro-mirror device die by touching the micro-mirror device die on the guide surface.

7. The micro-mirror device package according to claim 1 , further comprising:

a rotation stopper for preventing the micro-mirror device die from relatively rotating against the package substrate.

8. The micro-mirror device package according to claim 7 , wherein:

the rotation stopper is a protrusion provided on the package substrate and is provided in a position where the rotation stopper touches the micro-mirror device die when the micro-mirror device die is in a position and a direction in which the micro-mirror device die should be fixed.

9. The micro-mirror device package according to claim 1 , wherein:

the micro-mirror device die comprises a plurality of first guide portions,

the package substrate comprises a plurality of second guide portions and

a position and a direction against the package substrate of the micro-mirror device die is fixed by fixing the first and second guide portions which correspond to each other in a plurality of places.

10. A micro-mirror device package comprising:

a micro-mirror device die having a plurality of micro-mirror devices formed on a semiconductor substrate and a first guide portion; and

a package substrate having a second guide portion, wherein the micro-mirror device die is fixed on the package substrate by the first and second guide portions;

a third guide portion touching both the first and second guide portions and supporting the micro-mirror device die while maintaining its relative position against the package substrate; and

a heat transfer surface coefficient between the micro-mirror device die and the third guide portion is higher than a heat transfer surface coefficient between the micro-mirror device die and the package substrate.

11. A micro-mirror device package comprising:

a micro-mirror device die having a plurality of micro-mirror devices formed on a semiconductor substrate and a first guide portion; and

a package substrate having a second guide portion, wherein the micro-mirror device die is fixed on the package substrate by the first and second guide portions;

a third guide portion touching both the first and second guide portions and supporting the micro-mirror device die while maintaining its relative position against the package substrate; and

a radiation member jointed to the third guide portion or incorporated into the third guide portion.

12. A micro-mirror device package comprising:

a micro-mirror device die having a plurality of micro-mirror devices formed on a semiconductor substrate and a first guide portion; and

a package substrate having a second guide portion, wherein the micro-mirror device die is fixed on the package substrate by the first and second guide portions; and

a heat transfer member passing from a first surface touching the micro-mirror device die to a second surface opposing the first surface of the package substrate.

13. A micro-mirror device package comprising:

a micro-mirror device die having a plurality of micro-mirror devices formed on a semiconductor substrate; and

a radiation member directly jointed to or incorporated into the micro-mirror device die.