Voltage contrast structure for trench connectors
Embodiments described herein may be related to apparatuses, processes, systems, and/or techniques for electrically coupling components of a transistor structure together in order to perform a voltage contrast test to determine opens and shorts within the transistor structure. In embodiments, trench contacts (TCN) within a transistor structure may be electrically coupled together with an electrical connection that is electrically isolated from a power rail. In other embodiments, TCN may be electrically coupled using P-type epitaxial layers on a P-type substrate. Other embodiments may be described and/or claimed.
1 . A voltage contrast structure comprising:
a substrate layer that includes silicon;
a nano-ribbon above a side of the substrate, wherein the nano-ribbon is coupled to a first epitaxial layer and coupled to a second epitaxial layer, wherein the first epitaxial layer and the second epitaxial layer are physically coupled with the substrate layer;
a first trench connector on the first epitaxial layer;
a second trench connector on the second epitaxial layer; and
an electrical connector that is electrically coupled with the first trench connector and the second trench connector, the electrical connector having a top surface at a same level as a top surface of the first trench connector and as a top surface of the second trench connector.
2 . The voltage contrast structure of claim 1 , wherein the nano-ribbon is a plurality of nano-ribbons, and wherein the plurality of nano-ribbons overlap each other in a direction perpendicular to a surface of the substrate layer.
3 . The voltage contrast structure of claim 1 , further comprising a gate around the nano-ribbon, the gate between the first trench connector and the second trench connector.
4 . The voltage contrast structure of claim 1 , wherein the electrical connector is electrically coupled with a ground.
5 . The voltage contrast structure of claim 1 , wherein the electrical connector is electrically coupled with the substrate layer.
6 . The voltage contrast structure of claim 1 , wherein the electrical connector includes electrically conductive metal.
7 . The voltage contrast structure of claim 1 , wherein the second trench connector is a plurality of trench connectors.
8 . The voltage contrast structure of claim 1 , wherein the side of the substrate is a first side, and further including:
a second side of the substrate opposite the first side; and
a metal layer on the second side of the substrate, wherein the electrical connector is electrically coupled with the metal layer.
9 . The voltage contrast structure of claim 8 , wherein the metal layer on the second side of the substrate is electrically isolated from a power source.
10 . The voltage contrast structure of claim 1 , further comprising an electrical insulator, the electrical insulator between the first epitaxial layer and the silicon substrate or between the second epitaxial layer and the silicon substrate.
11 . A voltage contrast structure comprising:
a substrate layer that includes silicon, wherein the substrate layer is a P-type substrate;
a nano-ribbon above a side of the substrate, wherein the nano-ribbon is coupled to a first epitaxial layer and coupled to a second epitaxial layer, wherein the first epitaxial layer and the second epitaxial layer are P-type epitaxial layers, and wherein the first epitaxial layer and the second epitaxial layer are physically and electrically coupled with the substrate layer;
a first trench connector on the first epitaxial layer;
a second trench connector on the second epitaxial layer; and
wherein the first trench connector is electrically coupled with the second trench connector through the first epitaxial layer, the substrate layer, and the second epitaxial layer; and
an electrical connector that is electrically coupled with the first trench connector and the second trench connector, the electrical connector having a top surface at a same level as a top surface of the first trench connector and as a top surface of the second trench connector.
12 . The voltage contrast structure of claim 11 , wherein the nano-ribbon is a plurality of nano-ribbons, and wherein the plurality of nano-ribbons overlap each other in a direction perpendicular to a surface of the substrate layer.
13 . The voltage contrast structure of claim 11 , further comprising a gate surrounding the nano-ribbon, wherein the gate is between the first epitaxial layer and the second epitaxial layer.
14 . The voltage contrast structure of claim 13 , wherein the first trench connector or the second trench connector are not directly electrically coupled with the gate.
15 . The voltage contrast structure of claim 11 , wherein the second epitaxial layer is a plurality of epitaxial layers, wherein the second trench connector is a plurality of trench connectors, and wherein the plurality of trench connectors are electrically coupled, respectively, to the plurality of epitaxial layers.
16 . The voltage contrast structure of claim 15 , further comprising a plurality of gates surrounding the nano-ribbon, where at least some of the plurality of gates are between the plurality of trench connectors.
17 . The voltage contrast structure of claim 11 , wherein the electrical connector is electrically coupled with the substrate layer.
18 . The voltage contrast structure of claim 11 , wherein the electrical connector includes electrically conductive metal.
19 . The voltage contrast structure of claim 11 , wherein the second trench connector is a plurality of trench connectors.
20 . The voltage contrast structure of claim 11 , wherein the side of the substrate is a first side, and further including:
a second side of the substrate opposite the first side; and
a metal layer on the second side of the substrate, wherein the electrical connector is electrically coupled with the metal layer.
21 . The voltage contrast structure of claim 20 , wherein the metal layer on the second side of the substrate is electrically isolated from a power rail.
22 . A method comprising:
providing a substrate;
providing a first epitaxial layer on the substrate;
providing a second epitaxial layer on the substrate, wherein one or more nano-ribbons extend through the first epitaxial layer and the second epitaxial layer parallel to a side of the substrate;
forming a first trench contact on the first epitaxial layer;
forming a second trench contact on the second epitaxial layer; and
electrically coupling the first trench contact and the second trench contact using an electrical connector, the electrical connector having a top surface at a same level as a top surface of the first trench contact and as a top surface of the second trench contact, wherein the electrical connector is coupled with a ground.
23 . The method of claim 22 , wherein the ground is a ground of the substrate.
24 . The method of claim 22 , further comprising:
applying an electronic beam to the first trench contact and the second trench contact; and
identifying whether the first trench contact and the second trench contact are electrically coupled based upon a brightness of a scan image of the first trench contact and the second trench contact.