IP Library › Granted Patent US 12,264,228
Granted Patent B2
US 12,264,228 · App. 17/876,168 · Granted Apr 1, 2025

Graphite composite and electronic component

Inventors: Youji Shirato (Hokkaido, JP); Norihiro Kawamura (Hokkaido, JP); Yoshifumi Iimuro (Hokkaido, JP)
Assignee: Panasonic Intellectual Property Management Co., Ltd.
C08K3/042H01L23/3737
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Quick Facts
Patent No.
US 12,264,228
App. No.
17/876,168
Granted
Apr 1, 2025
Kind
B2
Abstract

A graphite composite includes a graphite sheet having a void inside and a resin member. The void is partially filled by at least a part of the resin member in its entirety. The proportion of the resin member to the sum of the graphite sheet and the resin member is equal to or greater than 5% by mass. The graphite composite has a porosity equal to or greater than 50% by volume and equal to or less than 95% by volume.

Claims (49)

1. A graphite composite comprising:

a graphite sheet having a void inside; and

a resin member, wherein:

the void is only partially filled by the resin member,

proportion of the resin member to a sum of the graphite sheet and the resin member is equal to or greater than 5% by mass and equal to or less than 75% by mass, and

the graphite composite has a porosity equal to or greater than 50% by volume and equal to or less than 95% by volume.

2. The graphite composite of claim 1 , wherein

the graphite sheet has a porosity equal to or greater than 80% by volume.

3. The graphite composite of claim 1 , wherein

the graphite composite has a compression ratio equal to or greater than 70% when a pressure of 600 kPa is applied to the graphite composite in a thickness direction.

4. The graphite composite of claim 1 , wherein

the resin member contains a gelatinous polymer.

5. The graphite composite of claim 1 , wherein

the graphite composite is a thermal interface material.

6. An electronic component comprising:

a heat generator;

a heat dissipator; and

the graphite composite of claim 1 interposed between the heat generator and the heat dissipator.

7. The electronic component of claim 6 , wherein

the graphite composite is directly in contact with each of the heat generator and the heat dissipator.

8. The electronic component of claim 6 , wherein

the graphite composite is subjected to pressure applied from the heat generator and the heat dissipator.

9. The electronic component of claim 6 , wherein

the heat generator is a semiconductor component and the heat dissipator is a heat sink.

10. A graphite composite comprising:

a graphite sheet having a void inside; and

a resin member, wherein:

the void is only partially filled by the resin member,

proportion of the resin member to a sum of the graphite sheet and the resin member is equal to or greater than 5% by mass,

the graphite composite has a porosity equal to or greater than 50% by volume and equal to or less than 95% by volume, and

the graphite composite has a compression ratio equal to or greater than 70% when a pressure of 600 kPa is applied to the graphite composite in a thickness direction.

11. The graphite composite of claim 1 , wherein

the void is filled with 1 vol % to 45 vol % by the resin member.

12. The graphite composite of claim 10 , wherein

the void is filled with 1 vol % to 45 vol % by the resin member.

13. The graphite composite of claim 10 , wherein

the resin member contains a gelatinous polymer.

14. The graphite composite of claim 10 , wherein

the graphite composite is a thermal interface material.

15. An electronic component comprising:

a heat generator;

a heat dissipator; and

the graphite composite of claim 10 interposed between the heat generator and the heat dissipator.

16. The electronic component of claim 15 , wherein

the graphite composite is directly in contact with each of the heat generator and the heat dissipator.

17. The electronic component of claim 15 , wherein

the graphite composite is subjected to pressure applied from the heat generator and the heat dissipator.

18. The electronic component of claim 15 , wherein

the heat generator is a semiconductor component and the heat dissipator is a heat sink.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 1, 2022
From: SHIRATO, YOUJI; KAWAMURA, NORIHIRO; IIMURO, YOSHIFUMI
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 061603/0776 →
Priority Claims (1)
JP 2021-124733 · Jul 29, 2021 · national
Continuity (1)
Related Publication 20230032968A1 · Feb 2, 2023
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