IP Library › Granted Patent US 12,721,159
Granted Patent B2
US 12,721,159 · App. 17/554,498 · Granted Aug 25, 2026

Structural thermal interfacing for lidded semiconductor packages

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Quick Facts
Patent No.
US 12,721,159
App. No.
17/554,498
Granted
Aug 25, 2026
Kind
B2
Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2021
From: SHAH, PRIYAL; SWAMINATHAN, RAJA; WILKERSON, BRETT P.
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 058419/0001 →
Continuity (2)
Provisional Application 63127443 · Dec 18, 2020
Related Publication 20220199429A1 · Jun 23, 2022
References Cited (1)
US 11810833B2 · Hung · 2023 [cited by examiner]