IP Library › Granted Patent US 12,512,340
Granted Patent B2
US 12,512,340 · App. 17/876,534 · Granted Dec 30, 2025

Micro device mass transfer equipment

Inventors: Yun-Li Li (MiaoLi County, TW); Yu-Hung Lai (MiaoLi County, TW)
Assignee: PlayNitride Display Co., Ltd.
H01L21/67144H01L21/67092H01L21/67103H01L21/6835H01L25/0753H01L2221/68381H10H20/018
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Quick Facts
Patent No.
US 12,512,340
App. No.
17/876,534
Granted
Dec 30, 2025
Kind
B2
Abstract

A micro device mass transfer equipment including a base stage, a moving stage, a substrate stage, a laser device, a rolling and pressing mechanism, and a heating mechanism is provided. The moving stage is movably disposed on the base stage, and moves with a moving path. The substrate stage is movably disposed on the base stage, and is adapted to move between different positions overlapping the moving stage. The laser device is movably disposed on the base stage. The laser device is adapted to move relative to the substrate stage, and emits a laser beam toward the substrate stage. The rolling and pressing mechanism is disposed on the moving path of the moving stage, and forms a contact region with the moving stage. The heating mechanism is disposed corresponding to the contact region, and is adapted to heat the contact region between the moving stage and the rolling and pressing mechanism.

Claims (19)

1 . A micro device mass transfer equipment, comprising:

a base stage;

a moving stage, movably disposed on the base stage and moving with a moving path;

a substrate stage, movably disposed on the base stage and adapted to move between different positions overlapping the moving stage;

a laser device, movably disposed on the base stage, wherein the laser device is adapted to move relative to the substrate stage and emits a laser beam toward the substrate stage;

a rolling and pressing mechanism, disposed on the moving path of the moving stage and forming a contact region with the moving stage; and

a heating mechanism, disposed corresponding to the contact region and adapted to heat the contact region between the moving stage and the rolling and pressing mechanism.

2 . The micro device mass transfer equipment according to claim 1 , wherein the moving stage is adapted to move along a first direction or a second direction, parallel to the base stage, the substrate stage is adapted to move along the second direction or a third direction, and the first direction, the second direction, and the third direction are perpendicular to one another.

3 . The micro device mass transfer equipment according to claim 2 , wherein while the moving stage moves along the first direction, the laser beam moves along the second direction.

4 . The micro device mass transfer equipment according to claim 3 , wherein while the laser beam moves along the second direction, the substrate stage moves along the second direction.

5 . The micro device mass transfer equipment according to claim 1 , wherein the moving stage is adapted to pass through the substrate stage at a first speed, and is adapted to pass through the rolling and pressing mechanism at a second speed, wherein the first speed is greater than or equal to the second speed.

6 . The micro device mass transfer equipment according to claim 1 , wherein the rolling and pressing mechanism comprises a roller.

7 . The micro device mass transfer equipment according to claim 6 , wherein the rolling and pressing mechanism further comprises a buffer layer disposed on the roller.

8 . The micro device mass transfer equipment according to claim 7 , wherein the buffer layer is a plurality of buffer bumps separated from one another.

9 . The micro device mass transfer equipment according to claim 8 , wherein the roller has a roundness, each of the buffer bumps has a thickness, and the roundness is less than the thickness.

10 . The micro device mass transfer equipment according to claim 1 , wherein the heating mechanism comprises:

a laser light source, disposed in the base stage and located on a side of the moving stage facing away from the rolling and pressing mechanism, and adapted to irradiate the contact region with another laser beam to heat the contact region, wherein a light transmittance of the moving stage to the another laser beam is greater than 90%.

11 . The micro device mass transfer equipment according to claim 1 , further comprising a plurality of the base stages, a plurality of the substrate stages, and a plurality of the rolling and pressing mechanisms, each of the base stages is provided with one of the substrate stages or one of the rolling and pressing mechanisms, wherein the moving path of the moving stage extends between the base stages.

12 . The micro device mass transfer equipment according to claim 1 , wherein the heating mechanism comprises a plurality of heating units, and the heating units are dispersedly disposed on a circumferential surface of the rolling and pressing mechanism.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 4, 2022
From: LI, YUN-LI; LAI, YU-HUNG
To: PLAYNITRIDE DISPLAY CO., LTD.
Reel/Frame 060714/0330 →
Priority Claims (2)
TW 110128286 · Aug 2, 2021 · national
TW 111120381 · Jun 1, 2022 · national
Continuity (1)
Related Publication 20230036894A1 · Feb 2, 2023
References Cited (35)
US 8721803B2 · Nagasaka · 2014 [cited by examiner]
US 12057330B2 · Li · 2024 [cited by examiner]
US 20040228964A1 · Ito et al. · 2004 [cited by applicant]
US 20140306192A1 · Han · 2014 [cited by applicant]
US 20200006661A1 · Shinokawa et al. · 2020 [cited by applicant]
US 20200357779A1 · Kwag et al. · 2020 [cited by applicant]
US 20220001494A1 · Sakamoto et al. · 2022 [cited by applicant]
CN 104024835 · 2014 [cited by applicant]
CN 109256350 · 2019 [cited by applicant]
CN 109524512 · 2019 [cited by applicant]
CN 209087901 · 2019 [cited by applicant]
CN 110416148 · 2019 [cited by applicant]
CN 112599462 · 2021 [cited by applicant]
CN 113594308 · 2021 [cited by applicant]
JP 2001035816 · 2001 [cited by applicant]
JP 2012192427 · 2012 [cited by applicant]
JP 2019522891 · 2019 [cited by applicant]
JP 2020042116 · 2020 [cited by applicant]
JP 2020069530 · 2020 [cited by applicant]
KR 20210040210 · 2021 [cited by applicant]
TW 200400630 · 2004 [cited by applicant]
TW 200415128 · 2004 [cited by applicant]
TW 201822589 · 2018 [cited by applicant]
TW M563718 · 2018 [cited by applicant]
TW 201909379 · 2019 [cited by applicant]
TW 202008558 · 2020 [cited by applicant]
TW 202036927 · 2020 [cited by applicant]
WO 2020188780 · 2020 [cited by applicant]
“Notice of allowance of China Counterpart Application”, issued on Jul. 11, 2024, p. 1-p. 4. [cited by applicant]
“Office Action of Korea Related Application No. 10-2022-0093863”, issued on May 17, 2024, with English translation thereof, pp. 1-9. [cited by applicant]
“Office Action of China Counterpart Application”, issued on Sep. 13, 2024, p. 1-p. 10. [cited by applicant]
“Office Action of Taiwan Counterpart Application”, issued on May 30, 2023, p. 1-p. 8. [cited by applicant]
“Notice of allowance of Taiwan Counterpart Application”, issued on Dec. 25, 2023, p. 1-p. 3. [cited by applicant]
“Office Action of China Related Application, Application No. 202110883029.9”, issued on Jan. 10, 2024, p. 1-p. 9. [cited by applicant]
“Office Action of China Counterpart Application”, issued on Aug. 1, 2025, p. 1-p. 5. [cited by applicant]