Laser processing device and laser processing method

1. A laser processing apparatus that emits a laser light with at least a part of a focusing region being on a target to form a modified region in the target, the laser processing apparatus comprising:

a support portion configured to support the target;

an irradiation portion configured to irradiate the target supported by the support portion with the laser light; and

a controller configured to control the support portion and the irradiation portion, wherein

the irradiation portion includes a shaping portion configured to shape the laser light, to make a shape of a part of the focusing region within a plane orthogonal to an optical axis of the laser light have a longitudinal direction, and

the controller includes:

a determination portion configured to determine, based on target information on the target and line information on a line extending annularly on an inner side of an outer edge of the target for relatively moving the part of the focusing region along the line, a first orientation that is an orientation of the longitudinal direction for relatively moving the part of the focusing region along a first region of the line, and a second orientation that is an orientation of the longitudinal direction for relatively moving the part of the focusing region along a second region of the line, to make the longitudinal direction intersect with a movement direction of the part of the focusing region;

a processing controller configured to perform a first process of forming the modified region of relatively moving the part of the focusing region along the first region and stopping formation of the modified region in a region of the line other than the first region, and a second process of forming the modified region of relatively moving the part of the focusing region along the second region and stopping formation of the modified region in a region of the line other than the second region; and

an adjustment portion configured to adjust the orientation of the longitudinal direction to be the first orientation when the processing controller performs the first process, and to adjust the orientation of the longitudinal direction to be the second orientation when the processing controller performs the second process.

2. The laser processing apparatus according to claim 1 , wherein

the target information includes information on a crystal orientation of the target, and

the line information includes information on the movement direction of the part of the focusing region.

3. The laser processing apparatus according to claim 1 , wherein

the shaping portion includes a spatial light modulator, and

the adjustment portion controls the spatial light modulator to adjust the orientation of the longitudinal direction.

4. The laser processing apparatus according to claim 1 , wherein

the target is a wafer that has a (100) plane as a principal plane, and includes a first crystal orientation orthogonal to one (110) plane and a second crystal orientation orthogonal to another (110) plane,

the line annularly extends in a view orthogonal to the principal plane,

the first region includes a region in which a processing angle is 0° or greater and less than 45°, the processing angle being an angle of the movement direction of the part of the focusing region with respect to the first crystal orientation, when the part of the focusing region is relatively moved along the line, and

the second region includes a region in which the processing angle is 45° or greater and less than 90°, when the part of the focusing region is relatively moved along the line.

5. The laser processing apparatus according to claim 4 , wherein the first orientation and the second orientation are orientations of a direction inclined with respect to the movement direction toward one of the first crystal orientation and the second crystal orientation forming a larger angle with the movement direction.

6. The laser processing apparatus according to claim 5 , wherein the first orientation and the second orientation are orientations of a direction inclined by 10° to 35° with respect to the movement direction toward one of the first crystal orientation and the second crystal orientation forming a larger angle with the movement direction.

7. The laser processing apparatus according to claim 1 , wherein

the irradiation portion includes:

a first laser processing head configured to emit a first laser light as the laser light; and

a second laser processing head configured to emit a second laser light as the laser light,

in the first process, relatively moves the part of the focusing region of the first laser light along the first region to form the modified region and stops formation of the modified region in a region of the line other than the first region, and

in the second process, relatively moves the part of the focusing region of the second laser light along the second region to form the modified region and stops formation of the modified region in a region of the line other than the second region, and

the adjustment portion

adjusts, when the first process is performed, an orientation of a longitudinal direction of a shape of the part of the focusing region in a plane orthogonal to an optical axis of the first laser light to be the first orientation, and

adjusts, when the second process is performed, an orientation of a longitudinal direction of a shape of the part of the focusing region in a plane orthogonal to an optical axis of the second laser light to be the second orientation.

8. A laser processing method that emits a laser light with at least a part of a focusing region being on a target to form a modified region in the target, the laser processing method comprising:

a determination step of determining, based on target information on the target and line information on a line extending annularly on an inner side of an outer edge of the target for relatively moving the part of the focusing region along the line, a first orientation that is an orientation of a longitudinal direction that a shape of a part of the focusing region within a plane orthogonal to an optical axis of the laser light has, for relatively moving the part of the focusing region along a first region of the line, and a second orientation that is an orientation of the longitudinal direction for relatively moving the part of the focusing region along a second region of the line, to make the longitudinal direction intersect with a movement direction of the part of the focusing region;

a first processing step of forming the modified region of relatively moving the part of the focusing region along the first region and stopping formation of the modified region in a region of the line other than the first region;

a second processing step of forming the modified region of relatively moving the part of the focusing region along the second region and stopping formation of the modified region in a region of the line other than the second region;

a first adjustment step of adjusting the orientation of the longitudinal direction to be the first orientation when the first processing step is performed, and

a second adjustment step of adjusting the orientation of the longitudinal direction to be the second orientation when the second processing step is performed.