Pin fin placement assembly for forming temperature control element utilized in device die packages
A pin fin placement assembly utilized to form pin fins in a thermal dissipating feature is provided. The pin fin placement assembly may place the pin fins on an IC die disposed in the IC package. The pin fin placement assembly may assist massively placing the pin fins with desired profiles and numbers on desired locations of the IC die. The plurality of pin fins is formed in a first plurality of apertures in the pin fin placement assembly. A thermal process is then performed to solder the plurality of pin fins on the IC die.
1 . A method for manufacturing a temperature control element in an IC package, comprising:
coupling a pin fin placement assembly to a printed circuit board (“PCB”), the pin fin placement assembly comprising a top plate, a bottom plate, and a middle plate disposed between the top and bottom plates;
providing a plurality of pin fins in a first plurality of apertures in the top plate of the pin fin placement assembly;
moving the middle plate in a lateral direction relative to the top and bottom plates, such that the plurality of pin fins within the first plurality of apertures moves into a second plurality of apertures in the bottom plate of the pin fin placement assembly; and
performing a thermal process to solder the plurality of pin fins to an IC die positioned at the PCB.
2 . The method of claim 1 , further comprising:
removing the pin fin placement assembly from the PCB.
3 . The method of claim 1 , further comprising:
driving the plurality of pin fins into the first plurality of apertures in the top plate by vibration or brushing.
4 . The method of claim 3 , wherein the first plurality of apertures formed in the top plate is vertically aligned with the second plurality of apertures formed in the bottom plate.
5 . The method of claim 1 , further comprising:
maintaining the plurality of pin fins in the second plurality of apertures formed in the bottom plate in the pin fin placement assembly while performing the thermal process.
6 . The method of claim 1 , wherein coupling the pin fin placement assembly further comprises:
placing the pin fin placement assembly into an alignment hole formed in the PCB.
7 . The method of claim 1 , wherein the pin fins are manufactured from a material selected from copper, aluminum, tungsten, gold, silver, combinations thereof or alloys thereof.
8 . The method of claim 1 , wherein the plurality of pin fins have one of a circular configuration, a rectangular configuration, a longitudinal structure, or a combination thereof.
9 . The method of claim 1 , wherein the plurality of pin fins are arranged in one or more arrays or matrices.
10 . The method of claim 1 , wherein when the middle plate moves in the lateral direction, the top and bottom plates are in a stationary position.
11 . The method of claim 1 , wherein when the middle plate is in a first position, the middle plate supports the pin fins within the first plurality of apertures and prevents movement of the plurality of pin fins into the second plurality of apertures, and when the middle plate moves in the lateral direction into a second position, the plurality of pin fins move into the second plurality of apertures.
12 . The method of claim 11 , wherein the middle plate further comprises a third plurality of apertures for receiving the plurality of pin fins, and wherein when the middle plate is moved in the lateral direction, the first, second, and third plurality of apertures are aligned with each other, such that the plurality of pin fins move from the first plurality of apertures, through the third plurality of apertures, and into the second plurality of apertures.
13 . The method of claim 11 , further comprising:
simultaneously aligning each of the plurality of pin fins in the second plurality of apertures with a corresponding one of a plurality of solder materials deposited at a rear surface of the IC die.
14 . A pin fin placement assembly, comprising:
a top plate, a middle plate, and a bottom plate vertically assembled to form a plate body, wherein the middle plate is laterally movable relative to the top plate or the bottom plate;
a supporting post disposed below the plate body;
a first plurality of apertures formed in the top plate; and
a second plurality of apertures formed in the bottom plate,
wherein the first and the second plurality of apertures are vertically aligned, and
wherein the first and the second plurality of apertures are configured to receive pin fins to be disposed on an IC die.
15 . The pin fin placement assembly of claim 14 , wherein the top plate is removable from the plate body.
16 . The pin fin placement assembly of claim 14 , wherein the first plurality of apertures are configured to receive a corresponding pin fin to be disposed therein.
17 . The pin fin placement assembly of claim 14 , wherein the supporting post is configured to be placed into an alignment hole formed in a printed circuit board (“PCB”).
18 . The pin fin placement assembly of claim 14 , wherein when the middle plate moves in the lateral direction, the top and bottom plates are in a stationary position.
19 . The pin fin placement assembly of claim 14 , wherein the pin fin placement assembly is configured to permit pin fins in the first plurality of apertures to move into the second plurality of apertures when the middle plate is moved in a lateral direction.
20 . The pin fin placement assembly of claim 19 , wherein when the middle plate is in a first position, the middle plate supports the pin fins within the first plurality of apertures and prevents movement of the pin fins into the second plurality of apertures, and when the middle plate moves laterally into a second position, the pin fins drop into the second plurality of apertures.