Seal ring for hybrid-bond

1. A structure comprising:

a base die, the base die comprising:

a first plurality of bond pads disposed at an upper surface of the base die at a die attach area,

a second plurality of bond pads disposed at the upper surface of the base die outside the die attach area, and

a keep out area interposed between the first plurality of bond pads and the second plurality of bond pads, the keep out area free of bond pads; and

an upper die bonded to the base die, the upper die comprising:

a third plurality of bond pads disposed at a lower surface of the upper die, the third plurality of bond pads bonded to the first plurality of bond pads, and

a second seal ring embedded in the upper die, the second seal ring aligned to the keep out area of the base die.

2. The structure of claim 1 , wherein the base die further comprises a first bonding layer at the upper surface of the base die disposed between bond pads of the first plurality of bond pads, wherein the first bonding layer is directly fused to a second bonding layer of the upper die.

3. The structure of claim 1 , wherein the base die further comprises a first ringed bonding structure surrounding the die attach area.

4. The structure of claim 3 , wherein the upper die further comprises a second ringed bonding structure aligned to the first ringed bonding structure.

5. The structure of claim 1 , wherein material from each bond pad of the first plurality of bond pads is diffused into each corresponding bond pad of the third plurality of bond pads, and wherein material from each bond pad of the third plurality of bond pads is diffused into each corresponding bond pad of the first plurality of bond pads.

6. The structure of claim 1 , wherein the base die further comprises a first seal ring, wherein the first seal ring and the second seal ring are misaligned along a first edge of the upper die.

7. The structure of claim 6 , wherein the first seal ring and the second seal ring are aligned to each other along a second edge of the upper die.

8. The structure of claim 1 , wherein the keep out area is a first keep out area, and wherein the upper die further comprises a second keep out area, the second keep out area aligned to the first keep out area.

9. The structure of claim 8 , wherein the first plurality of bond pads and the second plurality of bond pads are distributed across the upper surface in a first regular pattern except in the first keep out area, and wherein the third plurality of bond pads are distributed across the lower surface of the upper die in the first regular pattern except in the second keep out area.

10. A structure comprising:

a first die comprising:

a first plurality of bond pads disposed at an upper surface of the first die at a die attach area, the upper surface including a first bonding dielectric layer, and

a first keep out area adjacent the first plurality of bond pads, the first keep out area free of bond pads, wherein the first keep out area corresponds to an interior region of the first die, wherein a bond pad outside the die attach area is disposed between the first keep out area and an edge of the first die; and

a second die bonded to the first die, the second die comprising:

a second plurality of bond pads disposed at a lower surface of the second die, the second plurality of bond pads bonded to the first plurality of bond pads, the lower surface including a second bonding dielectric layer, the first bonding dielectric layer fused to the second bonding dielectric layer, and

a second seal ring embedded in the second die, the second seal ring aligned to the first keep out area of the first die.

11. The structure of claim 10 , wherein the second die further comprises a second keep out area corresponding to a location of the second seal ring, the second keep out area aligned to the first keep out area.

12. The structure of claim 10 , wherein the first bonding dielectric layer is fused to the second bonding dielectric layer by Si—O—Si bonds.

13. The structure of claim 10 , further comprising:

a first bonding ring disposed within the first bonding dielectric layer of the first die; and

a second bonding ring disposed within the second bonding dielectric layer of the second die, the first bonding ring coupled to the second bonding ring.

14. The structure of claim 13 , wherein the first bonding ring is electrically coupled to the second seal ring.

15. The structure of claim 10 , wherein an edge of the second die is offset an edge of the first die.

16. A device comprising:

a first device area of a first package;

a first interconnect structure disposed over the first device area;

a first dielectric layer disposed over the first interconnect structure;

a first seal ring structure embedded in the first dielectric layer;

first bond pads disposed at an upper surface of the first dielectric layer, the first bond pads distributed across the upper surface of the first dielectric layer in a regular pattern except in a keep out zone of the first dielectric layer, the keep out zone free of the first bond pads, the keep out zone interposed between a first subset of the first bond pads and a second set of the first bond pads;

second bond pads of a second package coupled to the first set of the first bond pads; and

a second dielectric layer of the second package fused to the first dielectric layer.

17. The device of claim 16 , further comprising:

a first metal bonding structure disposed at a surface of the keep out zone; and

a second metal bonding structure disposed at a surface of the second dielectric layer, wherein the second metal bonding structure is directly bonded to the first metal bonding structure by an interdiffusion of respective materials of each of the first metal bonding structure and second metal bonding structure.

18. The device of claim 17 , wherein the first metal bonding structure is electrically coupled to a seal ring structure of the second package.

19. The device of claim 16 , wherein the second bond pads of the second package are correspondingly coupled to the first bond pads of the first package by an interdiffusion of respective materials of each of the first bond pads and the second bond pads.

20. The device of claim 16 , further comprising:

a first surface ring of the first package bonded to a second surface ring of the second package, the second surface ring electrically coupled to the a second seal ring structure embedded int the second dielectric layer.