Granted Patent B2

US 12,407,326 · App. 17/902,616 · Granted Sep 2, 2025

Inventor: James R. Costa (Grass Valley, CA)

Assignee: Murata Manufacturing Co., Ltd.

H03H9/564H03H3/02H03H9/133H03H9/173H03H9/568H03H2003/021

Abstract

Claims (69)

1. A stacked die XBAR filter device comprising:

a first die containing one or more shunt XBARs on a first surface, the one or more shunt XBARs having a first piezoelectric layer with a first thickness T 1 and a first interdigital transducer having interleaved fingers on the first piezoelectric layer;

a second die containing one or more series XBARs on a second surface, the one or more series XBARs having a second piezoelectric layer with a second thickness T 2 that is less than the first thickness T 1 and a second interdigital transducer having interleaved fingers on the second piezoelectric layer; and

one or more conductive vias through either the first die or the second die,

wherein the first die is connected to the second die with the first surface facing the second surface, and

wherein the interleaved fingers of the first interdigital transducer have a different thickness than the interleaved fingers of the second interdigital transducer.

2. The filter device of claim 1 , wherein the one or more conductive vias include wafer bumps or contact plating extending between and electrically connecting the one or more shunt XBARs on the first surface to the one or more series XBARs on the second surface.

3. The filter device of claim 2 , wherein the one or more conductive vias include:

first through wafer vias (TWVs) for electrically connecting at least some of the one or more series XBARs to input and output signal external circuitry, and

second TWVs for electrically connecting the one or more shunt XBARs to ground.

4. The filter device of claim 1 , wherein:

a first conductive via of the one or more conductive vias electrically connects the one or more shunt XBARs to the one or more series XBARS,

a second conductive via of the one or more conductive vias electrically connects the one or more shunt XBARs to ground, and

a third conductive via of the one or more conductive vias electrically connects at least some of the one or more series XBARs to external circuitry.

5. The filter device of claim 1 , wherein:

the first die further comprises a first substrate having the first surface and first cavities in an intermediate layer of the first substrate that are disposed under the one or more shunt XBARS,

the second die further comprises a second substrate having the second surface and second cavities in an intermediate layer of the second substrate that are disposed under the one or more series XBARs, and

the one or more conductive vias are through either the first substrate or the second substrate.

6. The filter device of claim 5 ,

wherein the one or more shunt XBARs and the one or more series XBARs each include the respective piezoelectric layer having a portion that forms a diaphragm that is over the first cavities or the second cavities,

wherein the respective interdigital transducer is on a surface of the respective piezoelectric layer and the interleaved fingers are on the respective diaphragm, and

wherein the piezoelectric layer and the interdigital transducer are configured such that a radio frequency signal applied to the interdigital transducer excites a primarily shear acoustic mode within the respective diaphragm.

7. The filter device of claim 5 , wherein:

the conductive vias are through the second die,

the second substrate is thinned,

the second die forms a lid of the filter device,

the first substrate forms a back of the filter device.

8. The filter device of claim 1 , further comprising:

a third die containing one or more XBARs on a third surface; and

one or more conductive vias through the second die or the third die for electrically connecting the second die to the third die,

wherein the second die is connected to the third die with the second surface facing away from the third surface.

9. A stacked die XBAR filter device, comprising:

a first piezoelectric layer having a first thickness T 1 between first front and back surfaces, the first back surface attached to a surface of a first substrate, portions of the first piezoelectric layer forming one or more first diaphragms that are over respective cavities in an intermediate layer of the first substrate;

a first conductor pattern on the first front surface, the first conductor pattern including a first plurality of interdigital transducers (IDTs) of a respective first plurality of acoustic resonators, first interleaved fingers of each of the plurality of first IDTs disposed on one of the one or more first diaphragms;

a second piezoelectric layer having a second thickness T 2 between second front and back surfaces, the second back surface attached to a surface of a second substrate, portions of the second piezoelectric layer forming one or more second diaphragms that are over respective cavities in an intermediate layer of the second substrate;

a second conductor pattern on the second front surface, the second conductor pattern including a second plurality of interdigital transducers (IDTs) of a respective second plurality of acoustic resonators, second interleaved fingers of each of the plurality of second IDTs disposed on one of the one or more second diaphragms; and

one or more conductive vias through the first substrate,

wherein the first conductor pattern is connected to the second conductor pattern with the first front surface facing the second front surface,

wherein the second thickness T 2 of the second piezoelectric layer is different than the first thickness T 1 of the first piezoelectric layer, and

wherein the first interleaved fingers of each of the plurality of first IDTs has a different thickness than the second interleaved fingers of each of the plurality of second IDTs.

10. The filter device of claim 9 , wherein the first and second piezoelectric layer and all of the first and second IDTs are configured such that a respective radio frequency signal applied to each first and second IDT excites a respective primarily shear acoustic mode within the respective diaphragm.

11. The filter device of claim 9 , wherein:

the first acoustic resonators are shunt acoustic resonators of a ladder circuit,

the second acoustic resonators are series acoustic resonators of the ladder circuit, and

wherein the second thickness T 2 of the second piezoelectric layer is less than the first thickness T 1 of the first piezoelectric layer.

12. A method of fabricating an acoustic resonator device having a plurality of dies, the method comprising:

forming one or more conductive vias through a first die, the first die having a plurality of shunt XBARs on a first surface, the plurality of shunt XBARs having a first piezoelectric layer with a first thickness T 1 and a first interdigital transducer having interleaved fingers on the first piezoelectric layer; and

attaching a front surface of first die to a front surface of a second die, the second die having a plurality of series XBARs on a second surface, the plurality of series XBARs having a second piezoelectric layer with a second thickness T 2 that is less than the first thickness T 1 and a second interdigital transducer having interleaved fingers on the second piezoelectric layer,

wherein the one or more conductive vias electrically connect the first XBARs to the second XBARs, and

wherein the interleaved fingers of the first interdigital transducer have a different thickness than the interleaved fingers of the second interdigital transducer.

13. The method of claim 12 , wherein the attaching of the front surface of first die

includes:

attaching bumps or contact pads of the die to bumps or contact pads of the second die; and

ultrasonic bonding of the first die to the second die.

14. The method of claim 12 , further comprising:

forming the shunt XBARs on the first surface by forming the first interdigital transducer with the first interleaved fingers on first diaphragms formed over a first cavities of a first substrate; and

forming the series XBARs on the second surface by forming the second interdigital transducer with the second interleaved fingers on second diaphragms formed over a second cavities of a second substrate.

15. The method of claim 12 , wherein forming the one or more conductive vias includes:

forming wafer bumps or contact plating extending between and electrically connecting the plurality of shunt XBARs to the plurality of series XBARS,

forming first through wafer vias (TWVs) for electrically connecting at least some of the plurality of series XBARs to external circuitry, and

forming second TWVs for electrically connecting the plurality of shunt XBARS to ground.

16. The method of claim 15 , wherein forming the wafer bumps or contact plating extending between and electrically connecting the plurality of shunt XBARs to the plurality of series XBARs includes:

forming conductive vias that electrically connect the plurality of shunt XBARs to the plurality of series XBARs.

17. The method of claim 12 , further comprising:

forming one or more second conductive vias through the second die; and

attaching a front surface of a third die to a back surface of the second die, the third die having a plurality of XBARs and a third surface,

wherein the one or more second conductive vias electrically connect the plurality of shunt XBARs, the plurality of series XBARs and the plurality of XBARs of the third die.

18. The filter device of claim 1 , wherein the second piezoelectric layer is formed of a different material than the first piezoelectric layer.

19. The filter device of claim 9 , wherein the second piezoelectric layer is formed of a different material than the first piezoelectric layer.

Assignments (2)

Continuity (2)

References Cited (279)